Flexible substrate and preparation method thereof

A flexible substrate, plastic-based technology, applied in semiconductor/solid-state device manufacturing, electrical components, electric solid-state devices, etc., can solve the problems of increasing the preparation cycle of FOLED substrates, expensive thin-film packaging equipment, and increasing the cost of processing substrates. Production time period, strong water absorption, and the effect of reducing production cost

Active Publication Date: 2011-06-22
SHENZHEN DANBANG INVESTMENT GROUP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, this method of processing organic polymer plastic substrates has the following disadvantages: 1) the price of thin film packaging equipment is very expensive, resulting in an increase in the cost of processing substrates; The layered film structure increases the preparation cycle of the entire FOLED substrate, and the production capacity of the corresponding production line will be affected

Method used

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  • Flexible substrate and preparation method thereof
  • Flexible substrate and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0027] The flexible substrate for FOLED includes an organic polymer plastic substrate, an ITO semiconductor transparent conductive film, and a molecular sieve film layer coated between them. The manufacturing method of the flexible substrate is: firstly, the molecular sieve film layer is coated on the organic polymer plastic substrate. , and then coat the ITO semiconductor transparent conductive film on the molecular sieve film layer to obtain a flexible substrate.

[0028] The flexible substrate for FOLED as shown in the accompanying drawings includes an ITO semiconductor transparent conductive film 2 with a thickness of 0.2 μm, a molecular sieve film layer 3 with a thickness of 10 μm in the middle layer, and an organic polymer PET plastic substrate with a thickness of 50 μm (hereinafter referred to as the substrate) 1. Molecular sieve film layer 3 is prepared by uniformly dispersing molecular sieve particles in a polymer adhesive. The polymer adhesive in this example is an ul...

Embodiment 2

[0035]The difference between the flexible substrate for FOLED and the first embodiment is that the thickness of the molecular sieve film layer 3 is 20 μm.

[0036] The fabrication steps of the flexible substrate are as follows:

[0037] 1) Preparation of molecular sieve film layer 3: same as Step 1) of Example 1.

[0038] 2) Coating the molecular sieve film layer 3: the difference from step 2) in the first embodiment is that the rotation speed of the spin coating equipment is set to 600 RPM, and the thickness of the molecular sieve film layer 3 obtained by coating is 20 μm.

[0039] 3) Deposition of the ITO semiconductor transparent conductive film 2: the same as step 3) of the first embodiment.

[0040] The water vapor permeability of the flexible substrate obtained in this embodiment is measured by a measurement system for the permeability of organic optoelectronic device packaging materials to be 1.63×10 -6 g / m 2 d, The water vapor permeability of the organic polymer PET...

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Abstract

The invention discloses a flexible substrate. The flexible substrate comprises an organic polymer plastic substrate and an indium tin oxide semiconductor transparent conductive film, and is characterized in that: a molecular sieve film layer is coated between the organic polymer plastic substrate and the indium tin oxide semiconductor transparent conductive film. The invention also discloses a preparation method for the flexible substrate. The preparation method comprises the following steps of: 1) forming the molecular sieve film layer on the organic polymer plastic substrate; and 2) formingthe indium tin oxide semiconductor transparent conductive film on the molecular sieve film layer. Because the molecular sieve film layer has very high water vapor adsorption ability, the water vapor permeability of the flexible substrate is greatly lower than that of a common flexible substrate; the water vapor permeation resistance is close to that of an organic polymer plastic substrate after being treated by a Barix method; the manufacturing cost of a treatment substrate can be reduced greatly; a preparation process of the treatment substrate is simplified effectively; a preparation time period is reduced; and the production capacity of the substrate is improved greatly.

Description

technical field [0001] The present invention relates to a flexible substrate and a preparation method thereof, in particular to a flexible substrate suitable for preparing a flexible organic light-emitting diode (Flexible Organic Light-Emitting Diode, abbreviated as FOLED) and a preparation method thereof. Background technique [0002] To prepare organic light-emitting diodes (Organic Light-Emitting Diode, abbreviated as OLED) on organic polymer plastic substrates to realize flexible displays, OLED devices must be packaged to isolate oxygen and water vapor in the air. [0003] The existing treatment of organic polymer plastic substrates is realized by the Barix packaging technology of Vitex Corporation of the United States. A layer of Barix film is formed on the substrate as a barrier layer. Layer film structure, this packaging structure can not only modify the plastic substrate, improve the surface flatness of the plastic substrate, but also greatly increase its water vapor...

Claims

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Application Information

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IPC IPC(8): H01L51/52H01L51/56
Inventor 刘萍
Owner SHENZHEN DANBANG INVESTMENT GROUP
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