Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Single-component environmentally-friendly electronic glue and application thereof

An environmentally friendly, electronic adhesive technology, applied in the direction of circuits, electrical components, adhesive types, etc., can solve the problems of easy cracking of electronic adhesives and pollute the environment, and achieve the effects of rapid curing, wide application and good heat resistance.

Inactive Publication Date: 2011-05-11
SHANGHAI XIYI NEW MATERIAL SCI & TECHCO
View PDF0 Cites 7 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The technical problem to be solved by the present invention is to provide a safe, non-toxic and environmentally friendly electronic glue for the existing electronic glue that is easy to crack and pollute the environment.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0030] A single-component environment-friendly electronic adhesive, consisting of the following components:

[0031] Slowly add 20 grams of methyl methacrylate, 20 grams of butyl acrylate, 5 grams of acrylic modified epoxy resin and 5 grams of cyclopentadiene into 50 grams of propylene glycol butyl ether solvent and mix uniformly, with cyclohexanone peroxide as The initiator adopts the solution polymerization method under the condition of 70-90° C., and reacts for 10 hours to obtain an environment-friendly acrylic resin, which can be directly used in environment-friendly electronic adhesives.

[0032] An application of a single-component environment-friendly electronic glue, which is used for protective coatings, protective adhesives and packaging materials of electronic devices, integrated circuits, printed circuits, LED chips, etc.

Embodiment 2

[0034] In the present embodiment, 25 grams of cyclohexyl acrylate, 20 grams of methyl methacrylate, 10 grams of acrylic modified epoxy resin, 10 grams of diisobutylene, 5 grams of styrene, and 10 grams of N-methylpyrrolidone were slowly added and 10 g of dimethyl adipate were uniformly mixed, and azobisisobutyronitrile was used as an initiator to react for 5 hours in a solution polymerization method under the condition of 70-90° C. to obtain an environment-friendly acrylate resin.

[0035] Others are the same as embodiment 1.

Embodiment 3

[0037] In this embodiment, 5 grams of butyl methacrylate, 15 grams of ethyl methacrylate, 5 grams of butyl acrylate, 1 gram of acrylic modified epoxy resin, 14 grams of 4-methyl-1-(1-methyl (Ethyl ethyl)-3-cyclohexene is slowly added into 40 grams of dimethyl adipate and 20 grams of dimethyl glutarate and mixed evenly, with tert-butyl hydroperoxide-N, N-dimethyl Dialkylamine is used as an initiator, and under the condition of 40-60 DEG C, a solution polymerization method is adopted to react for 20 hours to obtain an environment-friendly acrylic resin.

[0038] Others are the same as embodiment 1.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
particle diameteraaaaaaaaaa
particle diameteraaaaaaaaaa
Login to View More

Abstract

The invention discloses single-component environmentally-friendly electronic glue. The electronic glue comprises the following components in percentage by weight: (1) 50 to 100 percent of environmentally-friendly acrylic resin, (2) 0 to 50 percent of environmentally-friendly solvent, (3) 0 to 30 percent of reinforcing agent and (4) 0 to 20 percent of auxiliary agent, wherein the environmentally-friendly acrylic resin is prepared from an acrylic monomer, acrylic modified epoxy resin, an olefin monomer, an unnecessary alkenyl aromatic compound monomer and the environmentally-friendly solvent serving as raw materials in the presence of a thermal initiator or a redox initiator by a solution polymerization method; and solid content is between 20 and 80 weight percent. The electronic glue has the advantages of low price, moisture absorption resistance, high thermal resistance, single component, quick curing, high storage stability, high gluing strength and the like, is convenient to spread and is widely applied.

Description

technical field [0001] The invention relates to an adhesive composition, in particular to a single-component environment-friendly electronic glue, and also relates to the application of the single-component electronic glue. Background technique [0002] Electronic glue is a broad term used for bonding, sealing, potting and coating protection of electronic components. [0003] In order to ensure that circuit boards, electronic devices, LED chips, etc. maintain good insulation performance during use, avoid external impact and damage, and will not be affected by machinery, heat, humidity, dust, oily smoke, corrosive gases, etc., it is necessary to coat them Protective coating or encapsulation. [0004] Currently commonly used electronic adhesives include epoxy resin adhesives, organic silicone adhesives, solvent-based polyurethane adhesives, and solvent-based phenolic adhesives. Among them, organic silicone adhesives include room temperature vulcanized silicone rubber or silic...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): C09J133/08C09J133/12C09J133/10C09J163/10H01L23/29
Inventor 唐勇
Owner SHANGHAI XIYI NEW MATERIAL SCI & TECHCO
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com