Low melting point flux for hot dip plating
A technology of plating flux and hot-dip plating, which is applied in the field of flux and low melting point flux, which can solve problems affecting galvanizing production efficiency and coating quality, missing plating of workpieces, time extension, etc., and achieve expansion and application range and stability, reduce missed plating rate, and improve wettability
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Embodiment 1
[0029] In 1000 L of tap water, add 80 kg of zinc chloride, 5 kg of sodium fluoride, 10 kg of aluminum chloride, 5 kg of sodium bicarbonate, 0.1 kg of alkylphenol polyoxyethylene ether, perfluorooctanesulfonyl quaternary iodide 0.1 kg, fully stirred evenly, to obtain low melting point hot-dip plating flux.
Embodiment 2
[0031] In 1000 L tap water, add 140 kg of zinc chloride, 30 kg of sodium chloride, 20 kg of sodium fluoride, 40 kg of aluminum chloride, 15 kg of sodium bicarbonate, N-ethyl, N-hydroxyethyl perfluorooctyl Sulfonamide 1.5 kg, perfluorooctane sulfonyl quaternary iodide 1.5 kg, fully stirred evenly to obtain low melting point hot-dip plating flux.
Embodiment 3
[0033]In 1000 L tap water, add 100 kg of zinc chloride, 20 kg of sodium chloride, 10 kg of sodium fluoride, 20 kg of aluminum chloride, 10 kg of sodium bicarbonate, N-ethyl, N-hydroxyethyl perfluorooctyl 0.5 kg of sulfonamide, 0.5 kg of alkylphenol polyoxyethylene ether, and 1 kg of perfluorooctylsulfonyl quaternary iodide, and fully stirred to obtain a low melting point hot-dip plating flux.
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