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High adhesiveness silicone resin composition and an optical semiconductor device provided with a cured product thereof

A silicone resin and composition technology, applied in semiconductor devices, electrical components, circuits, etc., can solve problems such as high heat generation and cracking, and achieve high heat resistance, high light resistance, discoloration resistance and impact resistance excellent effect

Active Publication Date: 2011-11-09
SHIN ETSU CHEM IND CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, when this silicone resin composition is used for a high-brightness LED package with high light intensity and high heat generation, cracks are found at the end of the LED package or the root of the lead frame.

Method used

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  • High adhesiveness silicone resin composition and an optical semiconductor device provided with a cured product thereof
  • High adhesiveness silicone resin composition and an optical semiconductor device provided with a cured product thereof
  • High adhesiveness silicone resin composition and an optical semiconductor device provided with a cured product thereof

Examples

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example

[0102] Examples and comparative examples are listed below to specifically describe the present invention, but the present invention is not limited to the following examples. In addition, the part in the following description shows a weight part.

[0103] Preparation of organopolysiloxane with resin structure

Synthetic example 1

[0105] Add 1050g of xylene and 5143g of water to the flask, then dropwise add 2222g (10.5mol) of phenyltrichlorosilane, 543g (4.50mol) of vinyl dimethyl chlorosilane, and 1575g of xylene. The solution. After completion of the dropwise addition, the mixture was stirred for 3 hours, and the spent acid was separated and washed with water. After azeotropic dehydration, 6 g (0.15 mol) of KOH was added, and the mixture was heated to reflux at 150° C. overnight. Then neutralize and filter with 27g (0.25mol) of trimethylchlorosilane and 24.5g (0.25mol) of potassium acetate, and distill off the solvent under reduced pressure to synthesize a siloxane resin represented by the following average formula (Resin 1). The vinyl equivalent is 0.195 mol / 100g.

[0106]

Synthetic example 2

[0108] Add 1005g of xylene and 5000g of water to the flask, then dropwise add 2222g (10.5mol) of phenyltrichlorosilane, 422g (3.50mol) of vinyl dimethyl chlorosilane, and 1507g of xylene. The solution. After completion of the dropwise addition, the mixture was stirred for 3 hours, and the spent acid was separated and washed with water. After azeotropic dehydration, 6 g (0.15 mol) of KOH was added, and the mixture was heated to reflux at 150° C. overnight. Then neutralize and filter with 27g (0.25mol) of trimethylchlorosilane and 24.5g (0.25mol) of potassium acetate, and distill off the solvent under reduced pressure to synthesize a siloxane resin represented by the following average formula (Resin 2). The vinyl equivalent is 0.170 mol / 100g.

[0109]

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Abstract

The object of the present invention is to provide a silicone resin composition for encapsulating an optical semiconductor element which has strong adhesiveness to a substrate and provide an optical semiconductor element which has high reliability. The present invention provides a silicone resin composition comprising an organopolysiloxane (A) having at least two alkenyl groups per molecule, a liner organohydrogenpolysiloxane (B-1) which has hydrogen atoms each bonded to a silicon atom at the both terminals and a liner organohydrogenpolysiloxane (B-2) which has a hydrogen atom bonded to a silicon atom at one terminal and a hydroxyl or alkoxy group bonded to a silicon atom at the other terminal, a branched organohydrogenpolysiloxane (C) having at least three hydrosilyl groups per molecule, a catalytic (D), and a condensation catalyst (E).

Description

technical field [0001] The present invention relates to a silicone resin composition useful as a sealing material for optical semiconductor elements. Background technique [0002] In recent years, high-brightness light-emitting diodes (light-emitting diodes, LEDs) with high light intensity and high heat generation have been commercialized and widely used for general lighting and the like. Patent Document 1 discloses that a sealing material excellent in heat resistance, light resistance stability, and weather resistance can be provided by adding a hindered amine-based photodegradation inhibitor to a phenyl-based silicone resin. However, although this silicone resin composition is excellent in light resistance, heat discoloration resistance, and impact resistance, if it is used for a long time, the effect of the photodeterioration inhibitor disappears, and discoloration of the resin due to deterioration of the phenyl group occurs. And resin deterioration caused by cleavage of...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L83/07C08L83/05C08L83/06H01L33/56
CPCH01L33/56C08G77/18C08G77/16C08L83/04C08G77/12C08G77/20C08K5/56C08K5/57C08L83/00
Inventor 浜本佳英柏木努
Owner SHIN ETSU CHEM IND CO LTD
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