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Polyimide carbon fiber sizing agent and method for producing the same

A polyimide carbon fiber, setting agent technology, applied in the direction of carbon fiber, fiber processing, textiles and papermaking, etc., can solve the molecular structure preparation method of ES-T321 setting agent Unpublished, no published reports, molecular structure or preparation method No public reports, etc.

Inactive Publication Date: 2009-07-22
DONGHUA UNIV +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the molecular structure of ES-T321 styling agent and its preparation method have not yet been disclosed
[0007] At present, although the application of the sizing agent for carbon fiber preforming in the epoxy resin RTM molding process has been reported, there are no public reports on its molecular structure or preparation method; There is no public report about the sizing agent for molding

Method used

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  • Polyimide carbon fiber sizing agent and method for producing the same
  • Polyimide carbon fiber sizing agent and method for producing the same
  • Polyimide carbon fiber sizing agent and method for producing the same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0060] Put 54.8 grams (0.1 mol) of 2,2-bis[4-(2,4-diaminophenoxy)phenyl]hexafluoropropane and 5520 milliliters of N,N-dimethylacetamide into the reaction kettle , stirred, after complete dissolution, cooled to 0°C in an ice-water bath, added 19.6 grams (0.2 moles) of maleic anhydride, stirred within the temperature range of 0°C-20°C, after complete dissolution, maintained the reaction for 0.5 hours, added 568.5 grams (1.0 mole) of 2,2-bis[3-amino-4-(4-cyanophenoxy)phenyl]hexafluoropropane, 518.5 grams (1.0 mole) of 2,2-bis[4-(4 -Aminophenoxy)phenyl]hexafluoropropane, stirred, completely dissolved, cooled to 0°C in an ice-water bath, and added 676.2 grams (2.1 moles) of 3,3',4,4'-tetracarboxylic acid benzophenone Dianhydride, stirred within the temperature range of 0°C-20°C, after completely dissolving, after maintaining the reaction for 2 hours, add 552 ml of toluene and 18.8 g (0.11 moles) of p-toluenesulfonic acid, heat up, reflux and water separation reaction After 5 hours...

Embodiment 2

[0066] 44.1 grams (0.1 moles) of 2,2-bis[4-(2,4-diaminophenoxy)phenyl]propane, 1000 milliliters of N-methyl-2-pyrrolidone and 5979 milliliters of N,N-bis Put the methyl formamide into the reaction kettle, stir, and after it is completely dissolved, cool it in an ice-water bath to 0°C, add 32.8 grams (0.2 moles) of Nadic anhydride, stir it in the temperature range of 0°C-20°C, and dissolve it completely , maintained the reaction for 2 hours, added 56.8 grams (0.1 mole) of 2,2-bis[3-amino-4-(4-cyanophenoxy) phenyl] hexafluoropropane, 200.2 grams (0.5 mole) of 4 , 4'-bis(4-aminophenoxy)diphenyl sulfide, stirring, after completely dissolving, cooling to 0°C in an ice-water bath, adding 364.0 grams (0.7 moles) of 2,2-bis[4-(3, 4-dicarboxyphenoxy group) phenyl] propane dianhydride, stir in the temperature range of 0 ℃-20 ℃, after dissolving completely, after maintaining reaction for 4 hours, add 5979 milliliters of toluene, 1000 milliliters of dimethylbenzene and 119.7 grams ( 0.7 ...

Embodiment 3

[0072] 322.0 grams (1.0 mole) of 1,3-bis(2,4-diaminophenoxy)benzene and 5000 milliliters of N,N-dimethylacetamide were put into the reaction kettle, stirred, after completely dissolving, ice Cool in a water bath to 0°C, add 19.6 grams (0.2 moles) of maleic anhydride, stir in the temperature range of 0°C-20°C, after completely dissolving, maintain the reaction for 1.5 hours, add 56.8 grams (0.1 moles) of 2,2 -Bis[3-amino-4-(4-cyanophenoxy)phenyl]hexafluoropropane, 65.4 grams (0.1 moles) of 2,2-bis[4-(2-trifluoromethyl-4- Aminophenoxy)phenyl]hexafluoropropane, stirring, after completely dissolving, cooling to 0°C in an ice-water bath, adding 372.0 g (1.2 moles) of 3,3',4,4'-tetracarboxylic diphenyl ether dianhydride , stirred within the temperature range of 0°C-20°C, after completely dissolving, after maintaining the reaction for 3 hours, add 800 ml of toluene and 18.8 g (0.11 moles) of p-toluenesulfonic acid, heat up, reflux and divide water for 8 hours Finally, separate the t...

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Abstract

The invention relates to a polyimide carbon fiber tackifier with the molecular general formula shown at the right part. The preparation method of the tackifier comprises the steps as follows: quaternary primary aromatic amines and single anhydride are dissolved in strong-polarity aprotic organic solvent by the molar ratio of 1:2, mixed for reaction for 0.5-2 hours at the temperature of 0-20 DEG C; subsequently, binary primary aromatic amines and 2, 2-bi (3-amido-4-(4-cyano phenoxy) phenyl) Hexafluoropropane are added, mixed, dissolved and cooled by icy water bath; subsequently, binary aromatic anhydride is added and mixed for reaction for 2-4 hours at the temperature of 0-20 DEG C; subsequently, acidic catalyst and entrainer are added; after the heating refluxing water-diversion reaction for 5-12 hours, the entrainer is collected for recovery and reusing and transparent and sticky polyimide solution with uniform phase is obtained; the polyimide carbon fiber tackifier has excellent dimension stability, mechanic property and heat resistance; furthermore, the reaction condition of the preparation method is moderate, the reaction raw material has convenient source and low cost and is friendly to the environment.

Description

technical field [0001] The invention belongs to the field of carbon fiber sizing agent and its preparation, in particular to a polyimide carbon fiber sizing agent and its preparation method. Background technique [0002] Polyimide is a kind of polymer with excellent comprehensive performance, which has excellent heat resistance, low temperature resistance, solvent resistance, self-lubricating property and flame retardancy. At the same time, it also has very good mechanical properties and Dielectric properties. Therefore, it is widely used in photovoltaic materials, nonlinear optical materials; high temperature resistant materials for spacecraft, satellites or space vehicles; advanced structural composite materials in aerospace, automobiles, electromechanical, etc.; Insulating materials, high temperature resistant adhesives, etc.; and FPC or PCB substrate materials in the field of electronic microelectronics, IC interlayer insulating materials, VLSI passivation coatings and ...

Claims

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Application Information

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IPC IPC(8): D06M15/59C08G73/10D06M101/40
Inventor 虞鑫海陈梅芳
Owner DONGHUA UNIV
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