Method for preparing embedded material and embedded material prepared thereby

Abstract

The invention provides a method for preparing an embedded material and the embedded material prepared thereby. The method for preparing the embedded material comprises the following steps of: 1, providing a supporting material, impregnating the supporting material in glue solution of a resin compound to prepare a prepreg, roasting, and controlling the content of the resin compound on the prepreg to be 5 to 30 weight percent; 2, providing a metal foil, coating glue solution of the resin compound on the metal foil to prepare a glued metal foil, and roasting the glued metal foil into a semi-curing state, wherein the thickness of an upper glue layer is 5 to 150 mu m; and 3, respectively coating the prepared glued metal foil on two sides of the prepreg, and laminating in a laminating machine to prepare the embedded material. The embedded material comprises one or more of laminated prepregs and glued metal foils coated on two sides of the prepregs, wherein each prepreg comprises a supporting material and a resin compound which is attached to the prepreg by impregnation drying; and each glued metal foil comprises a metal foil and a glue layer coated on the metal foil.

Description

technical field [0001] The invention relates to the technical field of embedding materials, in particular to a method for manufacturing an embedding material with a support material applied to a printed circuit board and the prepared embedding material. Background technique [0002] With the development of electronic devices towards high functionality and miniaturization, the proportion of passive devices in electronic systems is increasing. For example, the number of passive components in a mobile phone is 20 times that of active components. At present, passive devices are mainly surface-mounted, occupying a large amount of space on the substrate, and there are many interconnections and soldering points on the surface, which greatly reduces the electrical performance and reliability of materials and systems. In order to provide an electronic system that is lighter, better in performance, cheaper in price, and more reliable in performance, it is the only choice to convert t...

AI Technical Summary

Problems solved by technology

However, because the prepreg is made of one-time prepreg molding, the thickness deviation of the prepreg made in this way is relatively large, which cannot meet the strict requirements of the thickness accuracy of the embedding material; in addition, the prepreg is made of one-time prepreg molding. When it is less than the minimum glue content required by the glass cloth, the prepreg will have pores, which will cause defects when used as an embedding material, so the thickness of the prepreg produced by this method has less adjustability

It is well known that the capacitance of a parallel plate capacitor is inversely proportional to the thickness of the material, so a larger thickness of the material reduces the capacitance of the material to a certain extent

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