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Manufacturing method of insulation heat-conducting metal substrate

A technology of metal substrate and manufacturing method, which is applied in the direction of metal material coating process, superimposed layer plating, gaseous chemical plating, etc., to achieve the effect of quantitative control

Inactive Publication Date: 2008-11-05
MITAC PRECISION TECH(KUNSHAN) CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] At present, there is no method on the market to prepare insulating and heat-conducting metal substrates by using a novel thin film coating technology combining plasma chemical vapor deposition (PCVD) and reactive colloid coating.

Method used

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Embodiment Construction

[0012] The manufacturing method of the insulating and heat-conducting metal base material of the present invention comprises the following steps:

[0013] 1. Provide a metal substrate, which can be copper alloy, stainless steel, Ni-Ti alloy, magnesium alloy or aluminum alloy, and the surface of the metal substrate is strip-shaped, flat, curved or three-dimensional, and the The base material is pretreated, including degreasing, pickling, cleaning and other steps to make its surface clean, and the metal base material is placed in a plasma reaction chamber. Voltage.

[0014] The above-mentioned plasma reactor chamber can be a batch type or a continuous (in-line) chemical vapor deposition chamber.

[0015] 2. Plasma pretreatment

[0016] A gas mixture mixed with a highly corrosive gas is passed into the plasma reaction chamber, and the surface of the metal substrate is irregularly eroded to form a nano-scale surface roughness, wherein the gas mixture also includes a reactive gas...

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PUM

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Abstract

The invention discloses a production method of an insulating and heat-conducting metallic parent material, which comprises the following steps: (1) a metallic parent material is provided and placed into a plasma reaction chamber; (2) a gas mixture with mixed high-erosiveness gas is let into the plasma reaction chamber, and the surface of the metallic parent material is eroded irregularly, thus forming the material with nano-level surface roughness; and (3) the chemical vapor deposition of plasmas is implemented in the plasma reaction chamber, free radical plasmas are generated, and multiple highly heat-conducting coating layers are formed on the surface of the metallic parent material; (4) coating is carried out with a layer of highly heat-conducting and insulating gum. The production method of the insulating and heat-conducting metallic parent material can implement even plating on any metallic substrates with any surface state and realize the quantitative control of heat conductivity.

Description

【Technical field】 [0001] The invention relates to a method for manufacturing an insulating and heat-conducting metal substrate, in particular to a method for manufacturing an insulating and heat-conducting metal substrate that can uniformly coat metal substrates in any surface state. 【Background technique】 [0002] A good insulating and thermally conductive substrate must have high thermal conductivity, insulation, and low expansion coefficient. [0003] One of the traditional preparation methods of insulating and thermally conductive substrates is to print copper foil circuits on plastic substrates such as FR4 printed circuit substrates (PCBs), whose thermal conductivity (K) is about 0.36W / m K, and its disadvantage is that the thermal performance poor. [0004] The second preparation method of the insulating and heat-conducting base material is to attach a metal plate such as an aluminum base material to the PCB base material, which is the so-called Metal Core PCB base mat...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C28/00C23C16/513C23C16/02C23F4/00C23C16/448
Inventor 吴政道胡振宇郭雪梅
Owner MITAC PRECISION TECH(KUNSHAN) CORP
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