Polyurethane adhesive for compounding high-temperature insulation material and preparation thereof

A technology of polyurethane adhesives and insulating materials, applied in the direction of polyurea/polyurethane adhesives, adhesives, adhesive types, etc., can solve the problems of composite failure, peeling, foaming, etc., and achieve good composite process performance and Adhesive properties, improved high temperature resistance, and the effect of product flexibility

Inactive Publication Date: 2009-02-25
SHANGHAI XINGUANG CHEM
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the compounding of thick polyester film, polyimide and polyaramid fiber paper with a temperature of 200 ° C to 220 ° C above H level cannot meet the requirements (bubbles, peeling, etc.), and all lag behind similar foreign products

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0030] The preparation process of main agent is:

[0031] ① Esterification: Put 396.4g of 1,4-butanediol, 457.1g of isophthalic acid, 1112.4g of sebacic acid, 286.3g of neopentyl glycol, and 396.6g of 1,4-cyclohexyldimethanol into the reaction by weight ratio device, the N 2 Under protection, the reaction temperature was gradually raised to 150° C., kept for 3.5 hours, and the outlet water temperature of the fractionation tower was kept at 103° C. Finally, the temperature was raised to 220°C for 4 hours, and the reflux water was changed to a bypass for 2.5 hours, and the acid value was measured by sampling.

[0032] ② Polycondensation: When the acid value is lower than 15mgKOH / g, vacuum polycondensation, the vacuum degree gradually increases from low to high, from -0.02MPa to -0.06MPa, keep for 2.5h, turn to high vacuum -0.1MPa at 235℃ Keep for 6h, cool, pass N 2 Exclude the vacuum. The measured acid value of the polyester resin is 0.9 mgKOH / g, and the hydroxyl value is 42...

Embodiment 2

[0039] The weight percentage of main ingredient is composed of:

[0040] Adipic acid: 730g

[0041] Isophthalic acid: 415g

[0042] Neopentyl glycol: 260g

[0043] 1,4-butanediol: 245g

[0044] Ethylene glycol 248g

[0045] Diphenylmethane diisocyanate: 140.5g

[0046] Ethyl acetate: 800g

[0047] Acetone: 3204g

[0048] Trishydroxyethylisocyanurate: 55.5g

[0049] γ-glycidyl etheroxypropyltrimethoxysilane: 27.75g

[0050] Curing agent weight percent consists of:

[0051] Toluene diisocyanate: 749.8g

[0052] 2,4-Diphenylmethane diisocyanate (MDI-50): 83.3g

[0053] Trimethylolpropane: 220.4g

[0054] Ethyl acetate: 351.2g

[0055] The operating steps of the main agent are the same as those in Example 1. After esterification and polycondensation reactions, the acid value of the polyester resin is measured to be 0.9 mgKOH / g, and the hydroxyl value is 42 mgKOH / g to obtain the resin of this example, and then synthesize polyurethane and compound glue to obtain the main a...

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Abstract

The present invention relates to a compound polyurethane adhesive for high-temperature insulation materials and a preparation method thereof. The polyurethane adhesive contains a host agent and a solidified agent. The host agent contains aliphatic diacid, aliphatic diols, aromatic diacid, diisocyanate, organic solvents and mating agent. The solidified agent contains diisocyanate, polyhydric alcohol and organic solvents. The host agent and the solidifying agent are evenly mixed into glue according to the weight proportion of 100:15-20 and solidified for 4 hours at 100 DEG. The present invention has good compounding process performance and adhesion property on polyester film/p-aramid insulation paper and polyimide/p-aramid insulation paper.

Description

1. Technical field [0001] The invention relates to a polyurethane adhesive, which is especially applicable to compounding high-temperature-resistant insulating materials and a preparation method thereof. 2. Background technology [0002] Insulation material is an important material for electrical products, whether it is advanced or not is the key to the performance, weight, power and safety of electrical equipment. At present, the flexible composite materials for electrical insulation are generally 105℃~130℃B grade and E grade polyester film / insulating paper / polyester film (MFM); 155℃F grade composite polyester fiber nonwoven fabric / polyester film / Polyester non-woven fabric (DMD); polyester film / polyaramid fiber paper for 180℃H grade composite is generally Nomex (NMN); 180~220℃H~C grade uses polyimide / polyaramid Amide fiber paper (NHKN) is also compounded with thick polyester film. With the rapid development of the national economy, F-class and even H-class motors can no ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J175/06
Inventor 陆东贞蔡华
Owner SHANGHAI XINGUANG CHEM
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