Dual-layer silicon nitride film for crystalline silicon solar cell and preparation method thereof
A double-layer silicon nitride, solar cell technology, applied in coatings, circuits, electrical components, etc., can solve the problems of large refractive index, inability to use thin films, can not be used, etc., to achieve enhanced anti-reflection effect, good practical value, The effect of improving photoelectric conversion efficiency
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example 1
[0025] Example 1. After the P-type monocrystalline silicon wafer with an area of 125mm×125mm and a thickness of about 200 microns has been textured, diffused, etched, dephosphorized silicon glass and cleaned, it is placed in a PECVD equipment for double-layer nitriding Growth of silicon thin films. In this process, the parameters of the first-stage film growth were set as time 120s, power 3500W, temperature 450°C, air pressure 1700mTorr, and the flow ratio of silane and ammonia to 1:6; the second-stage film growth The growth parameters were respectively set as 600s, the flow ratio of silane and ammonia gas was 1:8, and other parameters were the same as those of the first stage. The composite refractive index of the grown double-layer silicon nitride film is about 2.11, wherein the refractive index of the inner layer is about 2.25, and the refractive index of the outer layer is about 2.03.
example 2
[0026] Example 2: After the P-type monocrystalline silicon wafer with an area of 125mm×125mm and a thickness of about 200 microns is textured, diffused, etched, dephosphorous silicon glass is removed and cleaned, it is placed in a PECVD device for double-layer nitriding Growth of silicon thin films. In this process, the parameters of the first-stage film growth were set as time 120s, power 3500W, temperature 450°C, air pressure 1700mTorr, and the flow ratio of silane and ammonia to 1:7; the second-stage film growth The growth parameters were respectively set as 600s time and 430°C temperature, and other parameters were the same as those in the first stage.
example 3
[0027] Example 3. After the P-type monocrystalline silicon wafer with an area of 125mm×125mm and a thickness of about 200 microns has been textured, diffused, etched, dephosphorized silicon glass and cleaned, it is placed in a PECVD equipment for double-layer nitriding Growth of silicon thin films. In this process, the parameters of the first-stage film growth were set as time 120s, power 3500W, temperature 450°C, air pressure 1700mTorr, and the flow ratio of silane and ammonia to 1:7; the second-stage film growth The growth parameters were respectively set as 600s time and 3200W power, and other parameters were the same as those in the first stage.
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