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Process for preparing low temperature, high heat conducting and electrical insulation epoxy resin nano composite material

A technology of epoxy resin and preparation process, which is applied in the direction of heat exchange materials, organic insulators, plastic/resin/wax insulators, etc. It can solve the problems of easy aggregation of nanoparticles, low thermal conductivity, and poor low-temperature toughness, and achieve low temperature and Improvement of thermal conductivity at room temperature, improvement of impact toughness at low temperature, and improvement of impact toughness

Inactive Publication Date: 2009-05-06
725TH RES INST OF CHINA SHIPBUILDING INDAL CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0011] In order to overcome the shortcomings of poor low-temperature toughness and low thermal conductivity of epoxy resin under the above-mentioned background technology conditions, the present invention provides a low-temperature, high thermal conductivity, electrical insulation epoxy resin nanocomposite preparation process, using a filling method in epoxy resin Nano-ceramic particles with high thermal conductivity are introduced into the matrix, and the problem of easy agglomeration of nano-ceramic particles is solved by surface modification of nano-ceramic particles, and nano-ceramic particles are uniformly dispersed in epoxy resin by high-speed stirring and ultrasonic oscillation. , which solves the problem of sedimentation of nano-ceramic particles in the resin

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0027] 1) Nano powder modification

[0028] Add 10 parts by weight of nanoparticles to 0.8 parts by weight of coupling agent and 40 parts by weight of organic solvent, stir for 2 hours by high-speed shear at a speed of 1500 rpm, mix the above solution evenly, and vibrate by ultrasonic 1 hour so that the nano-powder can be uniformly dispersed, and then the solution is heated while stirring until the solvent is volatilized, and the modified nano-powder is dried and ground for use;

[0029] 2) Uniform dispersion of nano ceramic powder

[0030] Add 20 parts by weight of nanometer powder after modification to 40 parts by weight of epoxy resin, 35 parts by weight of low-molecular bisphenol A epoxy resin, and 25 parts by weight of liquid aromatic diamine. Stir at a stirring speed for 2 hours, mix the above mixed solution evenly, and oscillate ultrasonically for 1 hour, so that the nano-powder is evenly dispersed in the mixed solution;

[0031] 3) Curing of epoxy resin

[0032] Pou...

Embodiment 2

[0034] 1) Nano powder modification

[0035] Add 10 parts by weight of nanoparticles to 0.2 parts by weight of coupling agent and 50 parts by weight of organic solvent, stir for 2 hours by high-speed shear at a speed of 2000 rpm, mix the above solution evenly, and vibrate by ultrasonic 1 hour, so that the nano-powder can be uniformly dispersed, then heat the solution while stirring until the solvent is volatilized, dry the modified nano-powder and grind it for use;

[0036] 2) Uniform dispersion of nano ceramic powder

[0037] Add 20 parts by weight of the modified nano-powder to a mixed solution of 50 parts by weight of epoxy resin, 40 parts by weight of low-molecular bisphenol A epoxy resin, and 30 parts by weight of liquid aromatic diamine toughening agent. Stir at a stirring speed of 2000 rpm for 2 hours, mix the above mixed solution evenly, and oscillate ultrasonically for 1 hour, so that the nano-powder is evenly dispersed in the mixed solution;

[0038] 3) Curing of ep...

Embodiment 3

[0041] 1) Nano powder modification

[0042] Add 10 parts by weight of nanoparticles to 0.1 parts by weight of coupling agent and 50 parts by weight of organic solvent, stir for 2 hours by high-speed shear at a speed of 2000 rpm, mix the above solution evenly, and vibrate by ultrasonic 1 hour, so that the nano-powder can be uniformly dispersed, then heat the solution while stirring until the solvent is volatilized, dry the modified nano-powder and grind it for use;

[0043] 2) Uniform dispersion of nano ceramic powder

[0044] Add 20 parts by weight of nano powder after modification to the mixed solution of 70 parts by weight of epoxy resin, 50 parts by weight of low-molecular bisphenol A epoxy resin, and 40 parts by weight of liquid aromatic diamine toughening agent. Stir for 2 hours at a stirring speed of 1 / min, mix the above-mentioned mixed solution evenly, and oscillate with ultrasonic wave for 1 hour, so that the nano-powder is evenly dispersed in the mixed solution;

[...

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Abstract

The invention provides a process for preparing a low-temperature, high-heat conduction and electric insulation epoxy resin nano composite material. In the process, by the filling method, nano ceramic grains with high heat conduction ratio are filled in an epoxy resin matrix, and the problem of easy agglomeration of the nano grains is solved by surface modifying the nano ceramic grains, and by the high-speed stirring and the ultrasonic wave vibration methods, the nano ceramic grains are evenly dispersed in the epoxy resin, so that the problem of the sedimentation of the nano ceramic grains in the resin is also solved; moreover, because the nano ceramic grains have pinning effect on micro cracks, thereby the impact toughness of the composite material system is improved; at the same time, the filled nano ceramic grains also have relative high volume resistivity, thereby the volume resistivity of the composite material system is still kept high.

Description

technical field [0001] The invention belongs to the technical field of nanocomposite materials, and in particular relates to a preparation process of epoxy resin nanocomposite materials with low temperature, high thermal conductivity and electrical insulation. Background technique [0002] Low temperature epoxy resin refers to the epoxy resin used in low temperature environment and has sufficient bonding strength and toughness. Low temperature environment usually refers to 77K liquid nitrogen, 20K liquid hydrogen, 4K liquid helium and other environments. [0003] The development of national defense industry, aerospace technology and superconducting technology has put forward new requirements for the performance of epoxy resin: [0004] ①Good low temperature bonding performance and toughness [0005] Good bonding performance and toughness at low temperature are the basis for ensuring the reliability of bonding effects such as electronic packaging and coil impregnation, and a...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/02C08K9/00C09K5/00H01B3/40C08K5/17
Inventor 谢述锋王岳王德义
Owner 725TH RES INST OF CHINA SHIPBUILDING INDAL CORP
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