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Lead-free solder paste for ultrafine solder powder and preparation method thereof

A lead-free solder paste and solder powder technology, applied in welding equipment, welding media, manufacturing tools, etc., can solve the problems of solder paste stability, poor solderability, bubble generation, high viscosity, etc., and achieve solderability and storage stability. Good, prevent severe reaction, improve stability effect

Active Publication Date: 2012-02-22
云南锡业新材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] There are many types of lead-free solder paste, and the preparation processes are also different. If the preparation process is not strictly controlled, there will be certain problems in the solder paste. It is easy to generate air bubbles in the system, and the paste flux mixed with air bubbles will eventually affect the stability of the solder paste
Secondly, with the development of ultra-fine-pitch surface mount, it is necessary to adapt to the dispensing and printing solder paste products, that is to say, the solder powder must develop towards ultra-fine particles, and ultra-fine particle powder is easy to oxidize and follow. The chemical reaction of the paste solder leads to poor stability and solderability of the solder paste, and it is also prone to solder balls, collapse and other undesirable phenomena

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0028] Prepare paste flux raw materials, hydrogenated rosin 20.0%, KE-604 30.0%, diethylene glycol dimethyl ether 10.0%, diethylene glycol octyl ether 28.0%, sebacic acid 1.0%, dibromosuccinic acid 0.5%, ST (hydrogenated castor oil) 5.0%, lauryl hydroxy stearic acid amide 1.5%, abietyl-trimethylammonium chloride 0.7%, abietyl alcohol ether 0.3%, ricinoleoyl diethanolamine 3.0%.

[0029] Prepare the cream product of the present invention according to the following steps.

[0030] 1) Melt ordinary hydrogenated rosin in a reactor at a temperature of 140°C to 150°C.

[0031] 2) Slowly add the solvent into the molten rosin, keep the temperature at 130°C-140°C, stir for 10 minutes, then add active agent and surfactant, and stir for 10 minutes.

[0032] 3) Cool the material to 70℃~80℃, finally add thixotropic agent and stir for 30 minutes

[0033] 4) Cool the material to 30°C-40°C, vacuum degas and stir for 10 minutes, and continue cooling to room temperature to obtain the paste fl...

Embodiment 2

[0037] Prepare paste flux raw materials, water white rosin 25.0%, polymerized rosin 20.0%, diethylene glycol diethyl ether 15.0%, diethylene glycol octyl ether 23.0%, succinic acid 1.5%, dibromosuccinic acid 1.0%, ST (Hydrogenated Castor Oil) 6.5%, Lauryl Hydroxystearamide 2.5%, Rosinyl Bis-Trimethylammonium Chloride 1.0%, Rosin Alcohol Ether 1.5%, Ricinoleyl Diethanolamine 3.0%.

[0038] The preparation method is the same as that of Example 1, and the ratio of cream flux, solder powder and surface treatment agent is 10.5:88.0:1.5.

Embodiment 3

[0040] Prepare paste flux raw materials, KR-610 20.0%, KE-60 425.0%, ethylene glycol monobutyl ether 18.0%, diethylene glycol monohexyl ether 20.0%, sebacic acid 1.5%, adipic acid 1.5%, di Bromobutene glycol 1.0%, ST 5.5%, lauryl hydroxystearic acid amide 2.5%, abietyl bis-trimethylammonium chloride 1.0%, abietyl alcohol ether 1.5%, ricinoleoyl diethanolamine 2.5%.

[0041] The preparation method is the same as in Example 1, and the ratio of cream flux, solder powder and surface treatment agent is 10.5:88.5:1.0.

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Abstract

The invention relates to a lead-free solder paste for ultrafine solder powder and a preparation method thereof. The lead-free solder paste is taken as a fluxing material for an SMT (Surface Mount Technology) and belongs to the technical field of soldering materials. The lead-free solder paste comprises the following components by weight percent: 11.0%-13.0% of vacuum degassed paste fluxing agent and the balance of spherical alloy solder powder which is subjected to surface treatment and has a grain size of 15 microns to 25 microns, wherein a mixture of ethylene glycol monobutyl ether, halogen-free quaternary ammonium salt and polyglycol 600 with the weight ratio of (7.5-8.5):1:1, is taken as a surface treating agent in the alloy solder powder, and a weight ratio of the alloy solder powder to the surface treating agent is (88.5-87.0):(1.0-2.0). A paste fluxing agent prepared by using the preparation method provided by the invention has the advantages of few air bubbles and excellent soldering performance and storage stability. Meanwhile, the speed of reaction between the alloy solder powder and the paste fluxing agent is reduced, and the stability and the soldering performance of the ultrafine lead-free solder paste are well promoted.

Description

technical field [0001] The invention relates to an ultrafine solder powder lead-free solder paste and a preparation process thereof, which are used as SMT soldering materials and belong to the technical field of soldering materials. Background technique [0002] Solder paste is mainly used in surface mount technology (SMT) welding. With the increasing miniaturization and high performance of information equipment, SMT has become the mainstream technology of electronic assembly. Among them, the use of solder paste welding is a key process in the SMT process. It directly determines the performance and quality of electronic products. On the other hand, the quality of soldering depends not only on the quality of solder powder, including the sphericity, oxygen content, particle size distribution, etc. of the solder powder, but also on the performance of the paste flux in the solder paste and its The method of preparation of paste. [0003] There are many types of lead-free solde...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/363B23K35/40
Inventor 秦俊虎刘宝权白海龙古列东吕金梅沙文吉汤凤甦赵玲彦朵云琨
Owner 云南锡业新材料有限公司
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