Laser machining device

Abstract

A laser machining device enabling a reduction in installation space and rotation of a substrate by using a fixed table without using a table rotating mechanism. A laser machining device comprises a positionally fixed table (40) whose substrate mounting surface is formed by a porous member and which is provided with a suction mechanism for holding a substrate by suction via the porous member and alevitation mechanism for levitating the substrate by spraying gas thereto via the porous member, a laser source (10), a laser beam scanning optical system (20) for shaping a laser beam emitted from the laser source into a laser beam with an elliptical cross-section and leading the shaped laser beam to a machining surface of the substrate to scan the machining surface, and a substrate guiding mechanism (50) for, when the substrate mounted on the table is positioned or moved, guiding the substrate by a movable abutting portion which moves the substrate by pushing a substrate side surface in thedirection horizontal to the table surface while abutting on the substrate side surface of the levitated substrate. The laser machining device moves and rotates the substrate to a desired position by pushing the substrate side surface by the substrate guiding mechanism while levitating the substrate.

Description

technical field [0001] The invention relates to a laser processing device for processing a substrate to be processed by scanning a laser beam. [0002] Laser processing in the present invention includes laser scribing processing of brittle materials such as glass substrates, sintered ceramics, single crystal silicon, semiconductor wafers, ceramic substrates, etc., using thermal stress generated when laser heating is performed at a temperature below the softening point, And laser ablation processing that heats materials other than brittle materials at a temperature above the melting temperature. Background technique [0003] A scanning laser processing apparatus that performs processing by relatively moving an irradiation position of a laser beam with respect to a substrate to be processed has been used for processing a brittle material substrate such as a glass substrate. [0004] In this laser processing device, in order to achieve the purpose of reducing the processing wi...

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Problems solved by technology

[0038] However, in the case of using an elliptical beam spot to process a glass substrate, semiconductor wafer, etc. (assuming that the processing directions of the substrate are the X direction and the Y direction) into a square shape, it is necessary to change the orientation of the long axis direction of the beam spot from the X direction of the substrate. The direction is changed to the Y direction of the substrate, so any long-axis adjustment mechanism that rotates the long axis of the laser beam must be mounted, and not only the laser optical system becomes complicated, but also the long-axis adjustment mechanism needs to be aligned with the laser light source and the laser beam by using a translation mechanism. Moves together with the ellipse-shaping laser optics

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