Resin solution for producing copper-clad plate

Abstract

The invention relates to resin solution for producing a copper-clad plate. The resin solution consists of the following components in part by weight: 100 parts of phosphoric epoxy resin, 6 to 8 parts of phenolic resin curing agent, 20 to 40 parts of solvent, 5 to 15 parts of silicon dioxide, 2.0 to 5.0 parts of aluminum hydroxide, 2.0 to 5.0 parts of magnesium hydroxide and 1.0 to 1.5 parts of modified barium carbonate. Due to the adoption of the phosphoric epoxy resin, the manufactured copper-clad plate is suitable for lead-free solders, and the phosphoric epoxy resin can replace the bromine-containing epoxy resin in the prior art so as to meet the requirement of flame retardancy and eliminate the problem of environmental protection; and due to the adoption of a multi-component compound filler, the copper-clad plate produced by using the resin solution has good hardness, good electric insulation property, deformation resistance at a high temperature and excellent integral performance.

Description

(1) Technical field [0001] The invention relates to a resin solution used in the production of copper clad laminates. (2) Background technology [0002] Copper-clad laminate is a plate-shaped material made of one or both sides covered with a layer of copper foil and hot-pressed on an insulating substrate. Its only purpose is to manufacture printed circuit boards, and printed circuit boards are electronic devices that are inseparable from any electronic machine and components. They are used to install electronic components and realize interconnection or insulation between components. From aerospace, telemetry, remote control, to computers, mobile phones, various home appliances, children's electronic toys, etc., which are inseparable from daily life, printed circuit boards and CCL. [0003] Copper clad laminates are usually composed of three types of materials: resin, reinforcing materials (such as glass fiber cloth, glass fiber paper, fiber paper, etc.), and copper foil. ...

AI Technical Summary

Problems solved by technology

[0004] In the prior art, the resin solution for the production of copper-clad laminates mostly uses bromine-containing epoxy resins to meet the flame-retardant requirements. However, when using halogen-based flame retardants, people find that it has serious problems: it will seriously reduce the flame-retardant substrate. Anti-ultraviolet stability, producing more smoke, corrosive gas and toxic gas when burning

This is related to its flame retardant mechanism. Halogenated flame retardants generate hydrogen halides when they are thermally decomposed. Gas, which is denser than air, forms a barrier on the surface of polymer materials to reduce the concentration of combustible gases, but the amount of smoke is large, and hydrogen halide is corrosive, causing secondary hazards

In addition, it has been found that the thermal cracking and combustion products of polybrominated diphenyl ethers and their flame-retardant polymers contain toxic carcinogens polybrominated dibenzodioxane and polybrominated dibenzofuran

[0005] In addition, because the existing resin solution does not add suitable fillers, the expansion coefficient of the resin is greater than that of glass cloth and copper foil, and because the expansion coefficient of glass cloth is greater than that of copper foil, the copper clad laminate is prone to warping at high temperatures, which affects normal use.