Lead-free welding tin wire and water-soluble welding flux used by same

A lead-free solder, water-soluble technology, applied in the direction of welding medium, welding equipment, welding/cutting medium/material, etc., can solve the problems of residual halogen, environmental hazards, non-compliance, etc., to reduce interfacial tension and reduce environmental pollution Effect

Active Publication Date: 2011-08-24
浙江强力控股有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The main cost of traditional solder wire flux is rosin, halogen substances and solvents. There are many halogen residues in it, which is not in line with the current environmental protection trend. Moreover, it needs to be cleaned with Freon after welding, which has caused great harm to the environment.

Method used

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  • Lead-free welding tin wire and water-soluble welding flux used by same
  • Lead-free welding tin wire and water-soluble welding flux used by same
  • Lead-free welding tin wire and water-soluble welding flux used by same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0056] (Example 1, lead-free solder wire)

[0057] This embodiment is a lead-free solder wire, which includes a copper-tin alloy wire with a cavity and a water-soluble flux arranged in the cavity; the ratio of the copper-tin alloy wire and the water-soluble flux is:

[0058] Water-soluble flux 2.0%;

[0059] Copper tin alloy wire 98%;

[0060] The copper-tin alloy wire includes the following components:

[0061] Cu 0.75%;

[0062] Sn 99.25%;

[0063] The water-soluble flux includes the following components:

[0064] Coconut oil alkyl primary amine 20%;

[0065] Stearylamine polyoxyethylene ether 30%;

[0066] Diethylamine hydrochloride 1%;

[0067] Water-soluble high molecular polymer 49%;

[0068] The above percentages are mass percentages;

[0069] The ammonium salt halide is diethylamine hydrochloride;

[0070] The water-soluble high molecular polymer is polyethylene glycol with a molecular weight of 200 to 600 and a hydroxyl value of 51 to 64.

[0071] See Table 1 for the materials and their ...

Embodiment 2

[0072] (Example 2, lead-free solder wire)

[0073] Example 2 is basically the same as Example 1, except that the ratio of the copper-tin alloy wire and the water-soluble flux in this example is:

[0074] Water-soluble flux 2.2%;

[0075] Copper-tin alloy wire 97.8%;

[0076] In addition, the ratio of the water-soluble flux used in this embodiment is different from that in Embodiment 1. The relevant parameters in this embodiment are shown in Table 1.

Embodiment 3

[0077] (Example 3, lead-free solder wire)

[0078] Embodiment 3 is basically the same as embodiment 1, except that the ratio of copper-tin alloy wire and water-soluble flux in this embodiment is:

[0079] Water-soluble flux 2.1%;

[0080] Copper-tin alloy wire 97.9%;

[0081] In addition, the ratio of the water-soluble flux used in this embodiment is different from that in Embodiment 1. The relevant parameters in this embodiment are shown in Table 1.

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Abstract

The invention discloses a lead-free welding tin wire and a water-soluble welding flux used by the same. The lead-free welding tin wire comprises a copper-tin alloy wire provided with a hole cavity and the water-soluble welding flux arranged in the hole cavity; the proportion of the copper-tin alloy wire and the water-soluble welding flux is as follows: 2.0-2.2wt% of the water-soluble welding fluxand the balance of the copper-tin alloy wire, wherein the copper-tin alloy wire comprises the following components: 0.75-1.0wt% of Cu and the balance of Sn; the water-soluble welding flux comprises the following components: 20-30wt% of coconut oil alkyl carbinamine, 30-40wt% of octadecyl amine polyoxyethylene ether, 1-3wt% of diethylammonium chloride and the balance of water-soluble macromoleclarpolymer; the ammonium salt halogenide is diethylammonium chloride; and the water-soluble macromoleclar polymer is polyethylene glycol with the molecular weight of 200-2000. The lead-free welding tin wire provided by the invention has better welding performance and the water-soluble welding flux provided by the invention has better wettability.

Description

Technical field [0001] The invention belongs to the technical field of flux, and specifically relates to a lead-free solder wire and a water-soluble flux used therein. Background technique [0002] Solder paste is a slurry or paste that is uniformly mixed with solder alloy powder and paste flux. It is an indispensable raw material in the surface assembly technology (SMT) process of electronic products. It is widely used in reflow soldering to achieve Mechanical and electrical interconnection between electronic components and substrates. With the advent of the lead-free era of SMT, in terms of solder, various formulations of lead-free solder materials such as Sn-Ag series, Sn-Cu series and Sn-Ag-Cu series have been successfully developed. Due to lead-free solder Weak chemical properties (such as melting point, surface tension, and oxidation resistance, etc.) change lead to changes in the original soldering process, the preheating rate is significantly reduced, the average tempera...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/26B23K35/362
Inventor 赵图强
Owner 浙江强力控股有限公司
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