Pressure-sensitive acrylic acid thermally conductive adhesive, preparation method for same and application thereof

A heat-conducting adhesive and acrylic technology, which is applied in the direction of adhesives, adhesive types, film/sheet adhesives, etc., can solve problems such as thermal stress, failure, and difficulty in uniform dispersion, and achieve high thermal conductivity and performance stable effect

Inactive Publication Date: 2012-05-02
HISENSE VISUAL TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] For example, the thermally conductive adhesives disclosed in patent applications CN97181574.7, CN201010163571.9, CN91103592.3, CN200480010246.1, CN200780028241.5, and a high thermally conductive composite material disclosed in CN201110008919.1, which adopt the method of adding thermally conductive particles to In the polymer (solution) that has been polymerized, due to the small diameter of the heat-conducting particles and the high viscosity of the polymer, it is difficult to disperse evenly during the mixing process. When used, it will cause uneven heat distribution on the bonding surface and

Method used

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  • Pressure-sensitive acrylic acid thermally conductive adhesive, preparation method for same and application thereof
  • Pressure-sensitive acrylic acid thermally conductive adhesive, preparation method for same and application thereof
  • Pressure-sensitive acrylic acid thermally conductive adhesive, preparation method for same and application thereof

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Effect test

Embodiment 1

[0058] The pressure-sensitive acrylic heat-conducting adhesive of this embodiment is made according to the following steps:

[0059] 0.4g azobisisobutyronitrile and 40g ethyl acetate are formulated into initiator solution, and 4g carboxyl content is 1.1% multi-walled carbon nanotube (diameter 100nm, length 500nm) and 16g carbon fiber (carboxyl content is 0.05%, 5000nm in diameter, 6000nm in length), 3g of acrylic acid, 80g of n-butyl acrylate, 20g of 2-ethylhexyl acrylate and 140g of ethyl acetate to prepare a monomer solution;

[0060] In the reactor with material mixing function and temperature control function, the temperature of the monomer solution is raised to 76 ° C, and the initiator solution is added dropwise to the monomer solution for 5 times to carry out the polymerization reaction, and the time of each drop is 10 minutes. After the addition, the reaction was continued for 1 hour. After all the thermal initiator solution was added to the polymerization system, the ...

Embodiment 2

[0064] The pressure-sensitive acrylic heat-conducting adhesive of this embodiment is made according to the following steps:

[0065] 0.35g azobisisobutyronitrile and 30g ethyl acetate are formulated into initiator solution, and 2g carboxyl content is the multi-walled carbon nanotube (diameter 80nm, length 1000nm) of 1.5% and 15g carbon fiber (carboxyl content is 0.09% carboxyl The pitch-based carbon fiber of liquefied, diameter 6000nm, length 7000nm), 4.5g acrylic acid, 50g isobutyl acrylate, 10g lauryl acrylate, 15g acrylate-2-ethylhexyl, and 100g ethyl acetate are mixed with monomer solution;

[0066] In the reactor with material mixing function and temperature control function, the temperature of the monomer solution is raised to 76 ° C, and the initiator solution is added dropwise to the monomer solution for polymerization reaction in 6 times, and the time of each drop is 15 minutes. After the addition, the reaction was continued for 1 hour. After all the thermal initiator...

Embodiment 3

[0069] The pressure-sensitive acrylic heat-conducting adhesive of this embodiment is made according to the following steps:

[0070] 0.5g azobisisobutyronitrile and 45g ethyl acetate are mixed with initiator solution, and 2.5g carboxyl content is the multi-walled carbon nanotube (diameter 30nm, length 500nm) of 2.3% and 17.5g carbon fiber (carboxyl content is 0.05 % carboxylated pitch-based carbon fiber, diameter 5000nm, length 8000nm), 4g acrylic acid, 1g methacrylic acid, 55g n-butyl acrylate, 28g acrylate-2-ethylhexyl, 165g ethyl acetate are mixed with monomer solution;

[0071] In the reactor with material mixing function and temperature control function, the temperature of the monomer solution is raised to 76 ° C, and the initiator solution is added dropwise to the monomer solution for 5 times to carry out the polymerization reaction. The time for each drop is 20 minutes. After the addition, the reaction was continued for 1 hour. After all the thermal initiator solution w...

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Abstract

The invention provides a pressure-sensitive acrylic acid thermally conductive adhesive, formed by dispersing a thermally conductive agent in monomer solution at first, then performing an in-situ polymerization, wherein the dosage ratio of the thermally conductive agent to the monomer is (1 to 4): (6 to 9); the thermally conductive agent is composed of 75-90% of carbon fibres and 10-25% of carbon nano-tubes; and the monomer is acrylic acid and/or acrylate. The pressure-sensitive acrylic acid thermally conductive adhesive provided by the invention is excellent in thermal conductivility and goodin environmental protection property because of uniformly dispersing a thermally conductive agent consisting of specific components in an acrylic acid polymerized monomer to form a stable three-dimensional meshy thermally conductive structure. The pressure-sensitive acrylic acid thermally conductive adhesive can be used between an LED (light-emitting diode) lamp bar and a back plate, between the LED lamp bar and an aluminium alloy section, between the back plate and the aluminium alloy section, between the gaps of chips such as CPU and GPU and a radiator, and in case that the gap of two contact surfaces is narrow in a liquid crystal module.

Description

technical field [0001] The invention relates to a thermally conductive pressure-sensitive adhesive, in particular to a pressure-sensitive acrylic thermally conductive adhesive, its preparation method and application. Background technique [0002] At present, with the development of microelectronics technology and assembly technology, modern electronic equipment is increasingly becoming a highly integrated system formed by high-density assembly and micro-assembly. relationship, the contact interface between the heating device and the heat sink in electronic products often cannot reach the theoretical "zero gap" contact, and the contact surface is as follows: figure 1 As shown, part of the interface between the heat generating device 12 (such as LED lights, chips, etc.) and the heat sink 13 (such as aluminum alloy profiles, back plates, etc.) is not in contact, and heat exchange can only be performed through the air layer A. [0003] The heat cannot be transmitted evenly thro...

Claims

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Application Information

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IPC IPC(8): C09J133/08C09J9/00C09J11/04C09J7/00C08F220/18C08F220/06C08F2/44G02F1/1335G02F1/13357
Inventor 邢哲乔明胜李文涛陈宾
Owner HISENSE VISUAL TECH CO LTD
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