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Preparation method of patternable thin polymer film in MEMS field
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A polymer film and patterning technology, applied in the process of producing decorative surface effects, gaseous chemical plating, manufacturing microstructure devices, etc., can solve the problem of poor bonding force between SU-8 adhesive film and substrate, poor selectivity, Remove difficulties and other problems to achieve the effect of good binding force, convenient operation and low cost
Inactive Publication Date: 2012-04-25
SHANGHAI JIAOTONG UNIV
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Summary
Abstract
Description
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Problems solved by technology
This method can only be coated on a large area, and then wet-etched on the reverse side, which has poor selectivity and is difficult to remove; and the SU-8 adhesive film has poor adhesion to the substrate and is easy to fall off.
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Embodiment 1
[0027] Embodiment 1: general patternable polymer film production method
[0028] This embodiment includes the following steps:
[0029] Step 1, after cleaning the prepared substrate, sputtering the bonding layer and the seed layer on the substrate in sequence;
[0030] The specific operating parameters of the sputtering are: background vacuum 2×10 -4 Pa; working pressure: 8×10 -1 Pa, power 600W, time 45min;
[0031] The bonding layer is Cr with a thickness of 700? ;
[0032] The seed layer is Cu with a thickness of 900? ;
[0033] Step 2, by throwing the photoresist and patterning it with a metal structure mask, and then leaving a patterned seed layer after developing;
[0034] The concrete operating parameter of described photoresist throwing is: 2000rpm / min;
[0036] Step 3, performing electroplating treatment on the seed layer to form a metal structure with a height of 10 μm;
[0037] The specific operating param...
Embodiment 2
[0046] Embodiment 2: Manufacturing method of metal / polymer composite cantilever beam
[0047] This embodiment includes the following steps:
[0048] Step 1, after cleaning the prepared substrate, sputtering the bonding layer and the seed layer on the substrate in sequence;
[0049] The specific operating parameters of the sputtering are: background vacuum 2×10 -4 Pa; working pressure: 8×10 -1 Pa, power 600W, time 30min;
[0050] The bonding layer is Cr with a thickness of 600? ;
[0051] The seed layer is Cu with a thickness of 800? .
[0052] Step 2, by throwing the photoresist and patterning it with a pedestal mask, and then leaving a patterned seed layer after developing;
[0053] The concrete operating parameter of described photoresist throwing is: 1000rpm / min;
[0054] The thickness of the photoresist is 30 μm.
[0055] Step 3, performing electroplating treatment on the seed layer to make a metal base;
[0056] The specific operating parameters of the electropl...
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Abstract
A preparation method of a patternable thin polymer film in the MEMS field comprises the steps of sputtering a binding layer and a metal seed layer on a foundation base and any patterned structure, dropping photo resist and photo-etching patterns to form a patterned metal seed layer after developing treatment, implementing electrophoresis treatment to produce a flexible polymer thin film through taking the metal seed layer as the negative electrode and inert metal as the positive electrode, removing a photo resistmask layer after primary solidification treatment, placing the foundation base with the flexible polymer thin film in an oven again to implement secondary solidification treatment, and finally getting the solidified polymer thin film structure. The patternable thin polymer film has the advantages of one-shot pattern forming, simple technology, convenient operation and low cost, has a good binding force with backing members and metal, and is adaptive to mass integrated manufacture.
Description
technical field [0001] The invention relates to a preparation method in the technical field of micro-electromechanical systems, in particular to a preparation method for a patternable polymer film used in the MEMS field. Background technique [0002] Micro-mechanical system (MEMS) processing is a means of manufacturing micro-sensors, micro-actuators, micro-structures and systems. The planar process in MEMS can be said to be a combination of thin-film preparation technology and lithography and etching technology. Surface micromachining usually involves depositing a large number of different thin films on the top of the substrate, followed by deposition, etching and patterning processes to obtain the desired microstructure. These thin films are usually used as masklayers, structural layers or sacrificial layers. Thin-film preparation technology occupies an important position in MEMS processing technology, and the mask layer, structural layer or sacrificial layer cannot be sep...
Claims
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Application Information
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