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Chemical mechanical grinding composition

A chemical-mechanical, compositional technology applied in the field of sarcosine or sarcosine compounds

Active Publication Date: 2012-05-30
UWIZ TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, after grinding, the benzotriazole will leave residues on the surface of the processing object (chip), and the residue is not easy to be removed by cleaning agents such as deionized water, so that the surface of the processing object (chip) is formed by residues. Surface, which affects the subsequent process of the processing object (chip)

Method used

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  • Chemical mechanical grinding composition
  • Chemical mechanical grinding composition
  • Chemical mechanical grinding composition

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0033] Listed according to Table 1, use the silica sol abrasive grain that comprises average particle diameter about 90nm, alanine, hydrogen peroxide, 1,2,4-triazole (inhibitor), sodium cocoyl sarcosine ( Corrosion inhibitor) and the abrasive slurry composition control sample in which the solvent is water are tested. Wherein, the chemical formula of the sodium cocoyl sarcosinate is as formula four:

[0034]

[0035] Formula four

[0036] (RCON(CH 3 )CH 2 COONa, CAS 61791-59-1)

[0037] Oxidizing agent (hydrogen peroxide)(wt %) Accelerator (alanine) (wt%) Inhibitor (wt%) Abrasive grains (silica sol)(wt %) Corrosion inhibitor ppm Comparative example 1 0.7 2.4 0.025 0.1 0 Comparative example 2 0.7 2.4 0.025 0.1 50 Comparative example 3 0.7 2.4 0 0.1 0 Comparative example 4 0.7 2.4 0 0.1 50

[0038] T...

Embodiment 2

[0051] Listed in Table 3, Comparative Example 5 uses silica sol abrasive grains, hydrogen peroxide, potassium hydroxide, and benzotriazole (corrosion inhibitor) with an average particle diameter of about 90 nm, while Comparative Example 6 uses an average particle diameter of about 90 nm. Silica sol abrasive particles with a particle size of about 90nm, hydrogen peroxide, potassium hydroxide, sodium cocoyl sarcosinate (corrosion inhibitor) and an abrasive slurry composition in which the solvent is water, at a pH value of 11 environment, the control sample was tested.

[0052] Oxidizing agent (hydrogen peroxide) (wt%) Abrasive grains (silica sol)(wt %) BT Appm corrosion inhibitor ppm KOH (wt%) pH Comparative example 5 0.5 30.0 50 0 0.1 11 Comparative example 6 0.5 30.0 0 50 0.1 11

[0053] Table three

[0054] The grinding test was carried out according to the following...

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Abstract

The invention relates to a creatine compound used as a corrosion inhibitor. The creatine compound which is taken as the corrosion inhibitor is creatine and a salt compound thereof. The corrosion inhibitor can be used as a chemical mechanical polishing composition, and can form a protective film on the surface of a processing object during chemical mechanical polishing so as to prevent the processing object from corrosion. In addition, the creatine compound can overcome the defect that residuals are formed on the surface of the processing object due to the use of the prior corrosion inhibitor (such as benzotriazole, BTA). A chemical formula which can best display the characteristics of the corrosion inhibitor is shown.

Description

technical field [0001] The present invention relates to a sarcosine or a sarcosine compound as a corrosion inhibitor, and aims to provide a corrosion inhibitor for chemical mechanical grinding compositions, which can improve the corrosion inhibition ability of the processed object, and will not cause corrosion during grinding. Debris remains on the surface of the object. Background technique [0002] As the critical dimension (Critical Dimension) of electronic components becomes smaller and the number of wire layers increases rapidly, the resistance / capacitance time delay (RC Time Delay) will seriously affect the operation speed of the overall circuit. In order to improve the time delay and electromigration reliability problems caused by the narrowing of the metal connection line width, copper wire materials with low resistivity and high resistance to electromigration damage are selected to replace aluminum alloy metal. However, since copper metal is not easily etched, ano...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C23F11/173
Inventor 张松源
Owner UWIZ TECH