Normal temperature dipping-type epoxy anhydride heat-resistant resin as well as preparation method and application thereof
A technology of epoxy anhydride and heat-resistant resin, which is applied in the direction of epoxy resin coating, plastic/resin/wax insulator, coil manufacturing, etc. It can solve the problems of poor insulation performance of products, achieve low VOC content, save energy, and reduce thickness Effect of Coil Insulation Thickness
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Embodiment 1
[0035] Example 1 Preparation of normal temperature impregnated epoxy anhydride heat-resistant resin
[0036] The composition of normal temperature impregnated epoxy anhydride heat-resistant resin is as follows:
[0037]
[0038] Among them, component A is prepared by the following method: add 90 kg of JF9955A molecularly distilled bisphenol A epoxy resin and 10 kg of neopentyl glycol diglycidyl ether into a 40°C reactor for stirring, vacuum dehumidify for 0.5h, and stir the materials Uniform, filtered, airtight packaging is the first component.
[0039] Component B is prepared from methyl hexahydrophthalic anhydride by the following method: Add 110 kg of methyl hexahydrophthalic anhydride into the reaction kettle and stir evenly, vacuum dehumidify for 0.5h, filter, and seal The packaging is the B component.
[0040] The transportation and storage method of components A and B, this method is suitable for vacuum pressure impregnation heat-resistant impregnation resin at roo...
Embodiment 2
[0042] Example 2 Preparation of normal temperature impregnated epoxy anhydride heat-resistant resin
[0043]
[0044] Among them, component A is prepared by the following method: 80 kg of JF9955A molecularly distilled bisphenol A epoxy resin and 20 kg of neopentyl glycol diglycidyl ether are added to a 50°C reactor for stirring, vacuum dehumidification for 0.5h, and the materials are stirred Uniform, filtered, airtight packaging is the first component.
[0045] Component B is prepared from methyl hexahydrophthalic anhydride by the following method: Add 90 kg of methyl hexahydrophthalic anhydride into the reaction kettle and stir evenly, vacuum dehumidify for 0.5h, filter, and seal The packaging is the B component.
[0046] Other preparation methods are similar to Example 1.
Embodiment 3
[0047] Example 3 Preparation of normal temperature impregnated epoxy anhydride heat-resistant resin
[0048]
[0049] Among them, component A is prepared by the following method: 85 kg of JF9955A molecularly distilled bisphenol A epoxy resin and 15 kg of cyclohexanediol diglycidyl ether are added to a 50°C reactor for stirring, vacuum dehumidification for 0.5h, and the materials are stirred Uniform, filtered, airtight packaging is the first component.
[0050] Component B is prepared from methyl hexahydrophthalic anhydride by the following method: add 120 kg of methyl nadic anhydride into the reaction kettle and stir evenly, vacuum dehumidify for 0.5h, filter, and seal the package to obtain B component. components.
[0051] Other preparation methods are similar to Example 1.
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