Adhesive combination, covering film and flexible circuit board
A composition and adhesive technology, applied in the direction of adhesives, polyether adhesives, adhesive types, etc., can solve the problem of low dielectric constant, low dielectric loss, high temperature resistance, high flexibility and high electrical performance and other issues to achieve low dielectric constant and dielectric loss, low dielectric loss, and avoid low flexibility
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Embodiment 1
[0045] This example is used to illustrate the adhesive composition and its preparation method according to the present invention.
[0046] Add 10 parts by weight of polyphenylene ether with epoxy functional group at the end with a number average molecular weight of 3600 (manufacturer: GE in the United States, epoxy value 0.056mol / 100g) to 15 parts by weight of N,N-dimethyl ethyl In the mixed solvent of amide and methyl ethyl ketone (weight ratio 1:1), stir to dissolve the polyphenylene ether with epoxy functional group at the end; then add 50 parts by weight of bisphenol A epoxy resin (manufacturer: Jinan Ring Oxygen resin factory, brand E-20), 30 parts by weight of phenolic epoxy resin (manufacturer: Dow Chemical, brand: DEN.431) and 40 parts by weight of carboxy-terminated nitrile rubber with a number average molecular weight of 3400 (production Manufacturer: Shenzhen Jiadida Chemical Co., Ltd.), stirring at 120°C for 12 hours.
[0047] In addition, 10 parts by weight of magnesi...
Embodiment 2
[0050] This example is used to illustrate the adhesive composition and its preparation method according to the present invention.
[0051] Add 25 parts by weight of polyphenylene ether with an epoxy functional group at the end with a number average molecular weight of 2000 (manufacturer: GE in the United States, with an epoxy value of 0.1 mol / 100g) added to 25 parts by weight of N,N-dimethyl ethyl In the mixed solvent of amide and methyl ethyl ketone (weight ratio 1:0.5), stir to dissolve the polyphenylene ether with epoxy functional group at the end; then add 40 parts by weight of bisphenol A epoxy resin (manufacturer: Jinan Ring Oxygen resin factory, brand E-55), 20 parts by weight of phenolic epoxy resin (manufacturer: Jinan Epoxy Resin Factory, brand: F-44) and 50 parts by weight of amino-terminated butyronitrile with a number average molecular weight of 2500 Rubber (manufacturer: American Nuoyi Chemical), stirred at 120°C for 12 hours.
[0052] In addition, 20 parts by weight...
Embodiment 3
[0055] This example is used to illustrate the adhesive composition and its preparation method according to the present invention.
[0056] Add 20 parts by weight of a modified polyphenylene ether with an epoxy functional group at the end with a number average molecular weight of 5000 (manufacturer: GE in the United States, with an epoxy value of 0.04mol / 100g) added to 40 parts by weight of N,N-dimethyl In the mixed solvent of methyl acetamide and methyl ethyl ketone (weight ratio 1:2), stir to dissolve the polyphenylene ether with epoxy functional group at the end; then add 53 parts by weight of bisphenol A epoxy resin (manufacturer: Jinan Epoxy Resin Factory, grade E-56), 26 parts by weight of phenolic epoxy resin (manufacturer: Jinan Epoxy Resin Factory, grade: F-46) and 15 parts by weight of terminal vinyl group with a number average molecular weight of 5000 Nitrile rubber (manufacturer: Noi Chemicals, USA), stir at 120°C for 12 hours.
[0057] In addition, 20 parts by weight o...
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