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Halogen-free flame-proof glass fiber reinforcement epoxy molding compound

An epoxy molding compound and glass fiber technology, which is applied in the field of thermosetting molding compounds, can solve the problems such as the expansion limitation of glass fiber reinforced epoxy molding compounds, the generation of toxic and harmful gases, and the unfavorable human environment, so as to ensure the safety and protection of the human body. effects of the environment

Active Publication Date: 2009-01-14
常熟东南塑料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, halogen-containing flame retardants will produce toxic and harmful gases during the combustion process, which is harmful to the human body and the environment.
With the enhancement of people's awareness of humanism and environmental protection, in view of the fact that halogen-containing flame retardants will produce toxic and corrosive gases during combustion, they are used very carefully, so that ordinary glass fiber reinforced epoxy molding compounds Expansion of uses is limited

Method used

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  • Halogen-free flame-proof glass fiber reinforcement epoxy molding compound

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0024] 20.2 parts of bisphenol A type epoxy resin;

[0025] 7.3 parts of novolak resin;

[0026] 2.3 parts of dicyandiamide;

[0027] 62 parts of silicon dioxide;

[0028] 6.8 parts of polyphosphate amine;

[0029] Zinc borate 0.8 part;

[0030] 1.2 parts of calcium stearate;

[0031] 0.6 parts of montan wax;

[0032] 15 parts of glass fiber;

[0033] After accurately weighing the components of bisphenol A epoxy resin, silica (42 parts) as a mineral filler, polyphosphate amine, zinc borate, calcium stearate (1 part) and montan wax (0.4 part) , adding to a kneader for heating and mixing, the mixing temperature is 100-120°C, after mixing evenly, cool and pulverize to obtain component (A);

[0034] Then novolac resin, dicyandiamide, silicon dioxide (20 parts), calcium stearate (0.2 part) and montan wax (0.2 part) components were accurately weighed, then added to the kneader for heating and mixing, After mixing evenly, cool and pulverize to obtain component (B);

[0035] ...

Embodiment 2

[0037] 21.5 parts of bisphenol A type epoxy resin;

[0038] Novolak resin 8.1 parts;

[0039] 1.5 parts of 2-methylimidazole;

[0040] 65 parts of silicon dioxide;

[0041] 7.3 parts of melamine phosphate;

[0042] 1.8 parts of antimony trioxide;

[0043] Zinc stearate 1.0 parts;

[0044] Palm wax 0.8 parts;

[0045] 0.1 parts of stearic acid;

[0046] 16 parts of glass fiber;

[0047] Everlasting Red 0.3 parts.

[0048] First accurately weigh the components of bisphenol A epoxy resin, silicon dioxide (45 parts), melamine phosphate, antimony trioxide, zinc stearate, palm wax (0.4 parts) and permanent red, then add The kneader is heated and mixed, and the mixing temperature is 100-120 ° C. After the mixing is uniform, it is cooled and pulverized to obtain component (A);

[0049] Then novolac resin, 2-methylimidazole, silicon dioxide (20 parts), stearic acid and palm wax (0.4 parts) were accurately weighed, then added to the kneader for heating and mixing, and after mix...

Embodiment 3

[0052] 22.8 parts of bisphenol A type epoxy resin;

[0053] 8.8 parts of novolac resins;

[0054] 3.2 parts of dicyandiamide;

[0055] 70 parts of aluminum hydroxide;

[0056] 5.2 parts of melamine urate;

[0057] 1.5 parts of zinc borate;

[0058] 0.5 parts of magnesium stearate;

[0059] Palm wax 0.8 parts;

[0060] 0.7 parts of montan wax;

[0061] 0.1 parts of stearic acid;

[0062] 19.5 parts of glass fiber;

[0063]Titanium cyanide blue 0.35 parts.

[0064] First accurately weigh the components of bisphenol A epoxy resin, aluminum hydroxide (50 parts) as a mineral filler, melamine urate, zinc borate, magnesium stearate, palm wax and titanium cyanide blue, then add and knead machine for heating and mixing, the mixing temperature is 100-120°C, after mixing evenly, cool and pulverize to obtain component (A);

[0065] After accurately weighing the novolac resin, dicyandiamide, aluminum hydroxide (20 parts), stearic acid and montan wax components, add them to the kn...

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Abstract

The invention relates to non-halogen flame-resistant glass fiber reinforced epoxy molding compound. According to the weight parts, the material of the non-halogen flame-resistant glass fiber reinforced epoxy molding compound comprises 20 parts to 25 parts of epoxy resin, 7 parts to 9 parts of phenolic resin, 1.4 parts to 3.4 parts of curing agent, 60 parts to 75 parts of mineral filler, 4 parts to 7.5 parts of phosphate, 0.8 parts to 2 parts of metal oxide, 1.8 parts to 2.5 parts of mould releasing agent and 15 parts to 20 parts of reinforced fiber. The non-halogen flame-resistant glass fiber reinforced epoxy molding compound has advantages that because halogen is not contained in the formulation, when being burnt, noxious gas and harmful gas can not be generated, and the physical safety and the environmental protection can be ensured; the shrinkage ratio is 0.4 percent to 0.7 percent, the bending strength is 105 to 120 MPa, the notched impact strength is greater than 2.2 KJ per m<2>, the resistance is 1X10<12> Omega, the proof tracking index is greater than 600 V, the arc resistance is greater than 180 s, the electrical strength is greater than 10 MV per m, the flame-resistant performance reaches grade UL-94-V-0 (1.6 mm), and the non-halogen flame-resistant glass fiber reinforced epoxy molding compound can be suitable for the sealing material for manufacturing automobile commutators and electronic products.

Description

technical field [0001] The invention belongs to the technical field of thermosetting molding compounds, in particular to a halogen-free flame-retardant glass fiber reinforced epoxy molding compound. technical background [0002] Epoxy molding compound is a composite material made by mixing epoxy resin with curing agent and other necessary components (such as filler, mold release agent, reinforcing fiber, etc.). Because this composite material has good adhesion, low moisture absorption and high strength, it is often used as an electronic material and packaging material for electronic components. Ordinary epoxy molding compound is easy to burn. In order to improve the combustion resistance of the material, that is, flame retardancy, a flame retardant must be added to the epoxy molding compound. As is known in the industry, adding halogenated flame retardants such as decabromodiphenyl ether, tetrabromobisphenol A, hexabromobenzene, tetrabromobutane and / or tetrabromoethane to e...

Claims

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Application Information

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IPC IPC(8): C08L63/00C08K13/04C08K3/32C08K5/3492C08K5/52C08K3/22C08K3/38C08J5/04
Inventor 张文军王康建魏卫杨乐恩王可强
Owner 常熟东南塑料有限公司
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