Adhesive combination, covering film and flexible circuit board

A composition and adhesive technology, applied in the direction of adhesives, polyether adhesives, adhesive types, etc., can solve the problem of low dielectric constant, low dielectric loss, high temperature resistance, high flexibility and high electrical performance and other issues to achieve low dielectric constant and dielectric loss, low dielectric loss, and avoid low flexibility

Active Publication Date: 2010-06-23
BYD CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0011] The purpose of the present invention is to overcome the defects that existing adhesives cannot possess high temperature resistance, high flexibility and high electrical performance at the same time, and provide a kind of adhesive with high temperature resistance and

Method used

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  • Adhesive combination, covering film and flexible circuit board
  • Adhesive combination, covering film and flexible circuit board
  • Adhesive combination, covering film and flexible circuit board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0045] This example is used to illustrate the adhesive composition and its preparation method according to the present invention.

[0046] Add 10 parts by weight of polyphenylene ether with epoxy functional group at the end with a number average molecular weight of 3600 (manufacturer: GE in the United States, epoxy value 0.056mol / 100g) to 15 parts by weight of N,N-dimethyl ethyl In the mixed solvent of amide and methyl ethyl ketone (weight ratio 1:1), stir to dissolve the polyphenylene ether with epoxy functional group at the end; then add 50 parts by weight of bisphenol A epoxy resin (manufacturer: Jinan Ring Oxygen resin factory, brand E-20), 30 parts by weight of phenolic epoxy resin (manufacturer: Dow Chemical, brand: DEN.431) and 40 parts by weight of carboxy-terminated nitrile rubber with a number average molecular weight of 3400 (production Manufacturer: Shenzhen Jiadida Chemical Co., Ltd.), stirring at 120°C for 12 hours.

[0047] In addition, 10 parts by weight of magnesi...

Embodiment 2

[0050] This example is used to illustrate the adhesive composition and its preparation method according to the present invention.

[0051] Add 25 parts by weight of polyphenylene ether with an epoxy functional group at the end with a number average molecular weight of 2000 (manufacturer: GE in the United States, with an epoxy value of 0.1 mol / 100g) added to 25 parts by weight of N,N-dimethyl ethyl In the mixed solvent of amide and methyl ethyl ketone (weight ratio 1:0.5), stir to dissolve the polyphenylene ether with epoxy functional group at the end; then add 40 parts by weight of bisphenol A epoxy resin (manufacturer: Jinan Ring Oxygen resin factory, brand E-55), 20 parts by weight of phenolic epoxy resin (manufacturer: Jinan Epoxy Resin Factory, brand: F-44) and 50 parts by weight of amino-terminated butyronitrile with a number average molecular weight of 2500 Rubber (manufacturer: American Nuoyi Chemical), stirred at 120°C for 12 hours.

[0052] In addition, 20 parts by weight...

Embodiment 3

[0055] This example is used to illustrate the adhesive composition and its preparation method according to the present invention.

[0056] Add 20 parts by weight of a modified polyphenylene ether with an epoxy functional group at the end with a number average molecular weight of 5000 (manufacturer: GE in the United States, with an epoxy value of 0.04mol / 100g) added to 40 parts by weight of N,N-dimethyl In the mixed solvent of methyl acetamide and methyl ethyl ketone (weight ratio 1:2), stir to dissolve the polyphenylene ether with epoxy functional group at the end; then add 53 parts by weight of bisphenol A epoxy resin (manufacturer: Jinan Epoxy Resin Factory, grade E-56), 26 parts by weight of phenolic epoxy resin (manufacturer: Jinan Epoxy Resin Factory, grade: F-46) and 15 parts by weight of terminal vinyl group with a number average molecular weight of 5000 Nitrile rubber (manufacturer: Noi Chemicals, USA), stir at 120°C for 12 hours.

[0057] In addition, 20 parts by weight o...

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Abstract

The invention provides an adhesive combination. The adhesive combination contains thermoplastic resin, thermosetting resin and a firming agent, wherein the thermosetting resin contains polyphenyl ether with epoxy functional groups at the end, perfluor styrene-methacrylic acid epoxy propyl ester copolymer, bisphenol A epoxy resin and phenolic aldehyde epoxy resin. The invention further provides a flexible circuit board and a covering film which comprises the adhesive combination. The peeling strength of the provided flexible circuit board is from 12 to 16N/cm, the dielectric constant is from 1.4 to 1.8, the dielectric loss is from 0.0013 to 0.0017, the rotating speed is 300 r/m under the working environment (50 DEG C), the flexibility is 180 DEG, the flexible circuit board can be bent more than 12 million number of times, the flame retardance reaches UL to 94V0, and the GTT (glass-transition temperature) of an adhesive is from 200 to 220 DEG C.

Description

Technical field [0001] The invention relates to an adhesive composition and a cover film and a flexible circuit board comprising the adhesive composition. Background technique [0002] In recent years, the rapid development of the information and communication industries has driven the rapid development of the microelectronics industry, and the requirements for flexible circuit boards have become higher and higher. Flexible circuit boards are made of flexible insulating substrates, and have many advantages that rigid circuit boards do not have. For example, they can be bent, wound and folded freely, and can be arranged according to the requirements of the space layout and moved in three-dimensional space. Stretching, so as to achieve the integration of component assembly and wire connection. The base material used in the flexible circuit board is mainly polyimide copper clad laminate, and the polyimide copper clad laminate and the cover film with both mechanical protection and g...

Claims

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Application Information

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IPC IPC(8): C09J163/02C09J163/04C09J171/12C09J125/18H05K3/28
Inventor 唐富兰陶潜胡娟姚云江
Owner BYD CO LTD
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