Heterogeneous metal connecting method for tungsten, copper and alloy thereof

A technology of dissimilar metals and connection methods, applied in metal processing equipment, welding equipment, non-electric welding equipment, etc., can solve the problems of complex preparation process and limited application, and achieve the effect of simple process operation, promoting full diffusion, and relieving residual stress.

Inactive Publication Date: 2010-05-12
XI AN JIAOTONG UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the preparation process of tungsten copper FGM materials i

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0018] This embodiment includes the following steps:

[0019] 1. Polish the surface of industrial pure tungsten to be connected with a size of 15mm×7mm×3mm to 1200# with metallographic sandpaper, and then perform ultrasonic cleaning with hydrofluoric acid with a weight concentration of 5% and acetone with a weight concentration of 5%. Ultrasonic cleaning frequency is 20KHz, each cleaning for 10 minutes, dried and set aside;

[0020] 2. Put the industrially pure tungsten polished and cleaned in step 1 into the electroplating solution, adjust the current and voltage for electroplating, and the current density is 5A / dm 2 , the electroplating time is 30 minutes, the thickness of the coating is controlled at 22 μm, and the temperature of the plating solution is maintained at 60 ° C;

[0021] 3. Polish the industrially pure tungsten surface after electroplating to 1200# with metallographic sandpaper, then ultrasonically clean it with acetone with a weight concentration of 5% for 15...

Embodiment 2

[0028] This embodiment includes the following steps:

[0029] 1. Polish the surface of industrial pure tungsten to be connected with a size of 15mm×6.5mm×3mm to 1000# with metallographic sandpaper, and then perform ultrasonic cleaning with hydrofluoric acid with a weight concentration of 10% and acetone with a weight concentration of 10% , the ultrasonic cleaning frequency is 25KHz, each cleaning is 20 minutes, dried and set aside;

[0030] 2. Put the industrially pure tungsten polished and cleaned in step 1 into the electroplating solution, adjust the current and voltage for electroplating, and the current density is 8A / dm 2 , the electroplating time is 25 minutes, the coating thickness is controlled at 15 μm, and the bath temperature is maintained at 65°C;

[0031] 3. Polish the surface of industrial pure tungsten after electroplating to 1000# with metallographic sandpaper, then ultrasonically clean it with acetone for 12 minutes, dry it, and set it aside;

[0032] 4. Grin...

Embodiment 3

[0038] This embodiment includes the following steps:

[0039] 1. Polish the surface of industrial pure tungsten to be connected with a size of φ10mm×3mm to 1500# with metallographic sandpaper, and then perform ultrasonic cleaning with 8% hydrofluoric acid and 8% acetone successively. The frequency of ultrasonic cleaning is Both are 30KHz, wash for 15 minutes each, dry and set aside;

[0040] 2. Put the industrially pure tungsten polished and cleaned in step 1 into the electroplating solution, adjust the current and voltage for electroplating, and the current density is 5A / dm 2 , the electroplating time is 25 minutes, the coating thickness is controlled at 18 μm, and the bath temperature is maintained at 70°C;

[0041] 3. Polish the surface of the industrially pure tungsten after electroplating to 1500# with metallographic sandpaper, then ultrasonically clean it with acetone with a weight concentration of 8% for 10 minutes, dry it, and set it aside;

[0042] 4. Grind the surfac...

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Abstract

The invention discloses a heterogeneous metal connecting method for tungsten, copper and alloy thereof, which comprises the following steps: firstly, processing the surface of tungsten metal and performing surface treatment; plating nickel to the tungsten metal, processing the surface of the tungsten metal, and cleaning the tungsten metal; then, processing and cleaning the copper alloy; and finally, overlapping and assembling the tungsten and the copper alloy to form weldment, and connecting the weldments in a vacuum chamber through pressure diffusion welding to form a connecting piece. The method has the remarkable characteristics that before vacuum diffusion welding connection for the tungsten and the copper, a layer of thin nickel is firstly electroplated on the surface of the tungsten metal, and then is subjected to vacuum diffusion welding with the copper alloy so as to implement diffusion connection of tungsten-copper heterogeneous metals. The method has the advantages of simple and convenient process operation, low cost and good connecting effect, and develops a new path for the connection of the tungsten-copper heterogeneous metals; and the shearing strength can reach 50 to 80 percent of a tungsten base material.

Description

technical field [0001] The invention relates to a connection method between dissimilar metals in the technical field of material processing, in particular to a method for connecting dissimilar metals of tungsten, copper and alloys thereof. Background technique [0002] Tungsten (W) is often selected as a high-temperature resistant material due to its high melting point and good corrosion resistance; as a heat-resistant material, tungsten has special applications in aerospace, energy and electronics, such as the lining of fuel nozzles, Anodes of vacuum electronic devices, etc.; Cu and its alloys are often selected as heat dissipation materials due to their high thermal conductivity (400W / mK). Connecting with tungsten can achieve enhanced heat dissipation. For this reason, the connection of tungsten and copper and its alloys is the preferred composite structure for plasma components. Due to the difference in mechanical and physical properties between tungsten and copper, esp...

Claims

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Application Information

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IPC IPC(8): B23K20/00B23K20/24C25D5/28C25D5/38C25D3/12
Inventor 杨建锋李军陈俊凌乔冠军鲍崇高李春芳
Owner XI AN JIAOTONG UNIV
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