Special equipment for laser micro-cladding

Abstract

The invention discloses special equipment for laser mirco-cladding. The equipment comprises a workbench, a laser processing system and a control system, and is characterized by also comprising a charge coupled device (CCD) monitoring and positioning system and a direct writing system, wherein the CCD monitoring and positioning system comprises a coaxial CCD sensor, a paraxial CCD sensor, a zoom lens, an imaging eye lens, a zoom optical system, a paraxial imaging object lens and an external monitor; the direct writing system comprises a micro-pen direct writing device and a micro-jet direct writing device; the micro-pen direct writing device comprises a support, a guide rail, a cylinder, a slider, a piston rod, a dial gauge, a micro adjustment nut and a micropen; and the micro-jet direct writing device comprises a water bath kettle, a gas-guide tube, a micro-pressure gauge and a micro-jet tool. In respect of the equipment, a laser optical path and the installation stations and working modes of the micro-jet direct writing device and the micropen are reasonably designed, and laser processing, the micropen and the micro-jet direct writing system are integrated on the same working platform, thereby realizing advantage complementation of various processing methods.

Description

technical field [0001] The invention belongs to the technical field of electronic / optoelectronic manufacturing, and specifically relates to a special equipment for laser micro cladding. Fabrication of waveguides. Background technique [0002] The emergence and development of large-scale integrated circuits has led to the continuous development of electronic manufacturing technology in the direction of integration, miniaturization, short timeliness, small batches, multi-variety and three-dimensional manufacturing. Layer wiring, the factor that restricts the further improvement of the quality of electronic products has changed from the original chip size to the interconnection line spacing between chips. [0003] In 2000, the inventor proposed the technology of laser micro cladding electronic paste to prepare wires, that is, laser micro cladding flexible direct writing technology, and developed the manufacturing system and equipment based on this technology. This technology ...

AI Technical Summary

Problems solved by technology

However, there are several problems in using the rotary coating method to preset the film layer: first, the thickness of the preset film is not uniform; second, the excess slurry needs to be removed after laser direct writing, and the cleaned slurry cannot be recycled. Material waste is serious; third, this method cannot preset different materials on the same substrate

However, the existing working platform cannot meet the requirements of the composite process, and the distribution of tools is scattered. When multiple materials are preset on the

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