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Polyphenylene ether-coated epoxy resin microcapsules and preparation method thereof

A technology for coating epoxy resin and epoxy resin, which is applied in the field of polyphenylene ether-coated epoxy resin microcapsules and the preparation thereof, can solve the problems of low heat resistance, unfavorable application and high dielectric constant, and achieves high heat resistance. The effect of high performance, high yield and low water absorption

Inactive Publication Date: 2011-12-21
SUZHOU UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, polyurea-formaldehyde microcapsules with epoxy resin as the capsule core have been successfully synthesized. Although its heat resistance is relatively high, the heat resistance of polyurea-formaldehyde as a wall material is generally lower than that of high-performance thermosetting resins such as cyanate, bis The heat resistance of maleimide, etc., so the heat resistance of microcapsules still needs to be further improved
In addition, the dielectric constant of the wall material polyurea formaldehyde is relatively high, so it is not conducive to its application in fields with strict electrical performance requirements

Method used

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  • Polyphenylene ether-coated epoxy resin microcapsules and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0011] The specific steps of the technical solution of this embodiment are as follows:

[0012] In a three-necked flask equipped with a stirrer, 28 grams of 2,6-xylenol was dissolved in 80 grams of a mass concentration of 2% sodium hydroxide solution, adding 10 grams of a mass concentration of 5% gelatin solution, stirring conditions After slowly adding 30 grams of epoxy resin (E-51), set the stirring rate to 700 rpm. After the temperature of the above system rises to 30°C, add 0.5 grams of cuprous chloride-ethylenediamine complex, and slowly add hydrogen peroxide dropwise , after reacting for 3-6 hours, cool to room temperature to obtain polyphenylene ether-coated epoxy resin microcapsule suspension, after pickling, water washing, suction filtration and drying, the finished microcapsules can be obtained, with an average particle size of 90 μm.

Embodiment 2

[0014] In a three-necked flask equipped with a stirrer, 30 grams of 2,6-xylenol was dissolved in 80 grams of a mass concentration of 2% sodium hydroxide solution, and 10 grams of a mass concentration of 5% dodecylsulfuric acid was added Sodium solution, after slowly adding 30 grams of epoxy resin (E-44) under stirring conditions, set the stirring rate to 650 rpm, and after the temperature of the above system rises to 40 ° C, add 0.5 grams of cuprous chloride-ethylenediamine complex , feed oxygen, react for 3-6 hours, and cool to room temperature to obtain a suspension of polyphenylene ether-coated epoxy resin microcapsules. After pickling, water washing, suction filtration, and drying, the finished microcapsules can be obtained. The particle size is 102 μm.

Embodiment 3

[0016] In a three-necked flask equipped with a stirrer, 28 grams of 2,6-xylenol was dissolved in 80 grams of a mass concentration of 2% sodium hydroxide solution, and 10 grams of a mass concentration of 5% dodecylbenzene was added. Sodium sulfonate solution, after slowly adding 30 grams of epoxy resin (E-51) under stirring conditions, set the stirring rate to 700 rpm. After adding hydrogen peroxide and reacting for 3-6 hours, a suspension of polyphenylene ether-coated epoxy resin microcapsules is obtained. After acid washing, water washing, suction filtration and drying, the finished microcapsules can be obtained, with an average particle size of 96 μm.

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Abstract

The invention discloses a polyphenylene ether-coated epoxy resin microcapsule and a preparation method thereof. It uses epoxy resin as the capsule core, 2,6-dimethylphenol as the wall material, and copper ammonia complex as the catalyst to synthesize polyphenylene ether-coated epoxy resin microcapsules. The method is simple to operate, and the prepared polyphenylene ether-coated epoxy resin microcapsules have high resistance to deformation and good heat resistance, and are expected to be used for toughening low, medium and high temperature molding thermosetting resin bases and their composite material and may endow it with excellent dielectric properties.

Description

technical field [0001] The invention relates to a polyphenylene ether-coated epoxy resin microcapsule and a preparation method thereof, belonging to the technical field of polymer materials. Background technique [0002] Polymer microcapsule technology has been widely used in food, pesticides, feed, coatings, inks, adhesives, cosmetics, detergents, photosensitive materials, textiles and other industries. In recent years, microcapsule technology has been applied in resin-based and composite materials, and has become a new research direction for functional and intelligent materials. Studies have shown that applying microcapsules to resin-based and composite materials can endow materials with functions such as toughening and repairing. However, there are few types of microcapsules currently available for materials, and their heat resistance is poor, so their application in high-performance thermosetting resins is relatively limited. Therefore, the development of microcapsules...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L63/00C08L71/12C08J3/00B01J13/14
Inventor 袁莉顾嫒娟吴建元梁国正王卫
Owner SUZHOU UNIV
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