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Colorless and transparent polyimide resin material and preparation method thereof

A polyimide resin, transparent technology, applied in the field of colorless and transparent polyimide resin material and its preparation, can solve the limitation of large-scale application of polyimide film, cannot be applied on a large scale, hexafluoropropane di Anhydride is expensive and other issues

Active Publication Date: 2012-03-21
WUHAN YIMAIDE NEW MATERIALS TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, because 2,2-bis(3,4-dicarboxylic acid) hexafluoropropane dianhydride is extremely expensive, the large-scale application of this type of polyimide film is limited.
At the same time, in method (2), due to the difficulty in the synthesis of monomers with large side groups or asymmetric structures, it cannot be applied on a large scale.

Method used

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  • Colorless and transparent polyimide resin material and preparation method thereof
  • Colorless and transparent polyimide resin material and preparation method thereof
  • Colorless and transparent polyimide resin material and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0055] In this embodiment, the colorless and transparent polyimide resin material has the following structural formula:

[0056]

[0057] The specific preparation method is: at room temperature, 16.0 grams (0.05 moles) of 2,2'-bis(trifluoromethyl)diaminobiphenyl and 200 milliliters of m-cresol are added to a reaction reaction that is equipped with a stirrer and nitrogen protection device. After treating that 2,2'-bis(trifluoromethyl)diaminobiphenyl is completely dissolved, add 5.6 grams (0.025 moles) of cis-1,2,3,4-cyclohexane tetraacid dianhydride and 5.6 grams (0.025 moles) of trans-1,2,3,4-cyclohexanetetraacid dianhydride, continue stirring until the two are completely dissolved. Then the temperature was raised to 180°C for 5h. During the reaction process, the water generated by the reaction is removed from the reaction system by a water removal device to obtain a polyimide solution. Drop the reaction solution into ethanol to obtain fibrous polyimide precipitates, and...

Embodiment 2

[0069] In this embodiment, the colorless and transparent polyimide resin material has the following structural formula:

[0070]

[0071] The specific preparation method is: at room temperature, 16.7 grams (0.05 moles) of 2,2-bis(4-aminophenyl)hexafluoropropane and 160 milliliters of N,N-dimethylformamide are added to a mixer equipped with in the reactor. After 2,2'-bis(4-aminophenyl)hexafluoropropane is completely dissolved, add 11.2 grams (0.05 mole) of cis-1,2,3,4-cyclohexane tetraacid dianhydride at room temperature . After the system was completely dissolved, the temperature was raised to 50° C. and stirred continuously for 3 hours to obtain a viscous polyamic acid solution.

[0072]Coat the polyamic acid solution on a clean glass plate, place the glass plate in a drying oven with nitrogen protection, and heat up according to the following procedures: 80°C, 4h; 150°C, 1h; 200°C, 1h; 250°C, 1h; 300°C, 0.5h. After the temperature dropped to room temperature, the glas...

Embodiment 3

[0075] In this embodiment, the colorless and transparent polyimide resin material has the following structural formula:

[0076]

[0077] The specific preparation method is as follows: at room temperature, 16.7 g (0.05 mol) of 2,2-bis(4-aminophenyl) hexafluoropropane and 100 ml of N-methylpyrrolidone are added into a reactor equipped with a stirrer. After 2,2'-bis(4-aminophenyl)hexafluoropropane is completely dissolved, add 11.2 grams (0.05 moles) of trans-1,2,3,4-cyclohexanetetraacid dianhydride at room temperature and 50 ml o-dichlorobenzene. Continue stirring until the two are completely dissolved. Then the temperature was raised to 180°C for 10 h. During the reaction process, the water generated by the reaction is removed from the reaction system by a water removal device to obtain a polyimide solution. Drop the reaction solution into ethanol to obtain fibrous polyimide precipitates, and dry to obtain polyimide powder. The glass transition temperature of the polymer...

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Abstract

The invention discloses a colorless and transparent polyimide resin material. 1,2,3,4-cyclohexanetetracarboxylic dianhydride is chosen as dianhydride monomer or comonomer to carry out polycondensation reaction with primary diamine, so that the polyimide resin material is prepared. Because the 1,2,3,4-cyclohexanetetracarboxylic dianhydride comonomer has a distorted molecular structure, a large free volume exists between polymer molecular chains, and thereby the formation of charge transfer complex (CTC) in and between polyimide molecules is inhibited; and meanwhile, because of the introductionof a lipid structure, the electron-stimulated transition mode in the polyimide molecular chains is changed, the absorption of the aromatic polyimide in the visible light region is remarkably weakened, and thereby the transparency of the polymer is greatly increased. The ultraviolet light transmission cutoff wavelength of a produced polyimide film is 280nm to 380nm, the light transmissivity at 450nm is 86 to 94 percent, moreover, the glass-transition temperature is 250 DEG C to 400 DEG C, and the polyimide resin material has a good application prospect in the fields of flexible substrate materials for solar cells, flexible transparent conducting film substrate materials, liquid crystal display materials and the like.

Description

technical field [0001] The invention relates to the technical field of polyimide materials, in particular to a colorless and transparent polyimide resin material and a preparation method thereof. Background technique [0002] Polyimide is a class of polymers with excellent comprehensive properties. It has excellent heat resistance, low temperature resistance, solvent resistance and flame retardancy, as well as excellent dielectric and mechanical properties. Therefore, it is Widely used in electronics, microelectronics, aerospace, laser, optoelectronics and other fields. [0003] High optical transparency can expand the application of polyimide in optoelectronic materials, such as flexible substrates for solar cells, optical waveguide materials for communication links, alignment films for liquid crystal displays, and planar lightwave circuits optical half-wave plate etc. However, the traditional polyimide film is usually brownish-yellow or brown, and its transmittance to 50...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G73/10
Inventor 魏海兵陈国飞方省众侯亦嘉郭俊超王静刚
Owner WUHAN YIMAIDE NEW MATERIALS TECH CO LTD
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