MEMS pressure sensor and manufacturing method thereof

A pressure sensor and sensor housing technology, applied in the sensor field, can solve the problems of high cost, large volume and weight, low precision, etc., and achieve the effects of low cost, simple manufacturing process, stable and reliable performance
CN101738280AInactive Publication Date: 2010-06-16HENAN POLYTECHNIC UNIV

Patent Information

Authority / Receiving Office
CN · China
Current Assignee / Owner
HENAN POLYTECHNIC UNIV
Publication Date
2010-06-16
Estimated Expiration
Not applicable · inactive patent

Smart Images

  • Figure 1
    Figure 1
  • Figure 2
    Figure 2
  • Figure 3
    Figure 3
Patent Text Reader

Abstract

The invention discloses an MEMS pressure sensor and a manufacturing method thereof. The MEMS pressure sensor comprises an MEMS pressure sensing chip, wherein the MEMS pressure sensing chip is arranged at a Wheatstone bridge formed on the crystallographic orientation of a monocrystalline silicon film (110) by four polycrystalline silicon resistors, the monocrystalline silicon film comprises a lower silicon wafer, an upper silicon wafer and a purification layer, a cavity body is arranged on the lower silicon wafer, the lower silicon wafer and the upper silicon wafer are bonded together by hot melt silicon-silicon, the surface of the upper silicon wafer is provided with a passivation layer, the polycrystalline silicon resistors are arranged on the upper silicon wafer by a diffusion process, and a conducting wire of a metal film and a press welding block are etched on the upper silicon wafer. The pressure sensor adopting a silicon-silicon bonding structure can be made in a very small size, the number of chips on each silicon wafer can be increased by 50% or more, the silicon-silicon bonding strength is higher, and the air tightness is better. The cost of the sensor is greatly lowered, and the performance is more stable and reliable. The sensor belongs to a pressure sensor with low cost and high performance and has very extensive application.
Need to check novelty before this filing date? Find Prior Art

Description

technical field

[0001] The invention relates to a sensor, in particular to a pressure sensor using micro-electromechanical system (MEMS) technology, and also to a manufacturing method of the sensor chip. Background technique

[0002] Pressure sensors are used in a wide range of applications, including petrochemical, hydraulic, food, medicine, machinery, metallurgy, mining, electrical appliances, and medical instruments, etc., in almost every industry.

[0003] The engines of various diesel locomotives and the steam turbines of electric power units are lubricated by engine oil. Once the oil pressure is too low, dry friction will occur due to lack of oil, resulting in severe wear and heating, which may damage the engine or steam turbine and affect the diesel locomotive or The normal operation of the steam turbine, so the oil pressure is one of the important parameters of the engine or steam turbine. For cars, it is necessary to install an oil pressure gauge on the engine of t...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More