Method for preparing low-shrinkage-factor copper clad laminate by applying nano-stuffing
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A technology of copper-clad laminates and low shrinkage, which is applied in lamination, lamination devices, lamination auxiliary operations, etc., can solve the problems of inaccurate installation of components, large differences in thermal expansion coefficients, and changes in board flexibility. Poor and other problems, to achieve the effect of improved dimensional stability, lower thermal expansion coefficient, and improved reliability
Active Publication Date: 2009-10-28
SHAANXI SHENGYI TECH
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Therefore, how to reduce the CTE of the board and increase its reliability is an important issue. In addition, if the size shrinkage of the copper clad laminate is too large during the production and processing of the circuit board, it will cause inaccurate installation of components, or failure to assemble, etc. problem, and therefore needs to be improved
Usually, the method to improve the CTE and dimensional stability of the plate is to increase the glass transition temperature (Tg) of the plate. Generally, the resin is below the Tg temperature, and its CTE is 40-100ppm/°C, but when the temperature exceeds Tg, its CTE is 200ppm/°C. ℃, so the CTE corresponding to increasing the Tg of the resin system will also be si
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Embodiment 1
[0012] a. prepare FR-4 glue, its component parts by weight are:
[0013] 100 parts of bisphenol A type epoxy resin, 3 parts of dicyandiamide,
[0014] 15 parts of nanometer calcium carbonate, 0.07 part of 2-methylimidazole,
[0015] The above materials are prepared with acetone / dimethylformamide to make a resin solution for fabrics,
[0016] b. Impregnate the above resin liquid with glass fiber cloth and dry it at 130-190°C to make a fabric;
[0017] c. Select 8 fabric combinations according to the thickness of the board, and cover the upper and lower sides with a piece of copper foil for superposition;
[0018] d. Molding temperature 170°C, unit pressure 40kgf / cm 2 , Vacuum degree -60mmHg, heat preservation and pressure holding for 60 minutes, made of FR-4 type copper clad laminate.
Embodiment 2
[0020] a. prepare CEM-3 core material glue, its component parts by weight are:
[0021] 100 parts of bisphenol A type epoxy resin, 3 parts of dicyandiamide, Al(OH) 3 40 copies,
[0022] 15 parts of nanometer calcium carbonate, 0.1 part of 2-methylimidazole,
[0023] Modulate the above materials with acetone / dimethylformamide to make a resin solution for the core material;
[0024] b. impregnate the above-mentioned core material glue with glass fiber paper, and make the core material after drying at 130-190°C;
[0025] c. Choose 1-20 pieces of core material according to the thickness of the board, stick a piece of fabric on each side, and cover a piece of copper foil on the upper and lower sides;
[0026] d. Molding temperature 170°C, unit pressure 40kgf / cm 2 , Vacuum degree -60mmHg, heat preservation and pressure holding for 60 minutes, made of CEM-3 type copper clad laminate.
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Abstract
The invention discloses a method for preparing a low-shrinkage-factor copper clad laminate by applying a nano-stuffing, which comprises the following process flows: adding a nano-powder stuffing on a system of FR-4/CEM-3, impregnating fiberglass cloth/fiberglass paper with a facing material and core material glue, and preparing the stuffing into a semi-solid state at a temperature of between 130 and 180 DEG C to prepare a facing material and a core material; superposing 1 to 20 sheets of the facing material according to the thickness requirement, and covering a copper foil on one side or both sides of the facing material to prepare an FR-4 sheet material; superposing 1 to 20 sheets of the core material, pasting the facing material on the upper surface and the lower surface of the core material, and covering a copper foil on one side or both sides of the core material to prepare a CEM-3 sheet material; and performing hot press molding on the combination of the FR-4/CEM-3 at a temperature of between 90 and 180 DEG C, at a pressure of between 10 and 60 Kg/cm, and at a vacuum degree of -60 mmHg. The FR-4/CEM-3 copper clad laminate prepared by the method obviously reduces the heat expansion coefficient, remarkably improves the dimensional stability, overcomes the defects that the FR-4/CEM-3 sheet material prepared by the prior art has large CTE and poor dimensional stability, is more adaptable to the production of PCB and the assembly technique of electronic products, and remarkably improves the reliability.
Description
technical field [0001] The invention discloses a method for reducing the coefficient of linear thermal expansion (CTE) and dimensional stability of a copper-clad laminate, specifically a method for preparing a low-shrinkage copper-clad laminate with nanofillers, which belongs to the technology of electronic products field. Background technique [0002] With the development of electronic products towards thinner and smaller, high performance and multi-functionality and the advancement of electronic assembly technology, printed circuit board products for electronic interconnection have gone through the through-hole technology (THT) stage, comprehensive Embarked on the surface mount technology (SMT) stage, and gradually moved to the chip scale package (CSP) stage. The process of soldering surface mount components (SMD) on a printed circuit board is to heat from room temperature at about 23°C to a soldering temperature of about 230-260°C for soldering, and then cool and solidif...
Claims
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
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Application Information
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