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MEMS pressure sensor and manufacturing method thereof

A pressure sensor and sensor housing technology, applied in the sensor field, can solve the problems of high cost, large volume and weight, low precision, etc., and achieve the effects of low cost, simple manufacturing process, stable and reliable performance

Inactive Publication Date: 2010-06-16
HENAN POLYTECHNIC UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

There are many kinds of pressure sensors currently used in automobiles, generally including a signal conditioning circuit board, a pressure sensitive diaphragm is set on the signal conditioning circuit board, the diaphragm directly bears the pressure of the engine oil, and then transmits the pressure signal of the engine oil to the signal The conditioning circuit board is processed by the signal conditioning circuit board into an electrical signal output, but the pressure sensitive diaphragm of the above structure is generally a thick film pressure sensitive diaphragm processed by machining, which is often large in size and weight, high in cost and low in accuracy. , they are very limited in application in power units and automobiles

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  • MEMS pressure sensor and manufacturing method thereof
  • MEMS pressure sensor and manufacturing method thereof
  • MEMS pressure sensor and manufacturing method thereof

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Embodiment Construction

[0029] The present invention is described in detail below in conjunction with accompanying drawing and embodiment:

[0030] Such as image 3 , Figure 4 , Figure 5 , Figure 6 and Figure 7 The shown MEMS pressure sensor includes a MEMS pressure sensing chip, and the MEMS pressure sensing chip is a Wheatstone bridge composed of four polysilicon resistors 18 arranged on the [110] crystal direction of a single crystal silicon film 19. The silicon thin film 19 is composed of a lower silicon wafer 20, an upper silicon wafer 21 and a purification layer 22. A cavity 23 is arranged on the lower silicon wafer 20, and the lower silicon wafer 20 and the upper silicon wafer 21 pass through hot-melt silicon- The silicon is bonded together, the passivation layer 22 is set on the surface of the upper silicon wafer 21, the polysilicon resistor 18 is set on the upper silicon wafer 21 by a diffusion process, and the metal thin film wire 24 and the pressure layer are etched on the upper si...

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Abstract

The invention discloses an MEMS pressure sensor and a manufacturing method thereof. The MEMS pressure sensor comprises an MEMS pressure sensing chip, wherein the MEMS pressure sensing chip is arranged at a Wheatstone bridge formed on the crystallographic orientation of a monocrystalline silicon film (110) by four polycrystalline silicon resistors, the monocrystalline silicon film comprises a lower silicon wafer, an upper silicon wafer and a purification layer, a cavity body is arranged on the lower silicon wafer, the lower silicon wafer and the upper silicon wafer are bonded together by hot melt silicon-silicon, the surface of the upper silicon wafer is provided with a passivation layer, the polycrystalline silicon resistors are arranged on the upper silicon wafer by a diffusion process, and a conducting wire of a metal film and a press welding block are etched on the upper silicon wafer. The pressure sensor adopting a silicon-silicon bonding structure can be made in a very small size, the number of chips on each silicon wafer can be increased by 50% or more, the silicon-silicon bonding strength is higher, and the air tightness is better. The cost of the sensor is greatly lowered, and the performance is more stable and reliable. The sensor belongs to a pressure sensor with low cost and high performance and has very extensive application.

Description

technical field [0001] The invention relates to a sensor, in particular to a pressure sensor using micro-electromechanical system (MEMS) technology, and also to a manufacturing method of the sensor chip. Background technique [0002] Pressure sensors are used in a wide range of applications, including petrochemical, hydraulic, food, medicine, machinery, metallurgy, mining, electrical appliances, and medical instruments, etc., in almost every industry. [0003] The engines of various diesel locomotives and the steam turbines of electric power units are lubricated by engine oil. Once the oil pressure is too low, dry friction will occur due to lack of oil, resulting in severe wear and heating, which may damage the engine or steam turbine and affect the diesel locomotive or The normal operation of the steam turbine, so the oil pressure is one of the important parameters of the engine or steam turbine. For cars, it is necessary to install an oil pressure gauge on the engine of t...

Claims

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Application Information

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IPC IPC(8): G01L9/04B81B7/00B81B7/02B81C3/00B81C1/00
Inventor 关荣锋田大垒赵文卿王杏
Owner HENAN POLYTECHNIC UNIV
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