Quick solid-ceramic coating ion plating apparatus

A technology of hard ceramics and coating ions, which is applied in the direction of ion implantation plating, coating, metal material coating technology, etc., can solve the problems of coating deposition rate, hardness and poor adhesion, and improve the coating quality , comprehensive performance improvement, and the effect of density improvement

Inactive Publication Date: 2009-04-08
WUHAN UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to overcome the shortcomings of coating deposition rate, hardness and poor adhesion in existing arc ion plating equipment, and provide a fast hard ceramic coating ion plating device, which has better ion plating effect and Thick Film Capability

Method used

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  • Quick solid-ceramic coating ion plating apparatus
  • Quick solid-ceramic coating ion plating apparatus
  • Quick solid-ceramic coating ion plating apparatus

Examples

Experimental program
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Effect test

example 1

[0022]Example 1: Under the condition of 0.5Pa and negative 150V bias, the metal Cr target arc discharge controlled by the magnetic field is used to prepare a pure Cr metal transition layer; then nitrogen gas is introduced, and the air pressure rises to 2.3Pa, and all arc targets and arc targets on the furnace wall are opened. The rotating target in the middle uses nitrogen gas to react with Cr evaporated from the target surface to form CrN. The nitrogen gas flow rate is 200-600 sccm; the current of a single circular arc target metal target on the furnace wall is 60-80A. The center rotating target current is 250-300A.

[0023] The magnetic field of the circular target on the furnace wall to control the movement of the arc is generated by a magnet placed behind the arc target. A uniformly distributed magnetic field with a strength of 50 Gauss is generated on the target surface.

[0024] The above-mentioned glow discharge cleaning is carried out at 350-400°C in an argon environ...

example 2

[0025] Example 2: Under the condition of 0.5Pa and negative 200V bias, the metal Ti target arc discharge controlled by the magnetic field is used to prepare a pure Ti metal transition layer; The rotating target uses nitrogen gas to react with Ti evaporated from the target surface to form TiN. The nitrogen gas flow rate is 100-250 sccm; the current of a single circular arc target metal target on the furnace wall is 40-60A. The center rotating target current is 180-250A.

[0026] The magnetic field of the circular target on the furnace wall to control the movement of the arc is generated by a magnet placed behind the arc target. A uniformly distributed magnetic field with a strength of 50 Gauss is generated on the target surface.

[0027] The above-mentioned glow discharge cleaning is carried out at 350-400°C in an argon environment; after the glow cleaning is completed, the cathode arc discharge of the metal Ti target is carried out under the condition of 0.5Pa to deposit the...

example 3

[0028] Example 3: Under the condition of 0.5Pa and negative 100V bias voltage, a metal Zr target arc discharge controlled by a magnetic field is used to prepare a pure Zr metal transition layer; then feed nitrogen, and the air pressure rises to 1.5Pa, and all arc targets and arcs on the furnace wall are opened. The rotating target in the middle uses nitrogen gas to react with Zr evaporated from the target surface to form ZrN. The nitrogen gas flow rate is 150-350 sccm; the current of a single circular arc target metal target on the furnace wall is 80-110A. The center rotating target current is 200-280A.

[0029] The magnetic field of the circular target on the furnace wall to control the movement of the arc is generated by a magnet placed behind the arc target. A uniformly distributed magnetic field with a strength of 50 Gauss is generated on the target surface.

[0030] The above-mentioned glow discharge cleaning is carried out at 350-400° C. under an argon atmosphere; afte...

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Abstract

The invention discloses a rapid hard ceramic coating ion plating device which comprises a vacuum chamber formed by a furnace wall, one side of which is provided with a furnace door, and the vacuum chamber is provided with a vacuum pumping port. The interior of the vacuum chamber is provided with round electric arc targets and a high-power cylindrical rotary electric arc target, wherein, the round electric arc targets are divided into 2N rows, N is more than or equal to 1, the round electric arc targets are uniformly distributed on the furnace wall, the high-power cylindrical rotary electric arc target is arranged at the centre of the vacuum chamber, and the space between the round electric arc targets and the central high-power cylindrical electric arc target is an ion plating deposition area, and work supports are distributed in the ion plating deposition area. The device fully utilizes the high ionization rate of the electric arc ion plating technology, greatly improves the deposition efficiency of the ceramic coating and overcomes the defects in the prior art that expensive ion sources need to be added so as to improve adhesive force, etc. The device has the advantages of high film plating efficiency, low film plating cost, convenient operation, and the like. The device can meet the demand of over-thick ceramic coating in industry and has good application prospect in industrial production.

Description

technical field [0001] The invention relates to a rapid hard ceramic coating ion plating device, which belongs to the technical field of coating. Background technique [0002] Chromium electroplating is widely used in aerospace, machinery, electronics, chemical industry, hardware and other industries, and is the most widely used surface coating. However, the wastewater discharged from the chromium electroplating process contains a variety of heavy metals, especially the carcinogenic hexavalent chromium, which seriously pollutes the surrounding environment. With the increasing emphasis on environmental protection, developed countries have completely banned the use of electrochrome plating technology, and all of them have been subcontracted to developing countries including China, which has caused serious pollution to the environment. In response to the increasingly serious environmental problems, the country has adopted more stringent environmental policies. Recently, it is...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C14/48C23C14/06C23C14/54
Inventor 杨兵丁辉付德君
Owner WUHAN UNIV
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