A preparation method of surface metallized composite material through chemical plating under photocatalysis

A composite material and surface metal technology, which is applied in metal material coating process, liquid chemical plating, coating, etc., can solve the problems that the product quality is difficult to meet the use requirements, the surface metal layer is not uniform, and the metal particles are thick, etc., to achieve Improve the plating speed and production efficiency, the surface metal layer is uniform, and the effect of fine metal particles

Inactive Publication Date: 2009-10-07
UNIV OF SCI & TECH BEIJING
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, only nano inorganic powder is used as the self-catalytic active surface, and the traditional electroless plating method is used to realize metallization on the surface of the base material, which has th

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0018] Example 1:

[0019] Immerse 1g of nano titanium dioxide powder in 1L of electroless copper plating solution at a temperature range of 20-50°C with constant stirring.

[0020] Electroless plating is performed by irradiating the ultraviolet light with a wavelength of 254nm for 0.1~10min, and NaOH 14g·L is used during the reaction. -1 Maintain the pH of the bath at 11.5-12.

[0021] The nano-titanium dioxide powder composite material coated with metal copper on the surface is taken out, washed, and dried at 80-200 DEG C in an argon atmosphere for 60-150 minutes to prepare the metal copper-coated nano-titanium dioxide powder composite material.

[0022] The formula composition (mass fraction) of the electroless plating solution is 30% CuSO 4 ·5H 2 O 16g·L -1 , 20% HCHO 16mL·L -1 , 20% mixed complexing agent (KNaC 4 H 4 O 6 ·4H 2 O 15g·L -1 , Na 2 EDTA·2H 2 O 24g·L -1 ), 30% mixed additives (C 10 H 8 N 2 24mg·L -1 , K 4 Fe(CN) 6 ·H 2 O 12mg·L -1 ).

Example Embodiment

[0023] Example 2:

[0024] 1.5 g of nano-titanium dioxide powder-coated PBO fiber composite material was immersed in 2L of electroless copper plating solution at a temperature range of 20-80°C, stirring continuously.

[0025] Electroless plating is performed by irradiating UV light with a wavelength of 360nm for 1-30min, and NaOH 14g·L is used during the reaction. -1 Maintain the pH of the plating solution at 11.5 to 12.5.

[0026] The PBO fiber composite material coated with metal copper on the surface is taken out, washed, and dried in a hydrogen atmosphere at 50 to 200° C. for 60 to 180 minutes to prepare the metal copper coated PBO fiber composite material.

[0027] The formula composition (mass fraction) of the electroless plating solution is 30% CuSO 4 ·5H 2 O 16g·L -1 , 30% HCHO 16mL·L -1 , 20% mixed complexing agent (KNaC 4 H 4 O 6 ·4H 2 O 15g·L -1 , Na 2 EDTA·2H 2 O 24g·L -1 ), 20% mixed additives (C 10 H 8 N 2 24mg·L -1 , K 4 Fe(CN) 6 ·H 2 O 12mg·L -1 ).

Example Embodiment

[0028] Example 3:

[0029] Immerse 2g of the nano-zinc oxide powder coated carbon fiber composite material in 3L of electroless copper plating solution with constant stirring at a temperature range of 0-50°C.

[0030] Electroless plating is carried out by irradiating with ultraviolet light with a wavelength of 254nm for 20-40min, and NaOH 14g·L is used during the reaction. -1 Maintain the pH of the bath at 11-12.

[0031] The carbon fiber composite material coated with metal copper on the surface is taken out, washed, and dried under vacuum at 50-100° C. for 60-120 minutes to prepare the metal copper-coated carbon fiber composite material.

[0032] The formula composition (mass fraction) of the electroless plating solution is 20% CuSO 4 ·5H 2 O 16g·L -1 , 30% HCHO 16mL·L -1 , 30% mixed complexing agent (KNaC 4 H 4 O 6 ·4H 2 O 15g·L -1 , Na 2 EDTA·2H 2 O 24g·L -1 ), 20% mixed additives (C 10 H 8 N 2 24mg·L -1 , K 4 Fe(CN) 6 ·H 2 O 12mg·L -1 ).

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Abstract

The present invention pertains to the technical field of the preparation of surface metallized composite material and relates to a preparation method of surface metallized composite material through chemical plating under photocatalysis, wherein the fibre, plastic, fabric, resin, glass, ceramic, monocrystalline silicon or metal encapsulated with semiconductor nano inorganic powder is used as substrate material, or the semiconductor nano inorganic powder is used as substrate material, the photocatalytic technique integrates the reducer effect in conventional chemical plating, metal is carried on the surface of substrate material effectively, and surface metallized composite material is prepared. The advantage is that it makes use of the feature that semiconductor nano inorganic powder will be excited and generate a large number of electron-cavity pairs under the irradiation of photons of which energy is equal to or greater than band-gap energy, while electrons have a reducing effect and help accelerate the reduction of metal ions, and combines this feature with the reducer effect in conventional chemical plating to raise plating speed and production efficiency, reduce product cost and prepare surface metallized composite material with uniform surface metal layer, tiny metal particles, high quality and low cost.

Description

technical field [0001] The invention belongs to the technical field of preparation of surface metallized composite materials, and relates to a preparation method of photocatalytic electroless plating of surface metallized composite materials. Background technique [0002] Loading metal on the surface of polymer materials, inorganic non-metallic materials and metal materials to prepare surface metallized composite materials makes it have unique advantages that single materials do not have, and has broad application prospects. It is one of the research hotspots in the field, and improving product quality, shortening the process flow, improving production efficiency, reducing production costs, and reducing environmental pollution are the key contents of the research and development of this type of surface metallized composite material. [0003] Electroless plating is a typical method for preparing surface metallized composite materials. Its principle is: in the absence of exter...

Claims

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Application Information

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IPC IPC(8): C23C18/31
Inventor 刘雪峰熊小庆谢建新
Owner UNIV OF SCI & TECH BEIJING
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