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Inorganic anti-electrostatic adhesive and preparation thereof

A technology of inorganic adhesives and adhesives, applied in the direction of inorganic adhesives, adhesives, non-polymer adhesive additives, etc., can solve the problems of high brittleness, complex curing conditions of TiC ceramic powder adhesives, etc., and achieve reduced shrinkage rate, good anti-corrosion Electrostatic effect, effect of improving mechanical strength and heat resistance

Inactive Publication Date: 2009-08-05
BEIJING UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the curing conditions of TiC ceramic powder adhesives are complicated, and they are brittle when used.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0018] First, 30.0g of antimony-doped tin dioxide was pulverized, passed through a 200-mesh standard sieve, mixed evenly with 5.0g of zirconia, and then blended with 65.0g of aluminum phosphate adhesive as a rubber material, and fully stirred to make the antimony-doped tin dioxide Tin oxide and zirconium oxide are evenly dispersed in the aluminum phosphate adhesive to obtain an aluminum phosphate-based inorganic antistatic adhesive.

Embodiment 2

[0020] First, 2.0g of antimony-doped tin dioxide is pulverized, passed through a 200-mesh standard sieve, mixed evenly with 8.0g of zirconia, and then blended with 90g of aluminum phosphate adhesive as a glue, and fully stirred to make the antimony-doped tin dioxide Tin and zirconia are uniformly dispersed in the aluminum phosphate adhesive to obtain an aluminum phosphate-based inorganic antistatic adhesive.

Embodiment 3

[0022] First, 10.5g of antimony-doped tin dioxide was pulverized, passed through a 200-mesh standard sieve, mixed evenly with 0.5g of zirconia, and then blended with 89.0g of aluminum phosphate adhesive as a rubber material, and fully stirred to make the antimony-doped tin dioxide Tin oxide and zirconium oxide are evenly dispersed in the aluminum phosphate adhesive to obtain an aluminum phosphate-based inorganic antistatic adhesive.

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Abstract

The invention discloses inorganic electrostatic resistant adhesive and a method for preparing the same, belonging to the technical field of inorganic conductive adhesive bonding and aiming at overcoming the defects that the prior inorganic electrostatic resistant adhesive has poor high-temperature resistance, high cost, complex inorganic electrostatic resistant adhesive solidifying procedures and high brittleness. The inorganic electrostatic resistant adhesive contains the following components according to the percent by weight: 65-90 percent of inorganic adhesive, 2-30 percent of conductive filler and 0.5-10 percent of solidifying agent. The inorganic electrostatic resistant adhesive is prepared by mixing well the conductive filler and the solidifying agent and mixing the inorganic adhesive with the conductive filler and the solidifying agent which are well mixed. The inorganic electrostatic resistant adhesive has the advantages of good high-temperature resistance, low cost, and the like.

Description

technical field [0001] The invention belongs to the technical field of inorganic conductive bonding, and in particular relates to an inorganic antistatic adhesive and a preparation method thereof. Background technique [0002] In daily life and modern industrial production, many materials are prone to static electricity accumulation during use, resulting in vacuuming, electric shock, and even sparks that lead to vicious accidents such as explosions, resulting in heavy losses and disasters. With the rapid development of science and technology, the wide application of microelectronics technology and the increasingly complex electromagnetic environment, the electromagnetic field effect of electrostatic discharge has become an urgent problem to be solved. Especially in the microelectronics industry, antistatic adhesives are more and more widely used in surface packaging, chip interconnection, and electromagnetic compatibility at seams. [0003] At present, most of the conductiv...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J1/00C09J9/00C09J11/04
Inventor 郭红霞王群李春生
Owner BEIJING UNIV OF TECH
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