Method and device for machining tungsten and titanium alloy target material

A technology of tungsten-titanium alloy and processing device, which is applied in the direction of metal processing equipment, metal material coating technology, grinding device, etc., can solve problems such as cracking of tungsten-titanium alloy target material, reduce cracking defects, reduce processing costs, reduce wear effect

Active Publication Date: 2011-04-27
KONFOONG MATERIALS INTERNATIONAL CO LTD
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Problems solved by technology

[0004] In order to solve the above technical problems, the purpose of the present invention is to provide a processing method and processing device for a tungsten-titanium alloy target, which is used to solve the defect that the tungsten-titanium alloy target is prone to cracking in the existing processing method

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  • Method and device for machining tungsten and titanium alloy target material
  • Method and device for machining tungsten and titanium alloy target material
  • Method and device for machining tungsten and titanium alloy target material

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Embodiment 1

[0029] This embodiment provides a method for processing a tungsten-titanium alloy target, aiming to solve the problem that the existing processing method is prone to cracking defects in the tungsten-titanium alloy target through the improvement and control of the three elements of machining.

[0030] First of all, in mechanical processing, people usually want the shortest processing time, long processing device life and high processing accuracy. Therefore, the material and material, hardness, shape and condition of the workpiece must be fully considered before processing. The performance of the machine tool, and then select the appropriate processing tools and use high-efficiency processing conditions, wherein the processing conditions, in the field of mechanical processing technology, are the three elements of mechanical processing, including: rotational speed, feed rate and feed speed.

[0031] Speed: A unit of measurement for the rotational speed of a rotating object. It ref...

Embodiment 2

[0046]Due to the low hardness of the processing device of ordinary material used in the prior art, and the high hardness of the target made of tungsten-titanium alloy, when the tungsten-titanium alloy target is processed by the ordinary processing device, it is easy to cause the tungsten-titanium alloy target The cracking of the material will also cause serious wear of the processing device, requiring frequent replacement of the processing device, which will result in low processing efficiency and high processing cost.

[0047] For this reason, this embodiment provides a tungsten-titanium alloy target processing device, aiming at solving the problem that the existing processing device is prone to cracking defects of the tungsten-titanium alloy target by improving the material of the processing grinding device.

[0048] The material processed by the tungsten-titanium alloy target provided in this embodiment includes diamond with a particle size of 120 to 150 mesh.

[0049] Spec...

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Abstract

The embodiment of the invention discloses a method and device for machining a tungsten and titanium alloy target material. The method comprises the step of machining the tungsten and titanium alloy target material by adopting a diamond abrasive tool with the granularity of 120-150 meshes, wherein the rotating speed of the diamond abrasive tool is 3500-4000r / m, the feed amount is not more than 0.02 mm each time and the feed speed is not more than 500mm / m. The materials for the machining device comprise diamond with the granularity of 120-150 meshes. By applying the machining method provided by the embodiment of the invention, the cracking defect generated in the machining process of the tungsten and titanium alloy target material can be reduced and the machining precision can be remarkably improved. The materials of the machining device for the tungsten and titanium alloy target material provided by the embodiment of the invention comprise the higher-hardness diamond, so that the integral hardness of the machining device can be improved, the cracking defect of the tungsten and titanium alloy target material can be reduced and the machining quality can be improved; meanwhile, the wear on the machining device can be reduced, the frequent replacement for the machining device can be avoided, the machining efficiency can be improved and the machining cost can be reduced.

Description

Technical field: [0001] The technical field of mechanical processing in the semiconductor manufacturing industry of the present invention particularly relates to a processing method and processing device for a tungsten-titanium alloy target. Background technique: [0002] In the manufacturing process of semiconductor devices, it is usually necessary to deposit a layer of metal film on the surface of silicon wafers by physical vapor deposition process. Among them, sputtering is one of the forms of physical vapor deposition, which is mainly a physical process. During the shooting process, the accelerated high-energy ions collide with a high-purity target material solid plate, and the atoms are collided by a physical process. The collided atoms pass through the vacuum chamber and are deposited on the surface of the silicon wafer. This deposition process requires a target with uniform composition, suitable grain size, specific crystallographic orientation and high purity. In th...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24B37/00C23C14/34
Inventor 姚力军潘杰王学泽鲍伟江
Owner KONFOONG MATERIALS INTERNATIONAL CO LTD
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