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Process for preparing high-purity metallic nickel target of superfine crystal particle

An ultra-fine grain, high-purity technology, applied in the field of metal material pressure processing and heat treatment, can solve the problems of high impurity content, large grain size, coarse grain size, etc., and achieve uniform structure composition and fine grain size , the effect of high purity

Inactive Publication Date: 2008-11-19
CENT SOUTH UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The processing of nickel target is difficult to meet the conditions of target use. The main disadvantage is the low purity of nickel, especially the coarse grain size.
At present, the purity of the raw material of the anode nickel plate after electrolysis in China is generally about 99.8%, and the impurity content, especially the content of Fe and C, is high, resulting in pollution of the sputtering layer and black spots.
In addition, a large number of metal nickel targets currently used in China do not control the grain size, and the grain size is too large, which seriously exceeds the 100μm index required by the target material by several times or even exceeds an order of magnitude. Such nickel targets cannot meet high-quality sputtering coatings. requirements for use

Method used

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  • Process for preparing high-purity metallic nickel target of superfine crystal particle
  • Process for preparing high-purity metallic nickel target of superfine crystal particle

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0017] For the raw material electrolytic nickel plate with a purity of more than 99.9%, the surface is polished to remove the oxide scale to present a metallic luster, and it is directly cut for rolling.

[0018] The surface-milled slab is cold-rolled at room temperature, and the rolling deformation exceeds 50%, ensuring sufficient deformation to achieve sufficient crushing and uniformity of the internal structure of the nickel ingot.

[0019] The cold-rolled nickel plate was annealed at 600° C. for 30 minutes, and then taken out from the furnace for water cooling to obtain the required nickel target blank. The billet is machined to obtain the required size, and then the required high-purity ultra-fine grain nickel target is obtained.

[0020] The obtained nickel target has a purity of 99.96% and an average grain size of 24 μm.

Embodiment 2

[0022] For the raw material electrolytic nickel plate with a purity of more than 99.9%, the surface is polished to remove the oxide scale to present a metallic luster, and it is directly cut for rolling.

[0023] The surface-milled slab is cold-rolled at room temperature, and the rolling deformation exceeds 50%, ensuring sufficient deformation to achieve sufficient crushing and uniformity of the internal structure of the nickel ingot.

[0024] The cold-rolled nickel plate was annealed at 700° C. for 60 minutes, then taken out from the furnace, and cooled to room temperature in air to obtain the required nickel target blank. The billet is machined to obtain the required size, and then the required high-purity ultra-fine grain nickel target is obtained.

[0025] The obtained nickel target has a purity of 99.95% and an average grain size of 27 μm.

Embodiment 3

[0027] For the raw material electrolytic nickel plate with a purity of more than 99.9%, the surface is polished to remove the oxide scale to present a metallic luster, and it is directly cut for rolling.

[0028] The surface-milled slab is cold-rolled at room temperature, and the rolling deformation exceeds 50%, ensuring sufficient deformation to achieve sufficient crushing and uniformity of the internal structure of the nickel ingot.

[0029] The cold-rolled nickel plate was annealed at 800° C. for 120 minutes, and then taken out from the furnace for water cooling to obtain the required nickel target blank. The billet is machined to obtain the required size, and then the required high-purity ultra-fine grain nickel target is obtained.

[0030] The obtained nickel target has a purity of 99.97% and an average grain size of 29 μm.

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Abstract

The invention relates to a method for preparing metallic nickel target materials with superfine crystal grains and high purity. The method comprises the following steps of vacuum melting, rolling processing and heat treatment, wherein, the step of vacuum melting and purification mainly guarantees the high purity of nickel targets, and the step of rolling processing and the step of heat treatment mainly aim to guarantee the fineness of the crystal grains of the nickel targets. The grain diameter of the metallic nickel target materials prepared by adoption of the method is fine and is between 20 and 30 micrometers, which is far lower than 100 micrometers required; the purity of the metallic nickel target materials is high and reaches over 99.9 percent; and the metallic nickel targets have uniform structural constituents and can be mechanically processed into high-quality high-purity metallic nickel targets subsequently.

Description

technical field [0001] The invention relates to an ultrafine-grain high-purity metal nickel target material for vacuum sputtering, which belongs to the fields of metal materials, vacuum surface coating materials, pressure processing and heat treatment of metal materials. Background technique [0002] In recent years, with the enhancement of people's awareness of environmental protection and energy crisis, the surface coating technology of materials has gradually transitioned from traditional electroplating and electroless plating technology to vacuum sputtering technology. Vacuum magnetron sputtering technology has been widely used in hardware decoration and protective coatings, electronic product coatings, electromagnetic shielding coatings, plastic coatings, and automotive and architectural glass coatings. Therefore, the demand for sputtering targets to be used as the coating film layer of this technology is even more urgent. [0003] Nickel, as one of the most typical me...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C14/34C23C14/14C22C1/02C22F1/10
Inventor 余琨汤义荣
Owner CENT SOUTH UNIV
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