Diamond fretsaw and manufacture method thereof

Abstract

The invention discloses a diamond fretsaw and a manufacture method thereof. The diamond fretsaw comprises a metal baseline body and diamond granules, wherein the metal baseline body comprises a core body, a protection layer, a sand-planting layer and a nickel base layer; the core body is made of carbon steel and has the diameter of 0.1-0.4mm; the protection layer covers the surface of the core body, has the thickness of 0.001-0.003 mm and is made of soft copper; the sand-planting layer covers the surface of the protection layer and has the thickness of 0.01-0.04mm; testudinate cracks for planting the diamond granules are formed on the surface of the sand-planting layer which comprises zinc, zinc alloy, nickel or first nickel alloy; and the nickel base layer covers the surface of the sand-planting layer, has the thickness of 0.001-0.05 mm and is made from nickel or second nickel alloy. By utilizing the diamond fretsaw provided by the embodiment of the invention, the protection layer made of soft steel covers outside a steel wire so as to resist corrosion and prevent the cracks from expanding; due to the existence of the testudinate cracks, the wire drawing yield can be improved in one aspect, the processing efficiency of electroplating can be remarkably enhanced in the other aspect and the service life of the diamond fretsaw is favorably prolonged.

Description

technical field [0001] The invention relates to the field of wafer processing, in particular to a diamond wire saw for cutting wafers and a preparation method thereof. Background technique [0002] When manufacturing various semiconductor devices, raw material ingots containing single crystal, polycrystalline or amorphous silicon, sapphire, etc. are cut into thin plates or wafers of predetermined thickness through slicing. [0003] With the rapid development of the electronics industry, the application of wafers has become more and more extensive, and wafer processing technology has also received more and more attention. Among them, wafer cutting is an important process that restricts the yield of subsequent processes. [0004] The wire saw cutting methods currently available for hard and brittle materials such as silicon crystals mainly include cutting using free abrasives and cutting using fixed abrasives. In the cutting process of semiconductor materials such as silicon ...

AI Technical Summary

Problems solved by technology

[0006] However, in the above two methods, there is the problem of the initial holding force of the diamond, which determines that a very low moving speed of the steel wire must be adopted, resulting in the disadvantages of low production efficiency and high production cost.

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