Emulsion for seal adhesive at normal temperature and preparation method thereof

A technology of adhesives and emulsions, applied in the direction of adhesive types, chemical instruments and methods, ester copolymer adhesives, etc., can solve the problem of not having too strong adhesive force on the back of the substrate, damaging the sealing strength, and prone to back problems. Stickiness and other problems, to achieve the effect of meeting various performance indicators, stable storage, and low initial viscosity

Inactive Publication Date: 2009-12-02
BEIJING COMENS YANSHAN TECH +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, in the use of the glue solution, it is required that the system can have good adhesion to the substrate, increase the adhesive strength of the system, and improve the sealing performance of the sealing part; it is also required that the glue solution system after coating film formation and drying should be stored at room temperature In this state, there should not be too strong adhesion to the back of the substrate, and there should be no large initial adhesion. If the initial adhesion is too high, the risk of back adhesion will easily occur during the process of gluing and winding, and the back adhesion will easily damage the seal. combined strength
These properties cannot be provided simply by relying on natural latex with high pressure sensitivity and cohesive strength. For example, it is required that the emulsion has high adhesion to the substrate, because natural latex has poor adhesion to organic substrates, so The key to the preparation of this type of adhesive is to produce an emulsion that can improve the adhesion of the glue system and is not prone to back-adhesion

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0036] This embodiment provides an emulsion for normal temperature sealing glue, which can be used to prepare normal temperature sealing glue, and specifically includes the following components (by weight percentage):

[0037] Styrene (St) and / or methyl methacrylate (MMA) 20-40%

[0038] Butyl Acrylate (BA) 5~15%

[0039] Methyl acrylate (MA) 10~30%

[0040] Adhesion promoting monomer 0.5~5%

[0041] Tackifying resin (accounting for the mass and proportion of all monomers in the system, that is, all organic phase monomer systems participating in polymerization) 1-10%

[0042] Emulsifier 0.5~2.5%

[0043] Initiator (persulfate) 0.5~2.0%

[0044] pH adjuster (ammonia water or ammonium hydroxide) 0.1~0.5%

[0045] Tert-butyl hydroperoxide 0.1~0.3%

[0046] Deionized water 40~60%

[0047] Buffer (sodium bicarbonate) 0.05~0.1%

[0048] The preparation method is as follows:

[0049]Pre-emulsification: Add tackifying resin to complete monomer system (styrene (St) and / or meth...

Embodiment 2

[0070] This example provides an emulsion for room temperature sealing glue, which is mainly used for preparing room temperature sealing glue. The ambient temperature of the preparation is relatively high, and the requirements for the glass transition temperature of the system are also correspondingly increased, which can increase the cohesive energy of the glue system and reduce the background temperature. The risk of stickiness, prepare a styrene-acrylic emulsion with a Tg greater than 70°C and good wet adhesion. The formula is as follows:

[0071] Table 1

[0072] components

Dosage (g)

components

Dosage

(g)

BA (butyl acrylate)

80

Emulsifier

18.5

MMA (methyl methacrylate)

820

APS (ammonium persulfate)

8

MA (methyl acrylate)

100

h 2 O (deionized water)

1150

QM-1558 (urea ring functional monomer)

12

Ammonia

10

tackifying resin

70

tert...

Embodiment 3

[0077] This example provides an emulsion for room temperature sealing glue, which is mainly used to prepare room temperature sealing glue. The ambient temperature is moderate, and the working environment temperature of the glue is not very high. The cohesive energy requirements of the system are low, and the risk of back sticking occurs. The glass transition temperature of the system can be appropriately increased, and the styrene-acrylic emulsion with better adhesion properties has a formula such as the components recorded in Table 2:

[0078] Table 2

[0079] components

[0080] The preparation method refers to Example 1 and Example 2, the glass transition temperature of the obtained emulsion is 47° C., and the solid content is 49%.

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PUM

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Abstract

The invention discloses an emulsion for seal adhesive at a normal temperature and a preparation method and an application thereof. The emulsion is composed of styrene or methyl methacrylate, butyl acrylate, methyl acrylate, adhesive force acceleration monomer, tackifying resin (specific gravity in the gross mass of all monomers of the system), emulsifier, initiator, pH value modifier, tert-butyl hydroperoxide, deionized water and buffer. Firstly, the tackifying resin is fully dissolved in the monomer, and the monomer dissolved with the tackifying resin is pre-emulsified; other components are preformed with dripping preparation by continuous dripping technology to obtain emulsion. The emulsion can be respectively prepared into two systems of styrene-acrylic emulsion and pure acrylic acid emulsion, and the synthetic emulsion has higher base material adhering property and low initial adhesive, and not only can ensure glue solution compounded by the emulsion has high stripping strength, but also can be stored at different environment temperatures without conglutination, so that the invention greatly satisfies each property index of a cold sealing adhesive system.

Description

technical field [0001] The invention relates to an emulsion and a preparation technology thereof, in particular to an emulsion used in a normal temperature sealing adhesive system and a preparation method thereof, in particular to a synthesis technology of an emulsion used in a cold sealing adhesive system. Background technique [0002] Normal temperature sealing adhesives are mainly used for systems that are not suitable for sealing in hot environments, such as chocolate in packaging sealing. The performance of the product determines that it cannot be carried out at a higher temperature. It is required that the adhesive sealing system can only be used at a certain temperature. , Sealing under pressure conditions. Therefore, in the use of the glue solution, it is required that the system can have good adhesion to the substrate, increase the adhesive strength of the system, and improve the sealing performance of the sealing part; it is also required that the glue solution sys...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J125/06C09J133/12C08F212/08C08F220/14C08F2/22C09K3/10C08F220/16
Inventor 李岗陈小锋沈峰邓煜东
Owner BEIJING COMENS YANSHAN TECH
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