MEMS pressure sensor and manufacturing method thereof
A pressure sensor and sensor housing technology, applied in the sensor field, can solve the problems of high cost, large volume and weight, low precision, etc., and achieve the effects of low cost, simple manufacturing process, stable and reliable performance
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[0029] The present invention is described in detail below in conjunction with accompanying drawing and embodiment:
[0030] Such as image 3 , Figure 4 , Figure 5 , Figure 6 and Figure 7 The shown MEMS pressure sensor includes a MEMS pressure sensing chip, and the MEMS pressure sensing chip is a Wheatstone bridge composed of four polysilicon resistors 18 arranged on the [110] crystal direction of a single crystal silicon film 19. The silicon thin film 19 is composed of a lower silicon wafer 20, an upper silicon wafer 21 and a purification layer 22. A cavity 23 is arranged on the lower silicon wafer 20, and the lower silicon wafer 20 and the upper silicon wafer 21 pass through hot-melt silicon- The silicon is bonded together, the passivation layer 22 is set on the surface of the upper silicon wafer 21, the polysilicon resistor 18 is set on the upper silicon wafer 21 by a diffusion process, and the metal thin film wire 24 and the pressure layer are etched on the upper si...
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