Substrate for flexible organic optoelectronic device and preparation method thereof

A technology of optoelectronic devices and substrates, which is applied in the fields of electrical solid-state devices, semiconductor/solid-state device manufacturing, photovoltaic power generation, etc., can solve the problems of poor adhesion between thin films and substrates, reduce production costs and process difficulties, improve performance and life, The effect of improving performance

Inactive Publication Date: 2009-06-24
UNIV OF ELECTRONICS SCI & TECH OF CHINA
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] The technical problem to be solved by the present invention is how to provide a substrate for flexible organic optoelectronic devices and its preparation method, which solves the problem of poor adhesion between the deposited film and the substrate due to the low surface energy of the flexib...

Method used

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  • Substrate for flexible organic optoelectronic device and preparation method thereof
  • Substrate for flexible organic optoelectronic device and preparation method thereof
  • Substrate for flexible organic optoelectronic device and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0086] Such as figure 1 In the substrate structure shown, the flexible substrate 1 is a flexible polyethylene terephthalate polymer (PET) substrate, the adhesive layer 2 is a single-layer dual-curing system, and the conductive film 3 is ITO sputtered by DC magnetron. Transparent conductive film. The transmittance test curve is as figure 2 shown.

[0087] The preparation method is as follows:

[0088] ①Use detergent, acetone solution, ethanol solution and deionized water to ultrasonically clean the PET substrate, and dry it with dry nitrogen after cleaning;

[0089] ② Mechanically stir the UV-curable silicone adhesive raw material diluted 1:10 with ethanol for 20 hours, then spin-coat it on the PET surface at a speed of 2000 rpm for one minute, and the film thickness is about 100 nanometers.

[0090] Wherein the ratio of adhesive raw material components is:

[0091] Silicone 94%

[0092] Photoinitiator 2.5%

[0093] Diluents and additives 3.5%;

[0094] ③UV curing trea...

Embodiment 2

[0099] Such as figure 1 In the substrate structure shown, the flexible substrate 1 is made of a flexible metal foil, the adhesive layer 2 is made of a single-layer UV-curable adhesive, and the conductive film 3 is a DC magnetron sputtered ITO transparent conductive film.

[0100] The preparation method is as follows:

[0101] ①Use detergent, acetone solution, ethanol solution and deionized water to ultrasonically clean the flexible metal foil, and dry it with dry nitrogen after cleaning;

[0102] ② Mechanically stir the UV-curable silicone adhesive raw material diluted 1:1 with ethanol for 30 hours, then spin-coat it on the surface of the flexible metal foil at a speed of 3000 rpm for 1 minute, and the film thickness is about 200 nanometers;

[0103] Wherein the ratio of adhesive raw material components is:

[0104] Silicone 93%

[0105] Photoinitiator 4%

[0106] Diluents and additives 3%;

[0107] ③UV curing treatment on the surface of the substrate for 30 seconds;

[...

Embodiment 3

[0111] Such as figure 1 In the substrate structure shown, the flexible substrate 1 is a PET substrate, the adhesive layer 2 is a single-layer ultraviolet curing adhesive, and the conductive film 3 is a metal conductive film prepared by thermal evaporation.

[0112] ①Use detergent, acetone solution, ethanol solution and deionized water to ultrasonically clean the surface of the PET substrate, and dry it with dry nitrogen after cleaning;

[0113] ② Mechanically stir the UV-curable silicone adhesive raw material diluted 1:10 with ethanol for 20 hours, then spin-coat it on the PET surface at a speed of 2000 rpm for one minute, and the film thickness is about 100 nanometers;

[0114] ③Irradiate the surface of the substrate with ultraviolet light for 30 seconds;

[0115] ④Put the substrate into a vacuum chamber, and evaporate a 100nm thick metal conductive film on the surface of the PET substrate by thermal evaporation at room temperature;

[0116] ⑤After taking the substrate out ...

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Abstract

The invention discloses a flexible substrate used for optoelectronic devices and comprises a flexible substrate; the invention is characterized in that a bonding layer and a conductive thin film are arranged on the surface of the flexible substrate; the conductive thin film is deposited on the surface of the bonding layer; the bonding layer is made of UV-curable silicone adhesive; and the raw material of the adhesive comprises photosensitive polysiloxane, photoinitiator and reactive diluents. The substrate solves the problem of poor adhesion between the deposited conductive thin film and the substrate due to low surface energy of the flexible substrate and improves the barrier properties of the substrate on water and oxygen, and also achieves good smoothing effect on the surface of the substrate; besides, the preparation method is simple and effective, which can significantly reduce the substrate production cost and process difficulty and increase the substrate yield rate in the etching process.

Description

technical field [0001] The invention relates to the technical field of organic optoelectronic devices, in particular to a flexible organic optoelectronic device substrate and a preparation method thereof. Background technique [0002] Optoelectronics technology is a high-tech industry that develops rapidly after microelectronics technology. With the rapid development of optoelectronic technology, optoelectronic products such as solar cells, optical image sensors, plasma flat panel displays, electroluminescent displays, thin film transistors, and liquid crystal display panels have gradually matured, and they have greatly improved human life. At the same time, the wide application of optoelectronic information technology in various fields of social life has also created a huge growing market. Developed countries regard the optoelectronic information industry as one of the key development areas, and the competition in the optoelectronic information field is unfolding worldwide...

Claims

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Application Information

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IPC IPC(8): H01L51/00H01L51/44H01L51/46H01L51/48H01L51/52H01L51/54H01L51/56C09J183/04
CPCY02E10/50Y02E10/549Y02P70/50
Inventor 于军胜李璐蒋亚东黄江
Owner UNIV OF ELECTRONICS SCI & TECH OF CHINA
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