Peel-able ultra-thin copper foil using copper foil as carrier and preparation method thereof

A technology of ultra-thin copper foil and copper foil carrier, applied in electrolysis process, electroforming and other directions, can solve the problems of increased adhesive strength, highly toxic chromium, inability to mass-produce, etc., and achieves less defects and surface roughness. Low, glossy and clean finish
CN101892499AInactive Publication Date: 2010-11-24JIANGXI UNIV OF SCI & TECH +1
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Patent Information

Authority / Receiving Office
CN · China
Current Assignee / Owner
JIANGXI UNIV OF SCI & TECH
Publication Date
2010-11-24
Estimated Expiration
Not applicable · inactive patent

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Abstract

The invention relates to a preparation technique for manufacturing an ultra-thin copper foil of printed circuit board, in particular to a peel-able ultra-thin copper foil using a copper foil as a carrier and a preparation method thereof. The carrier of the peel-able ultra-thin copper foil is 35-micron copper foil, and a peel-able layer consists of an organic layer and an alloy layer, wherein the organic layer is a nitrogenous compound, and the alloy layer consists of a tungsten-nickel binary alloy. A 1 to 5-micron ultra-thin copper foil prepared by the method can be peeled off from a support carrier after inactivation and heating processing, has moderate peeling strength, and avoids a phenomenon that the ultra-thin copper foil can be partially or wholly separated from the carrier in the process of preparing and using a composite foil; after peeling, the ultra-thin copper foil cannot be kept on a carrier foil, and the carrier foil also cannot be kept on the ultra-thin copper foil; and the ultra-thin copper foil has a bright and clean surface and is suitable for manufacturing a high-density printed circuit board.
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Description

technical field

[0001] The invention relates to a preparation technology for manufacturing ultra-thin copper foil of a printed circuit board, in particular to a peelable ultra-thin copper foil with copper foil as a carrier and a preparation method thereof. Background technique

[0002] With the continuous development of electronic products in the direction of miniaturization and multi-function, the development of printed boards in the direction of multi-layer, high integration and high density is promoted, and the line width and spacing of printed circuit graphics are becoming more and more Development in the direction of miniaturization. Therefore, higher requirements are put forward for the reliability of circuit boards. For example, the thinned copper foil used in fine circuits has higher peelability and can effectively reduce or avoid the "side erosion" phenomenon that occurs when etching circuits. Therefore, the peelable ultra-thin copper foil will be widely used in hi...

Claims

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