Solvent type aeolotropic nano conductive adhesive and manufacturing method thereof

An anisotropic, nano-conductive technology, applied in the direction of adhesive types, conductive adhesives, adhesives, etc., can solve the problems of complex reaction conditions, long reaction time, low yield, etc., and achieve simple preparation, uniform particles, loading The effect of stream improvement

Inactive Publication Date: 2010-06-30
漳立冰
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

These techniques have complex reaction conditions, long reaction time (generally need several hours to several days), and shortcomings such as low yield (milligram level)
The

Method used

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  • Solvent type aeolotropic nano conductive adhesive and manufacturing method thereof
  • Solvent type aeolotropic nano conductive adhesive and manufacturing method thereof
  • Solvent type aeolotropic nano conductive adhesive and manufacturing method thereof

Examples

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preparation example Construction

[0044] 2. Preparation of anisotropic conductive adhesive:

[0045] The above-mentioned high-concentration conductive particle solution is mixed with a polymer material and a solvent. Among them, the polymer material is polyester, polyurethane, epoxy resin, etc.; the solvent is a polar solvent compatible with ethylene glycol, including water, ethanol, acetone, and dimethylformamide (DMF); the mass ratio of each substance It is: 0.5-5% of conductive particles, 15-45% of polymer materials, and 50-80% of solvents.

[0046] The anisotropic conductive adhesive of the present invention is a solvent type, which is a mixture of conductive fillers and insulating adhesive polymers, and does not form anisotropic conduction before the process is implemented. It can be used in various ways, such as printing method (printing), dispensing method or coating step method.

[0047] Compared with traditional composite conductive particles, such as nickel-plated gold or silver-coated particles (s...

Embodiment 1

[0069] 1 kg of silver nitrate (AgNO 3 ), 1L ethylene glycol solution and 0.2kg of polyvinylpyrrolidone (PVP) are mixed evenly and then poured into the mixing kettle, and then 20g of sodium chloride solution is poured into the above-mentioned mixed solution and stirred, and after uniform mixing, the solution is placed in an industrial Heating in a microwave oven under 800W power for 10 minutes, a reaction takes place to obtain a dispersion of silver conductive particles (600 nm) with a uniform particle size, and the concentration is 27%. 10 grams of the above dispersion liquid and 100 grams of polyurethane solution Solucote 334 (35% in DMF) were uniformly mixed at a mass ratio of 1:10 to obtain an anisotropic conductive adhesive. Here, the mass ratio of the substances in the conductive adhesive is: 2.5% for conductive particles, 31.8% for polymer materials, and 65.7% for solvents.

Embodiment 2

[0071] 1.5kg silver nitrate (AgNO 3 ), 3L ethylene glycol solution and 2kg of polyvinylpyrrolidone (PVP) are mixed evenly and then poured into the mixing kettle, and then 100g of sodium chloride solution is poured into the above mixture and stirred, and after uniform mixing, the solution is placed in an industrial microwave oven Internally heated at 1200W for 13 minutes, a reaction occurred to obtain a dispersion of silver conductive particles (200 nm) with a uniform particle size, and the concentration was 14%. The dispersion liquid was uniformly mixed with a 35% epoxy resin solution Eponol 53-BH-35 at a mass ratio of 1:8 to obtain an anisotropic conductive adhesive. Here, the mass ratio of each material of the conductive adhesive is: 1.6% of conductive particles, 33.3% of polymer materials, and 65.1% of solvent.

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Abstract

The invention provides a solvent type aeolotropic nano conductive adhesive, which is a uniform mixture of 10 to 1,000 nanometer silver nano particles, a polymer material and a polar solvent. The solvent type aeolotropic nano conductive adhesive has uniform conducting particles; compared with compound particles which only have surface conductivity, the silver nano-particles have overall conductivity and a heavier carrier current. The invention also provides a method for manufacturing the solvent type aeolotropic nano conductive adhesive, which comprises the steps of: firstly, preparing high-concentration silver nano dispersion by using a microwave aided method; and secondly, mixing the dispersion and high polymer to prepare the high-performance aeolotropic nano conductive adhesive. The conductive adhesive contains the uniform particles and the preparation method is simple, so the conductive adhesive is particularly suitable for packaging of fine circuits with a diameter of less than 5 micrometers and chips.

Description

technical field [0001] The invention discloses a solvent-type anisotropic conductive adhesive and a preparation method thereof. The conductive particles of the adhesive are submicron to nanometer, and the Z-axis vertical conduction is formed by a hot pressing method. Background technique [0002] Anisotropic conductive adhesive is a special conductive adhesive that only conducts electricity in the z-axis direction, but has a large resistance or almost no conductivity in the x-y plane. A short circuit between lines will occur. At the same time, since the use of lead-containing solder paste materials is banned in Europe and other regions, anisotropic conductive adhesives have been widely used in recent years. Anisotropic conductive adhesive can be used in touch screen, printed circuit, flip chip (Flip chip), liquid crystal display (LCD), radio frequency identification (RFID), membrane switch, electroluminescence (EL) and backlight (Backlight) connection and other fields . T...

Claims

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Application Information

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IPC IPC(8): C09J9/02C09J167/00C09J175/04C09J163/00C09J11/04B22F9/24
Inventor 漳立冰葛明圆常振宇姜清奎
Owner 漳立冰
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