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Photosensitive polyorganosiloxane composition

A technology of polyorganosiloxane and photosensitivity, which is applied in the direction of photomechanical equipment, photosensitive material processing, and photosensitive materials used in photomechanical equipment. Excellent fabricability, low viscosity, and low thermal weight loss

Inactive Publication Date: 2011-02-02
ASAHI KASEI KK
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0012] The third point is that since the gasket is a substance that forms a closed space including microstructures, if the record of Patent Document 3 is cited, it is a substance that forms a "cavity", so after the packaging is completed, the contained It is not preferable to leave volatile components, etc.
[0014] That is, the current situation is that there is no photosensitive film-forming material that has excellent low-temperature curability, small volume shrinkage during curing, no stickiness, and practical performance that can only replace conventional polyimide precursors.

Method used

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  • Photosensitive polyorganosiloxane composition
  • Photosensitive polyorganosiloxane composition
  • Photosensitive polyorganosiloxane composition

Examples

Experimental program
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Embodiment

[0214] The present invention will be specifically described by the following synthesis examples, examples, and comparative examples.

Synthetic example 1

[0216] (Synthesis of polyorganosiloxane POS-1)

[0217] In a three-necked round-bottomed flask with a capacity of 500ml equipped with a water-cooled condenser and a vacuum-sealed stirring blade, 86.52g (0.4mol) of diphenylsilanediol (hereinafter DPD), 3-methacryloyloxypropane Trimethoxysilane (hereinafter MEMO) 52.45g (0.211mol), 3-morpholinopropyltrimethoxysilane (hereinafter MOPS) 35.12g (0.141mol), titanium tetraisopropoxide (hereinafter TIP) 6.82g (0.024mol), start stirring. (MEMO:MOPS=60:40 mol% mixing ratio) was immersed in an oil bath, the temperature was set to 120° C., and heating was started from room temperature. During this process, while the water-cooled condenser was used to reflux the methanol generated along with the progress of the polymerization reaction, it was reacted until the temperature of the reaction solution was constant, and then heating and stirring were continued for 30 minutes.

[0218] Then, a hose connecting the cold tank and a vacuum pump was...

Synthetic example 2

[0220] (Synthesis of polyorganosiloxane POS-2)

[0221] Except that the MOPS in Synthesis Example 1 was changed to 2-(2-trimethoxysilylethyl)pyridine (hereinafter PES) 32.05g (0.141mol), the same operation as Synthesis Example 1 was performed to obtain polyorganosiloxane Alkane POS-2 (viscosity 191 poise at 40°C).

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Abstract

Disclosed is a photosensitive polyorganosiloxane composition comprising component (a): 100 parts by mass of a polyorganosiloxane wherein the polyorganosiloxane has been obtained by mixing a silanol compound represented by general formula (1): R2Si(OH)2, an alkoxysilane compound represented by general formula (2): R'Si(OR'')3, and an alkoxysilane compound represented by general formula (3): R'''Si(OR'''')3 in a specific molar ratio range with a catalyst selected from the group consisting of metal alkoxides represented by general formula (4): M(OR''''')4, metal alkoxides represented by general formula (5): M'(OR'''''')3, and Ba(OH)2 and polymerizing the mixture without the addition of water, and component (b): 0.1 to 20 parts by mass of a photopolymerization initiator. The groups in the general formulae (1) to (5) are as defined in the claims.

Description

technical field [0001] The present invention relates to the formation of insulating materials for electronic components, surface protective films, interlayer insulating films, α-ray shielding films, etc. A photosensitive polyorganosiloxane composition used in a semiconductor device, etc., and a semiconductor device manufactured using it. Background technique [0002] Polyimide resins that have excellent heat resistance, electrical properties, and mechanical properties are widely used in applications such as insulating materials for electronic components and surface protection films for semiconductor devices, interlayer insulating films, and α-ray shielding films. [0003] This polyimide resin is generally characterized by being supplied in the form of a photosensitive polyimide precursor composition, coated on a substrate, prebaked, and patterned via a desired The mask is irradiated with active light (exposure), developed, and subjected to thermal curing treatment, whereby ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03F7/075H01L21/027G03F7/40G03F7/004
CPCG03F7/0757
Inventor 木村正志平田竜也
Owner ASAHI KASEI KK
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