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Environment-friendly electroplate liquid for copper base plating layer and application method thereof

An electroplating solution, an environmentally friendly technology, applied in coatings, electrolytic coatings, etc., can solve problems such as environmental hazards, strong corrosion and high toxicity of electroplating solutions, and achieve the effects of smooth surface, simplified composite electroplating process, and simple components

Inactive Publication Date: 2011-04-27
ZHEJIANG UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, most of the current electroplating technologies need to be carried out in a specific water-based electroplating solution, and the electroplating solution is generally highly corrosive or highly toxic. During the electroplating operation, a large amount of gas, liquid, and solid waste are often discharged, causing serious harm to the environment.

Method used

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  • Environment-friendly electroplate liquid for copper base plating layer and application method thereof

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Experimental program
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Effect test

Embodiment 1

[0019] Choline chloride and ethylene glycol were stirred and mixed at 75° C. according to a molar ratio of 1:2 to obtain a choline chloride-based deep eutectic solvent. 30 g CuCl 2 2H 2 O is dissolved in 200ml choline chloride-based deep eutectic solvent to obtain an environmentally friendly electroplating solution for copper-based coatings. The electrolytic copper is used as the anode, the brass sheet is used as the cathode, the plating voltage is 0.6V, and the temperature is room temperature. The electroplating time is 1 hour. After the electroplating is completed, the coating is washed with methanol and water in sequence, and then dried.

[0020] The copper coating obtained by this process is pink, with a smooth surface and a thickness of about 15 μm. The scanning electron microscope photo is as follows: figure 1 shown.

Embodiment 2

[0022] Choline chloride and urea were stirred and mixed at 75° C. according to a molar ratio of 1:2 to obtain a choline chloride-based deep eutectic solvent. 10 g CuCl 2 Dissolve in 200ml of choline chloride-based deep eutectic solvent to obtain an environmentally friendly electroplating solution for copper-based plating. The electrolytic copper is used as the anode, the brass sheet is used as the cathode, the plating voltage is 1V, and the temperature is 40°C. The electroplating time is 0.5 hours. After the electroplating is completed, the coating layer is washed with methanol and water in sequence, and dried.

[0023] The copper plating obtained by this process is rose red, with a smooth surface and a thickness of about 10 μm.

Embodiment 3

[0025] Choline chloride and ethylene glycol were stirred and mixed at 75° C. according to a molar ratio of 1:2 to obtain a choline chloride-based deep eutectic solvent. 30 g CuCl 2 2H 2 O was dissolved in 200ml of choline chloride-based deep eutectic solvent, and at the same time, 0.02g of carbon nanotubes were added to obtain an environmentally friendly electroplating solution for copper-based plating. The electrolytic copper is used as the anode, the brass sheet is used as the cathode, the plating voltage is 1.1V, and the temperature is room temperature. The electroplating time is 1 hour. After the electroplating is completed, the coating is washed with methanol and water in sequence, and then dried.

[0026] The copper plating obtained by this process is dark red, with a smooth surface and a thickness of about 12 μm.

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Abstract

The invention discloses an environment-friendly electroplate liquid for a copper base plating layer, wherein a choline chloride-based deep eutectic solvent is used as a electroplate liquid solvent; every liter of the electroplate liquid contains 0.1-1 mol of CuCl2.2H2O or CuCl2 and 0-10 g of a composite plating layer additive; the composite plating layer additive is one or a mixture of some of nano carbon tube powder, SiC powder, diamond powder and Al2O3 powder; and the choline chloride-based deep eutectic solvent is the mixed liquid of choline chloride and glycol in the molar ratio of 1: 2, or the mixed liquid of the choline chloride and urea in the molar ratio of 1: 2. The electroplate liquid is featured with simple ingredient, convenience in preparation and environment friendliness. The process in which the electroplate liquid is used for electroplating the copper base plating layer is simple and controllable, and the electroplate liquid contains no corrosive material and has no steam discharging in the electroplating process. The surface of the acquired copper base plating layer is even, and especially in the process of electroplating a copper base composite coating, the electroplate liquid is not needed to be mechanically stirred, which simplifies the composite electroplate technology, and is helpful for the large-scale production.

Description

technical field [0001] The invention relates to an environment-friendly electroplating solution for a copper-based coating and a method for using the same. Background technique [0002] The equipment manufacturing industry has a key position and role in the development of my country's national economy and the realization of industrial modernization. High-performance surface treatment technology has become one of the key technologies for the development of advanced manufacturing industries, and plays an important supporting role in military, aerospace, information and other high-tech fields and people's material life. The electroplating method based on the principle of cathodic reduction occupies an important position in the field of surface treatment of metal materials. However, most of the current electroplating technologies need to be carried out in a specific water-based electroplating solution, and the electroplating solution is generally highly corrosive or highly toxi...

Claims

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Application Information

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IPC IPC(8): C25D15/00C25D3/38
Inventor 谷长栋王秀丽邬震泰涂江平
Owner ZHEJIANG UNIV
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