Organosilicon lubricating grease composition with heat conductivity

Abstract

The invention provides a liquid organosilicon lubricating grease composition, which is cast between a heating element and a heat radiation element and then solidified, thereby improving thermometric conductivity and simultaneously maintaining allocation performance of organosilicon lubricating grease composition with heat conductivity. The organosilicon lubricating grease composition with heat conductivity contains the following substances: 25 DEG C, viscosity 50-1000 Pa.s: (A) organopolysiloxane containing more than two alkenyl groups in one molecule; (B) organic hydrogen polysiloxane showed in general formula (1); (C) organic hydrogen polysiloxane showed in general formula (2); (D) bulking agent with heat conductivity, whose thermometric conductivity is more than 10W / m DEG C; (E) catalyst selected from platinum and platinum compound; (F) control agent selected from acetylenic compound, nitrogen compound, organic phosphorus compound, oxime compound and organic chloride compound; (G) volatile solvent for dispersing or dissolving ingredients mentioned above and the boiling point is 80-360 DEG C.

Description

technical field [0001] The present invention relates to thermally conductive silicone grease compositions containing volatile solvents. Background technique [0002] Currently, not only in the semiconductor industry, but also in various fields such as the automobile industry and home appliance manufacturing, semiconductor devices are beginning to be introduced. The structure of a semiconductor device that has become mainstream at present is composed of an IC package and a heat radiator for dissipating heat from the surface of the IC package. In the meantime, the thermally conductive silicone composition is cast and thermally cured under pressure to bury the microscopic unevenness on the surface of the IC package or the surface of the heat sink while connecting heat generation. body and exothermic body (Japanese Patent Application Laid-Open No. 2002-327116: Patent Document 1). At this time, a heat release sheet or heat release grease can also be used. However, in the case ...

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Problems solved by technology

However, in the case of using a heat releasing sheet, since the minute unevenness cannot be completely buried, as a result, air with a strong heat insulating effect is trapped together, and sufficient heat dissipation cannot be obtained in an IC package that generates a large amount of heat. Exothermic effect

In addition, sometimes an adhesive layer is provided on the surface of the heat radiation sheet to prevent air from entering, but this is not sufficient for the same reason when it is used in an IC module that generates a large amount of heat.

[0003] In order to completely exclude the air, liquid exothermic grease is being turned to, but this exothermic grease, unlike the above-mentioned thermally conductive silicone grease, cannot be solidified after being loaded, so it has the following disadvantages: When used for a long time as The component silicone oil seeps out, or in the worst case the exothermic grease itself comes out between the IC assembly and the exothermic body

[0005] One of the methods to improve thermal conductivity is to increase the filling rate of thermally conductive fillers, but simply applying this method will also cause the problem of a sharp increase in the viscosity of the silicone composition and a sharp deterioration in dispensability

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