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Electrical element having transparent portion and a sealing method of the same and thermosetting resin composition for sealing

A technology of resin composition and photocurable resin, which is applied in the direction of electrical components, electrical solid devices, semiconductor/solid device parts, etc., can solve the problems of inability to adapt and absorb ultraviolet rays, and achieve low production cost, low viscosity, The effect of improving strength

Active Publication Date: 2013-08-07
DONGJIN SEMICHEM CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in the case of making elements in this way, for the commonly used photocurable resin composition, since the light source reaches the composition after passing through the color filter, the composition cannot absorb ultraviolet rays (UV), so this technology for making elements Not suitable for photocurable resin composition

Method used

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  • Electrical element having transparent portion and a sealing method of the same and thermosetting resin composition for sealing
  • Electrical element having transparent portion and a sealing method of the same and thermosetting resin composition for sealing
  • Electrical element having transparent portion and a sealing method of the same and thermosetting resin composition for sealing

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1～6

[0073] Examples 1-6: Production of thermosetting resin composition

[0074] A thermosetting resin composition for sealing was produced with the composition shown in Table 1 below.

[0075] [Table 1]

[0076]

[0077] EPOLIGHT 100MF: Aliphatic glycidyl ether compound (Kyoeisha)

[0078] YL983U: Bisphenol F epoxy resin (Japan Epokishi Corporation)

[0079] CELLOXIDE 2021P: Cycloaliphatic epoxy resin (Daicel Chemical Industry Co., Ltd.)

[0080] Epikote 152: cresol-novolak type epoxy resin (Nippon Epokishi Corporation)

[0081] RIKACID MH-700: Liquid cycloaliphatic anhydride curing agent (New Japan Rikasha)

[0082] EMI-24: Imidazole Curing Accelerators (Air Products)

[0083] K61B: Amine curing accelerator (Air Chemicals)

[0084] The light transmittance, adhesive strength, viscosity, and curability of each of the thermosetting resin compositions produced in Examples 1 to 6 above were measured, and are shown in Table 2 below, respectively.

[0085] 1. Measurement of l...

Embodiment 7～11

[0092] Examples 7-11: Production of photocurable resin composition

[0093] [table 3]

[0094]

[0095] YL983U: Bisphenol F epoxy resin (Japan Epokishi Corporation)

[0096] NC7300L: biphenyl type epoxy resin (Nippon Kayakusha)

[0097] SP170: Cationic polymerization initiator (Asahi Denka Corporation)

[0098] P-3: Inorganic filler, talc (Nippon Talku Corporation)

[0099] KBM403: Silane coupling agent (Shin-Etsu Corporation)

[0100] The light transmittance, moisture transmittance, adhesive strength, thermal stability, and viscosity of each of the photocurable resin compositions produced in Examples 7 to 11 above were measured, and are shown in Table 4 below.

[0101] 1. Measurement of water permeability: Utilize a bar applicator (bar applicator) to coat the photocurable resin composition on the surface of the polyethylene terephthalate film, so that it is coated on the surface of the film The size of the photocurable resin composition on the surface is 50mm×50mm×0....

Embodiment 12

[0109] Example 12: Sealing of Display Elements

[0110] A lower sealing part and an upper sealing part are prepared, wherein the lower sealing part includes a lower substrate and an anode (positive electrode), a light-emitting layer (red, green, blue surface emitting) and a cathode (negative electrode) laminated on the lower substrate. The thermosetting resin composition of Example 1 above was applied to the entire cathode (negative electrode) surface of the lower sealing member by an ODF process. In addition, the photocurable resin composition was applied to the edge of the upper sealing member using a screen printing process. Under nitrogen atmosphere, at 10 -7 The upper sealing member and the lower sealing member are bonded in a torr vacuum atmosphere so that the coated surface of the upper sealing member and the coated surface of the lower sealing member are in contact with each other. Irradiate 6000mJ / cm to the bonded upper and lower sealing members 2 UV, after curing ...

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Abstract

The invention provides an electrical element having transparent portion and a sealing method of the same and thermosetting resin composition for sealing. In the sealing method of the electrical elements having transparent portion, the electrical elements having transparent portion are formed by splicing the lower sealing piece and upper sealing piece; the method is characterized by comprising: after coating the thermosetting resin composition on one side of the upper sealing piece or the whole face of the cathode (negative pole) face of the lower sealing piece, splicing the lower sealing piece and upper sealing piece, curing the thermosetting resin composition by heating. For the electrical elements manufactured by the method in the invention, the luminous layer and the whole face of the electrode in the element are effectively protected and have excellent service life property. The thermosetting resin composition for sealing used in the invention has low viscosity, thereby having theadvantages of using drip-type injection process, easy for controlling the coating amount and fast coating speed.

Description

technical field [0001] The present invention relates to a sealing method of an electrical component with a light-transmitting portion and an electrical component with a light-transmitting portion, in particular to a sealing method for an electrical component with a light-transmitting portion, an electrical component with a light-transmitting portion, and an electrical component suitable for said The thermosetting resin composition of the sealing method: it can effectively protect the electrical devices in the electrical components and make them have excellent life characteristics, and can effectively carry out the inflow of light so that they have excellent device characteristics, and can improve the electrical components. Intensity; especially the thermosetting resin composition suitable for sealing of the present invention has the advantages of being able to apply the drop type injection (One Drop Fill, ODF) process, the coating amount is easy to control, and the coating spee...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/56H01L23/29H01L51/52H01L33/00H01M14/00C08L63/00
CPCH10K50/844G02F1/1339G02F2202/022G02F2202/28
Inventor 孙祯炫李祥圭朱汉福朴锺大
Owner DONGJIN SEMICHEM CO LTD