Method of bonding resins by light irradiation and process for producing resin article

Abstract

A bonding method by which a resin can be bonded to another resin at a lower temperature than in thermal fusion bonding with satisfactory productivity. The method of resin bonding, which is for bonding a first resin to a second resin, comprises a step (I) in which those surfaces of the first and second resins which are bonding surfaces are irradiated with ultraviolet and a step (II) in which the resins are heated while keeping the irradiated surfaces in contact with each other to thereby bond the first resin to the second resin, with those surfaces used as bonding surfaces. This bonding method can be applied, for example, to a process for producing a resin article comprising two or more parts which each has a resinous area and which have been bonded to each other at the resinous areas, and to a process for producing a microchip comprising a pair of resin substrates bonded to each other face-to-face, at least one of the resin substrates having a fine channel formed therein.

Description

technical field [0001] The present invention relates to a resin bonding method based on light (ultraviolet light) irradiation and a method for manufacturing a resin article such as a microchip using the method. Background technique [0002] As a resin bonding method, there are usually bonding by thermal fusion, or bonding by coating with an organic solvent or an adhesive. Bonding by thermal fusion is usually performed at a temperature equal to or higher than the glass transition temperature of the resin. [0003] On the other hand, a microchip that typically has a structure in which a pair of substrates are bonded facing each other, and in which a fine flow path is formed on the surface of at least one of the substrates is attracting attention. Microchips are also sometimes called microfluidic devices. [0004] In microchips, by providing regions having various functions, such as reaction regions where reagents are placed, in flow paths called microchannels, it is possible...

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Problems solved by technology

However, the method of Document 2 is only a method for bonding PDMS substrates containing Si-O bonds and having a strong affinity with silicon oxide films, and it is impossible to achieve bonding between resin substrates other than PDMS substrates. bonding

[0013] In the methods of Documents 3 and 4, it is necessary to apply a resin composition to the surface of the substrate, and it is difficult to directly apply this method to a microchip manufacturing method due to the occurrence of clogging of the flow path.

As in Document 1, it is conceivable to apply the resin composition while avoiding the flow path. However, as mentioned above, such a coating process is not only a factor that reduces the productivity of microchips, but it is also difficult to cope with the narrowing of the flow path width. Complicated with the flow pattern

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