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Radiation-sensitive resin composition, layer insulation film and microlens and manufacture method thereof

A resin composition and radiation technology, which is applied in the photoengraving process of the pattern surface, opto-mechanical equipment, and photosensitive materials for opto-mechanical equipment, etc., can solve problems such as easy peeling and product yield problems.

Active Publication Date: 2012-11-28
JSR CORPORATIOON
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0009] In addition, if the interlayer insulating film or microlens obtained in this way is formed in the development process, even if the development time is only a little longer than the optimum time, the developer will permeate between the pattern and the substrate, and peeling will easily occur. It is necessary to strictly control the development time, and there are problems in the yield of the product

Method used

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  • Radiation-sensitive resin composition, layer insulation film and microlens and manufacture method thereof
  • Radiation-sensitive resin composition, layer insulation film and microlens and manufacture method thereof
  • Radiation-sensitive resin composition, layer insulation film and microlens and manufacture method thereof

Examples

Experimental program
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preparation example Construction

[0129] As a polymerization initiator used for the preparation of polymer [A], what is generally known as a radical polymerization initiator can be used. Examples include 2,2'-azobisisobutyronitrile, 2,2'-azobis(2,4-dimethylvaleronitrile), 2,2'-azobis(4-methoxy- 2,4-Dimethylvaleronitrile) and other azo compounds; benzoyl peroxide, lauroyl peroxide, tert-butyl peroxyvalerate, 1,1'-bis-(tert-butyl peroxide)cyclohexyl organic peroxides such as alkanes; and hydrogen peroxide. When using a peroxide as a radical polymerization initiator, you may use a peroxide together with a reducing agent as a redox type initiator.

[0130] The usage ratio of the polymerization initiator is preferably 0.1 to 50 parts by weight, more preferably 0.1 to 20 parts by weight with respect to 100 parts by weight of all the unsaturated compounds.

[0131] Examples of the solvent used in the preparation of the polymer [A] include alcohol, ether, glycol ether, ethylene glycol alkyl ether acetate, diethylene...

Embodiment

[0232] Hereinafter, synthesis examples and examples are given to describe the present invention more specifically, but the present invention is not limited to the following examples.

[0233] Synthesis example of polymer [A]

Synthetic example 1

[0235] 7 parts by weight of 2,2'-azobis(2,4-dimethylvaleronitrile) and 200 parts by weight of diethylene glycol ethyl methyl ether were added to a flask equipped with a condenser tube and a stirrer. Then add 15 parts by weight of methacrylic acid, tricyclic methacrylic acid [5.2.1.0 2，6 ] 20 parts by weight of decane-8-yl ester, 5 parts by weight of 4-acryloylmorpholine, 50 parts by weight of glycidyl methacrylate, 10 parts by weight of styrene and 3 parts by weight of pentaerythritol tetrakis (3-mercapto propionate) Parts and nitrogen replacement, began to stir slowly. The temperature of the solution was raised to 70°C, and the temperature was maintained for 4 hours to obtain a polymer solution containing the copolymer [A-1].

[0236] The polystyrene conversion weight average molecular weight (Mw) of copolymer [A-1] was 12,000, and molecular weight distribution (Mw / Mn) was 3.0. In addition, the polymer concentration in the polymer solution obtained here was 34.8% by weight....

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Abstract

The invention relates to a radiosensitive resin combination, which contains [A] polymer and [B] 1,2-diazido quinone compound. The [A] polymer has the following groups: at least one group selected from carboxyl and carboxylic acid anhydride group, at least one group selected from epoxy ethyl and oxygen heterocyclic ring butyl, and n+ / - group expressed by the following formula (1), (in formula (1), RI is methene, alkylidene with 2 to 10 carbon atoms or alkyl methene; Y is single bond, -CO-, -O-CO-* (wherein, the connecting bond with * is bonded with the RI), n is an integer from 2 to 10, X is n+ / - alkyl with one or a plurality of ether linkages and 2 to 70 carbon atoms, and + expresses a connecting bond).

Description

technical field [0001] The present invention relates to a radiation-sensitive resin composition, an interlayer insulating film, a microlens and their preparation methods. Background technique [0002] In electronic components such as thin-film transistor (hereinafter referred to as "TFT") liquid crystal display elements, magnetic head elements, integrated circuit elements, and solid-state imaging elements, an interlayer insulating film is generally provided to insulate interconnections arranged in layers. As the material for forming the interlayer insulating film, since it is preferable to obtain a necessary pattern shape with a small number of steps and a material with sufficient flatness, radiation-sensitive resin compositions are widely used (see JP-A-2001-354822 and JP-A-2001-354822 and JP-A 2001-343743). [0003] In the above-mentioned electronic components, for example, a TFT type liquid crystal display element is manufactured through the process of forming a transpar...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G03F7/008G03F7/00C08F220/32C08F4/04C08F220/10C08F212/08
CPCG03F7/004G03F7/0045G03F7/0047G03F7/027
Inventor 内池千浩花村政晓滨田谦一饭岛孝浩
Owner JSR CORPORATIOON
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