Demouldable foaming preparation method of wafer level glass micro-cavity

A glass micro- and wafer-level technology, which is applied in glass manufacturing equipment, glass molding, manufacturing tools, etc., can solve the problems of corroding glass, taking a long time, and removing silicon molds, and achieves short removal time, reduced costs, and shortened Effect of time to silicon removal

Active Publication Date: 2012-02-01
SOUTHEAST UNIV
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  • Claims
  • Application Information

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Problems solved by technology

[0004] However, how to remove the silicon mold after the positive pressure thermoforming and negative pressure thermoforming methods to prepare the glass microcavity becomes a difficult problem
Since silicon and glass are anodically bonded, it usually takes a long time to remove silicon by using the traditional method of etching with TMAH; while using potassium hydroxide to remove silicon, although the speed is faster, it will corrode the glass at the same time

Method used

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  • Demouldable foaming preparation method of wafer level glass micro-cavity
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  • Demouldable foaming preparation method of wafer level glass micro-cavity

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Embodiment 1

[0021] A method for preparing a wafer-level glass microcavity by releasing and foaming includes the following steps: the first step: etching a shape on a silicon wafer (for example, a 4-inch wafer) to form a microcavity array of a specific size. The microcavity is round or square, and the process for preparing the pattern structure on the silicon wafer is one of wet etching process, reactive ion etching process or deep reactive ion etching. The second step: coating the thermal outgassing agent in the microcavity array. The hot air release agent is a powder that can release gas after heating, such as calcium carbonate powder or titanium hydride powder, and the particle size of the powder is 300 mesh, 800 mesh or 1000 mesh. The added mass is calculated according to the size of the required molding cavity. For example, calcium carbonate is used. If the mass can be 0.1mg, 0.5mg, 1mg, 1.5mg, 2mg, the third step: the borosilicate glass disc and the silicon circle The wafer molds are...

Embodiment 2

[0024] A method for preparing a wafer-level glass microcavity by releasable foaming includes the following steps:

[0025] In the first step, 15 micron thick aluminum was sputtered on a 4-inch Si wafer.

[0026] In the second step, the aluminum on the silicon wafer is etched by a wet etching process to form a square array, and the aspect ratio of the micro groove is 1:1.

[0027] The third step is to place 0.1 mg of calcium carbonate powder in the aluminum microgrooves on the above Si wafer, and then mix it with Pyrex 7740 glass wafer (a brand of borosilicate glass, produced by Corning Corporation in the United States, available in the market, usually It has been polished, and its size is the same as that of the Si wafer.) Bonding is carried out under vacuum to make the Pyrex7740 glass and the aluminum microgroove on the silicon wafer form a sealed cavity. The bonding surface should be kept highly clean before bonding And very small surface roughness. The bonding process between th...

Embodiment 3

[0031] A method for preparing a wafer-level glass microcavity by releasable foaming includes the following steps:

[0032] The first step is to use a 25% TMAH solution wet etching method to etch a specific pattern on a 4-inch Si wafer (actually, in three dimensions, grooves are carved on the silicon wafer, and patterns in two dimensions). Is a square slot array, the silicon wafer is polished,

[0033] The second step is to place 0.2 mg of calcium carbonate powder in the microgrooves of the above Si wafer, and then mix it with the same size (4 inches) Pyrex 7740 glass wafer (a brand of borosilicate glass, produced by Corning Corporation, USA) Commercially available, it has been polished) and aluminum foil of the same size are bonded with a low melting point metal, so that Pyrex7740 glass and aluminum foil and the above-mentioned specific pattern form a sealed cavity.

[0034] In the third step, the above-mentioned bonded wafer is heated to 850°C under one atmospheric pressure, and ke...

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Abstract

The invention discloses a demouldable foaming preparation method of a wafer level glass micro-cavity, which comprises the following steps of: etching a micro-groove array on a silicon wafer to obtain a silicon wafer die; putting hot release gas agent powder in the micro-groove array of the silicon wafer die; bonding the borosilicate glass wafer with the silicon wafer die through a bonding layer, and sealing the micro-groove array of the silicon wafer die; putting the bonded wafer in a heating furnace for heating above a glass softening temperature, keeping temperature, molding the softened glass with gas released by a hot release gas agent to obtain a glass micro-cavity, cooling and annealing; and then putting the molded wafer in a corrosive of the bonding layer, and removing the bonding layer so as to release the silicon wafer die and obtain the wafer level glass micro-cavity. In the invention, the bonding layer is arranged between the borosilicate glass wafer with the silicon wafer, the bonding layer is selectively removed by the corrosive, and the silicon wafer die can be completely released.

Description

Technical field [0001] The invention involves a MEMS (microelectronics mechanical system) packaging technology, especially a new and simple glass micro -cavity method. Background technique [0002] In the field of MEMS manufacturing technology, Pyrex7740 glass (a glass containing alkaline ions, Pyrex is a product brand of Corning, the American) is an important material.The thermal expansion coefficient of silicon is) similar thermal expansion coefficient, which has a high light transmission rate and strong strength. It has form a high-intensity bond connection with the glass with the glass combined with the anode key process.O covalent key, its strength is even higher than the silicon material itself.Due to this characteristic, Pyrex7740 glass is widely used in MEMS packaging, micro -flow, and MOEMS (micro -optical electromechanical system). [0003] In the field of MEMS, micro -processing of glass materials such as Pyrex7740 has always been a difficult problem.The traditional us...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C03B19/00C03C15/00
Inventor 尚金堂于慧秦顺金
Owner SOUTHEAST UNIV
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