Peel-able ultra-thin copper foil using copper foil as carrier and preparation method thereof

A technology of ultra-thin copper foil and copper foil carrier, applied in electrolysis process, electroforming and other directions, can solve the problems of increased adhesive strength, highly toxic chromium, inability to mass-produce, etc., and achieves less defects and surface roughness. Low, glossy and clean finish

Inactive Publication Date: 2010-11-24
JIANGXI UNIV OF SCI & TECH +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

It was found that when the organic matter is used as the peeling layer, the peeling strength is too small, which will cause the ultra-thin copper foil to be partially or completely detached from the carrier during the process of preparing and using the composite foil; Too much strength, when the composite foil is laminated on the substrate (such as PP board) at high temperature, due to the penetration of the peeling layer into the carrier foil and ultra-thin copper foil layer, the adhesive strength increases, resulting in the use of some peeling layers The composite foil is difficult

Method used

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  • Peel-able ultra-thin copper foil using copper foil as carrier and preparation method thereof
  • Peel-able ultra-thin copper foil using copper foil as carrier and preparation method thereof
  • Peel-able ultra-thin copper foil using copper foil as carrier and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0060] An electrodeposited copper foil having a thickness of 35 µm was prepared as a metal carrier foil. These copper foils generally have a rough side (ie, a matte side) and a smooth side (ie, a shiny side). Then, an organic layer is formed on the bright side of the carrier foil, and then an alloy layer is electroplated on the organic layer, followed by the first electrodeposition of copper, the second electrodeposition of copper, the third electrodeposition of copper and passivation treatment , the stirring method used in the experiment was magnetic particle stirring. Proceed using the following procedure:

[0061] A. Forming an organic layer

[0062] A 35 micron thick copper foil was immersed in an aqueous solution containing 6 g / L benzotriazole (BTA) at room temperature for 30 seconds to form an organic layer of BTA, which was taken out and rinsed in deionized water for 6S.

[0063] B. Formation of alloy layer

[0064] Immerse the rinsed carrier foil with the BTA organ...

Embodiment 2

[0077] The carrier-supported ultra-thin copper foil was prepared in the same manner as in Example 1, except that nickel sulfate was 25 g / L and sodium tungstate 70 g / L in the tungsten-nickel alloy solution used. The results show that the carrier and the ultra-thin copper foil can be peeled off, and the peel strength reaches 0.11 kgf / cm. The surface of the thin copper foil is bright and clean, and the thickness of the ultra-thin copper foil is 3 microns.

Embodiment 3

[0079] The carrier supporting ultra-thin copper foil was prepared in the same manner as in Example 1, except that nickel sulfate was 40 g / L and sodium tungstate 80 g / L in the tungsten-nickel alloy solution used. The results show that the carrier and the ultra-thin copper foil can be peeled off, and the peel strength reaches 0.13 kgf / cm. The surface of the thin copper foil is bright and clean, and the thickness of the ultra-thin copper foil is 3 microns.

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Abstract

The invention relates to a preparation technique for manufacturing an ultra-thin copper foil of printed circuit board, in particular to a peel-able ultra-thin copper foil using a copper foil as a carrier and a preparation method thereof. The carrier of the peel-able ultra-thin copper foil is 35-micron copper foil, and a peel-able layer consists of an organic layer and an alloy layer, wherein the organic layer is a nitrogenous compound, and the alloy layer consists of a tungsten-nickel binary alloy. A 1 to 5-micron ultra-thin copper foil prepared by the method can be peeled off from a support carrier after inactivation and heating processing, has moderate peeling strength, and avoids a phenomenon that the ultra-thin copper foil can be partially or wholly separated from the carrier in the process of preparing and using a composite foil; after peeling, the ultra-thin copper foil cannot be kept on a carrier foil, and the carrier foil also cannot be kept on the ultra-thin copper foil; and the ultra-thin copper foil has a bright and clean surface and is suitable for manufacturing a high-density printed circuit board.

Description

technical field [0001] The invention relates to a preparation technology for manufacturing ultra-thin copper foil of a printed circuit board, in particular to a peelable ultra-thin copper foil with copper foil as a carrier and a preparation method thereof. Background technique [0002] With the continuous development of electronic products in the direction of miniaturization and multi-function, the development of printed boards in the direction of multi-layer, high integration and high density is promoted, and the line width and spacing of printed circuit graphics are becoming more and more Development in the direction of miniaturization. Therefore, higher requirements are put forward for the reliability of circuit boards. For example, the thinned copper foil used in fine circuits has higher peelability and can effectively reduce or avoid the "side erosion" phenomenon that occurs when etching circuits. Therefore, the peelable ultra-thin copper foil will be widely used in hi...

Claims

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Application Information

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IPC IPC(8): C25D1/04
Inventor 邓庚凤王平黄永发张永伟何桂荣聂华平
Owner JIANGXI UNIV OF SCI & TECH
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