Solution for nickel electroforming, electroforming method using solution and thin nickel plate manufactured by using method

An electroforming, solution technology, applied in electroforming, electrolytic processes, etc., can solve the problems of uneven opening size, curling or warping, insufficient thickness uniformity around micropore openings, etc., and achieve compressive stress and/or Low tensile stress, balanced compressive stress and tensile stress, simple effect of graphic transfer link

Inactive Publication Date: 2011-06-01
KUN SHAN POWER STENCIL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The current printing stencils are usually made by fine etching technology, but this technology cannot meet the requirements of stencil bump printing for chip-level packaging, and it mainly has the following defects:
[0005] (2) There is a problem of lateral corrosion;
[0006] (3) The etching technology is based on chemical dissolution, the surface of the formed opening is rough, and the hole wall is not smooth enough, which is not conducive to the printing of conductive materials;
[0007] (4) The hole size tolerance of the etching printing template is about 20 μm, resulting in uneven hole size;
[0008] (5) The uniformity of the hole size after etching is poor, and there will be a deviation of about 20 μm
In the case of u...

Method used

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  • Solution for nickel electroforming, electroforming method using solution and thin nickel plate manufactured by using method
  • Solution for nickel electroforming, electroforming method using solution and thin nickel plate manufactured by using method
  • Solution for nickel electroforming, electroforming method using solution and thin nickel plate manufactured by using method

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preparation example Construction

[0057] The present invention has no special limitation on the preparation method of the nickel electroforming solution, for example, the concentrated nickel sulfamate solution of concentration such as 180g / L can be diluted with deionized water, and then other components are added according to the stated concentration Can be prepared.

[0058] The amount of the auxiliary brightener in the nickel electroforming solution can be calculated each time according to the product of the required current and time during electroforming. Preferably, the amount of the auxiliary brightener is 0.1g / L / (100A×h)~0.15g / L / (100A×h), for example, it can be 0.1g / L / (100A×h), 0.11g / L / (100A×h), 0.12g / L / (100A×h), 0.13g / L / (100A×h), 0.14g / L / (100A×h) or 0.15g / L / (100A× h)). For example, if a current of 80A is used for electroforming for 0.5 hours, the product of the required current and time is 40A×h, and the concentration of the auxiliary brightener in the nickel electroforming solution should be 0.04g / L...

preparation example 1～8 and comparative example 1～3

[0085] A solution for nickel electroforming was prepared with deionized water according to the concentration in Table 1 below, wherein the auxiliary brightener was added in the form of a 100 g / L aqueous solution.

[0086] Table 1 is used for the concentration of each component of nickel electroforming solution

[0087]

[0088]

Embodiment 1

[0090] Thin-layer nickel sheets were prepared according to the following steps (see Table 3 for specific process parameters), wherein the electroforming solution for nickel electroforming prepared in Preparation Example 1 was used for electroforming, and a bidirectional pulse power supply was used as the electroforming power supply.

[0091] Activation: Put a bright stainless steel substrate (purchased from Changtai Stainless Steel Technology Group, 1.5mm thick 304 mirror stainless steel) in the activation tank (the solution is industrial hydrochloric acid and deionized water in a volume ratio of 1:4) Activated in medium for 30 minutes.

[0092] Lamination film: A layer of photosensitive film for electroforming (purchased from DuPont, thickness 50 μm, type HM1056) with a thickness of 50 μm is pressed on the surface of the stainless steel substrate.

[0093] Pattern transfer: make a high-precision chrome plate with the microhole pattern to be made in advance, and then use the c...

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Abstract

The invention provides a solution for nickel electroforming, an electroforming method using the solution and a thin nickel plate manufactured by using the method. The solution for nickel electroforming contains nickel aminosulfonate and nickel sulfate, and preferably also contains nickel bromide. The solution for nickel electroforming is adopted for electroforming in the method, and preferably a bidirectional pulse power supply is adopted as an electroforming power supply. The thin nickel plate has good thickness uniformity, low stress (pressure stress or tensile stress), smooth inner walls of micropores and no micro burrs or pin holes, and can be used for manufacturing an encapsulation template for transferring soldering paste during flip chip encapsulation.

Description

technical field [0001] The invention belongs to the technical field of material preparation technology, and relates to an electroforming solution, an electroforming method and a thin-layer nickel sheet prepared by the method, in particular to a method for transferring solder when making a flip-chip (flip-chip) package. Electroformed nickel sheets for packaging stencils for paste. Background technique [0002] Integrated circuit flip-chip packaging is an advanced chip interconnection technology and an ideal chip bonding technology. It has the advantages of small package area, high I / O density, good heat dissipation, high reliability and improved testability of bare chips. The key process of integrated circuit flip-chip packaging is to form bumps on the pads of the chip. Bump forming technologies include evaporation, sputtering, electroplating, and stencil printing. Among them, stencil printing has low cost, high efficiency, and can be used without Advantages such as lead so...

Claims

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Application Information

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IPC IPC(8): C25D1/00C25D3/12
Inventor 谭建雄胡鹏程赵录军
Owner KUN SHAN POWER STENCIL
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