LED (Light Emitting Diode) integrated structure, manufacturing method, lamp, display screen, backlight device, projecting device and injection mould of forming plastic part

A technology of LED chips and plastic lenses, which is applied in cooling/heating devices of lighting devices, components of lighting devices, semiconductor devices of light-emitting elements, etc., and can solve problems such as short life, low reliability, and high thermal resistance

Inactive Publication Date: 2011-02-02
杨东佐
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0024] In order to solve the poor heat dissipation caused by excessive thermal resistance in the middle link of the existing LED integrated structure, short life, low luminous efficiency, low yield rate caused by low reliability of chip electrical interconnection, and LED chips packaged by COB technology The problem of poor optical effect of the integrated structure, the first technical problem to be solved in the present invention is to provide an intermediate link with small thermal resistance, good heat dissipation, direct electrical connection between the chip and the conductive layer of the layout circuit, and does not require reflow soldering or wave crest. Resin or silica gel can be used for soldering and encapsulating colloid, and the positional relationship between the lens and the chip is precise, with high luminous flux, simple structure, simple assembly, good heat dissipation effect, and good optical effect LED integrated structure

Method used

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  • LED (Light Emitting Diode) integrated structure, manufacturing method, lamp, display screen, backlight device, projecting device and injection mould of forming plastic part
  • LED (Light Emitting Diode) integrated structure, manufacturing method, lamp, display screen, backlight device, projecting device and injection mould of forming plastic part
  • LED (Light Emitting Diode) integrated structure, manufacturing method, lamp, display screen, backlight device, projecting device and injection mould of forming plastic part

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0216] like Figure 1 to Figure 4 As shown, an LED integrated structure includes a heat dissipation substrate 1, a PCB board 2, an LED chip 3, a lens 4, a lens positioning ring 5, a gold wire 6 electrically connected to an electrode of the LED chip 3, and a layout of the electrically connected gold wire 6 The circuit conductive layer 7 is used for encapsulating the LED chip 3 and the encapsulant 8 of the gold wire 6 . Lens positioning ring 5 selects high-temperature-resistant PPA plastics for use.

[0217] The lens positioning ring 5 is provided with the first through hole 23 for positioning the lens 4 and the encapsulating colloid 8, and the lens positioning ring 5 is extended with a fixed column 9. At the end of the fixed column 9, the heat dissipation substrate 1 is placed on the A resisting portion 10 is formed in the mold for molding the lens positioning ring 5 when molding the plastic positioning ring. The lens positioning ring 5 is provided with a glue injection chann...

Embodiment 2

[0232] like Figure 1 to Figure 4 As shown, different from Embodiment 1, the manufacturing method of the LED integrated structure includes:

[0233] 1) The lens positioning ring 5 is injection-molded, and the fixing column 9, the glue port 12 and the injection channel 11 extending from one end surface of the lens positioning ring 5 are formed at the same time, and the length of the fixing column 9 is longer than the heat dissipation substrate 1 and the PCB board 2 The sum of the thickness;

[0234] 2) On the heat dissipation substrate 1, the chip fixing boss 14 on the heat dissipation substrate 1, the large hole 17 of the heat dissipation step through hole, the heat dissipation rib 18, the heat insulation blind hole 19 in the heat dissipation rib 18, and the lens positioning are formed by stamping The second through hole 15 fitted with the fixing column 9 of the ring 5;

[0235] 3) Small holes 22 connected to the large holes 17 of the heat dissipation step through holes form...

Embodiment 3

[0245] like Figure 5 As shown, the difference from Embodiment 1 is that an LED integrated structure includes a heat dissipation substrate 50, an LED chip 51, a lens 52, a lens positioning ring 53, a wire 54 electrically connected to an electrode of the LED chip 51, and a wiring for electrically connecting the wire 54. The conductive layer 55 of the circuit shown in the figure is used for encapsulating the LED chip 51 and the encapsulant 56 of the wire 54 . The lens positioning ring 53 selects high temperature resistant PPO+GF plastics, and the number of lens positioning rings is six. There are no heat dissipation ribs and heat insulation blind holes on the heat dissipation substrate 50 .

[0246] The heat dissipation substrate 50 is made of high thermal conductivity ceramics or the like by die-casting. The layout circuit conductive layer 55 is directly disposed on the heat dissipation substrate 50, and the layout circuit conductive layer 55 is distributed on the same plane....

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Abstract

The invention relates to an LED (Light Emitting Diode) integrated structure comprising a radiating base plate, an LED chip, a lens, a plastic piece of a positioning lens or a forming lens, a conducting wire and a layout circuit conducting layer, wherein two or more than two chip fixing lug bosses which are integrally formed with the radiating base plate are arranged on the radiating base plate, a first through hole of the positioning lens or the forming lens is arranged on the plastic piece of the positioning lens or the forming lens, the chip fixing lug bosses are arranged in the first through hole, the layout circuit conducting layer is extended between the inside wall of the first through hole and the outside walls of the chip fixing lug bosses, one end of the conducting wire is electrically connected with the LED chip, and the other end of the conducting wire is electrically connected with the layout circuit conducting layer which is extended between the inside wall of the first through hole and the outside walls of the chip fixing lug bosses. The LED integrated structure has the advantages of low thermal resistance of an intermediate link, good heat radiating performance, accurate position relation of the lens and the chip, high luminous flux, simple structure, simple assembly, good radiating effect and good optical effect.

Description

technical field [0001] The invention relates to an LED integrated structure and manufacturing method for lighting, backlight module, TV, LED dot-matrix display, projection equipment, etc., in particular to a high-power LED integrated structure and manufacturing method. The invention also relates to an LED lamp with an LED integrated structure, an LED dot matrix display screen, a backlight device and a projection device. The invention also relates to an injection mold for forming a positioning lens of an LED integrated structure or a plastic part for forming a lens. Background technique [0002] Semiconductor LED is a new type of solid light source. Its traditional packaging is an in-line structure such as epoxy resin encapsulating the LED chip and the pins are electrically connected to the LED chip. In the 1980s, surface mount technology began to be used. LED light sources, especially high-power LED light sources, concentrate heat when emitting light. If the heat generated ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F21S2/00H01L33/48F21V17/00F21V29/00F21V23/06H01L33/64F21V19/00H01L25/03H01L33/54F21Y101/02
CPCB29C45/14065B29C45/2602F21Y2105/001F21K9/30B29C45/00B29L2011/0016F21Y2101/02F21Y2103/10F21Y2105/10F21Y2115/10H01L2224/48091H01L2224/4899H05K1/181H05K3/0061H05K2201/09236H05K2201/10106H05K2201/10121H05K2201/10674H05K2203/049H01L2924/00014
Inventor 杨东佐
Owner 杨东佐
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