Method for recovering waste slurry of multiline cut silicon chips

A waste slurry, multi-wire cutting technology, applied in the direction of fine work equipment, work accessories, stone processing equipment, etc., can solve the problems of occupying space, waste of resources, pollution of the environment, etc., to save energy, eliminate pollution, agglomeration Phenomenon-reducing effect

Inactive Publication Date: 2011-06-01
平顶山市中奥磨料有限公司
View PDF0 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

For a long time, these used waste slurries (the main contents of which are silicon carbide, silicon micropowder, polyethylene glycol cutting fluid, metal impurities and water) have become a heavy burden on the silicon wafer cutting industry. Waste, and occupy space, pollute the environment

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0014] The method for recycling waste slurry of multi-wire cut silicon wafers of the present invention comprises the following steps:

[0015] Step 1: Dilute the recovered waste slurry with polyethylene glycol cutting fluid until the solid mass accounts for 20%-25%;

[0016] The second step: use continuous centrifugation to separate the 6 micron coarse silicon carbide blade particles; add 20% -30% new silicon carbide blade particles and appropriate cutting fluid to the separated silicon carbide blade particles , which can be used normally by the wire cutting machine, which not only reduces the cost of wire cutting, but also shortens the downtime;

[0017] Step 3: Use a continuous belt press to press the remaining cutting liquid slurry containing fine silicon carbide micropowder and silicon micropowder of 6 microns into a filter cake, which can achieve a liquid content of the filter cake of less than 15%, saving money for further processing energy consumption;

[0018] Step 4...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention discloses a method for recovering waste slurry of multiline cut silicon chips. The method comprises the following steps: recovered waste slurry is diluted by a cutting fluid to 20 to 25 percent of solid mass; particles of a silicon carbide blade material thicker than 6 microns are separated by a continuous centrifugal separation method; residue containing silicon carbide micro powder thinner than 6 microns and cutting fluid slurry of silicon micro powder are pressed into a filter mass by a presser; the filter mass is dried by microwave; the filter mass is subjected to a stage treatment of the silicon carbide micro powder and the silicon micro power by an air classifier; after the pressed cutting fluid and steam of the cutting fluid are filtered by a filter, residual impurities in the fluid is subjected to adsorption and impurity removal by floridin sorbent, and is filled and recovered through dehydration and decolorization. The method has the advantages that in the treatment on the waste slurry, the whole production process does not have any pollution, does not consume water, saves energy consumption over 70 percent, and has product recovery ratio over 98 percent.

Description

technical field [0001] The invention relates to the recycling of waste produced in the process of processing silicon wafers by adopting a multi-wire cutting method, in particular to a method for recycling waste slurry of multi-wire cutting silicon wafers. Background technique [0002] At present, the industrial production of photovoltaic cell silicon wafers and semiconductor silicon wafers adopts multi-wire cutting. The main consumables used in the production of multi-wire cutting are the slurry made of special cutting tools for silicon carbide wire cutting and polyethylene glycol cutting fluid. At the current technical level, 10-14 tons of silicon carbide special blades and 10-14 tons of cutting fluid are required to produce 1MW of solar-grade monocrystalline silicon wafers. For a long time, these used waste slurries (the main contents of which are silicon carbide, silicon micropowder, polyethylene glycol cutting fluid, metal impurities and water) have become a heavy burde...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Patents(China)
IPC IPC(8): B28D7/00B28D5/04
Inventor 杨东平周凯
Owner 平顶山市中奥磨料有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products