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High-performance tin-based solder alloy and preparation method thereof

A high-performance, brazing material technology, applied in metal processing equipment, welding equipment, manufacturing tools, etc., can solve the problem of failure to obtain particle-reinforced phase agglomeration, mechanical properties of tin-based solder alloy, low density of particle-reinforced phase, difficult Enhanced phase addition and other issues to achieve the effect of improving interface bonding performance, improving mechanical properties, improving mechanical properties and corrosion resistance

Inactive Publication Date: 2012-06-27
HARBIN INST OF TECH SHENZHEN GRADUATE SCHOOL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

For tin-based solder alloys, since the alloy has a larger density (about 6.5g / cm 3 ), while the commonly used particle-reinforced phase density is low (about 3.5g / cm 3 ), so it is difficult to add a sufficient amount of reinforcing phase to the solder matrix even with ultrasonic or mechanically assisted stirring during the solder melting process
Because of this, no one has been found to prepare particle-reinforced tin-based solder alloys by ultrasonic-assisted methods, nor has it been possible to obtain tin-based solder alloys that can overcome the agglomeration of particle-reinforced phases and significantly improve mechanical properties during remelting of solder alloys.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0036] The materials used in this example are: Sn-3.0Ag-0.5Cu (SAC305) tin-based solder powder with a particle size of about 2 μm, pure titanium metal powder and SiC powder with a particle size of 60 nm. The material of the tin pot is pure titanium, the size is: ?38mm×35mm, and the amount of tin melting at one time in actual operation is 200g. The material of the ultrasonic horn is titanium alloy (Ti-6Al-4V), the ultrasonic power is 1000W, the ultrasonic vibration time is 120 seconds, the ultrasonic frequency is 20KHz, and the depth of the ultrasonic horn immersed in the molten solder is 5mm.

[0037] Take 199.4g of SAC305 solder powder, 0.4g of SiC powder and 0.2g of pure titanium metal powder, and pour the above powder into a ball mill jar for ball milling. The ball-to-material ratio is 5:1, the material of the ball milling tank and balls is zirconia, the ball milling medium is a mixture of flux and alcohol, the ball milling protective atmosphere is Ar, the ball milling time...

Embodiment 2

[0041] The materials used in this example are: Sn-0.3Ag-0.7Cu cast alloy strips, Hf powder, Sn-0.3Ag-0.7Cu solder alloy powder with a particle size of about 10 μm and ZrO with a particle size of about 1 μm 2 powder. The material of the tin pot is pure titanium, the size is: ?38mm×35mm, and the amount of tin melting at one time in actual operation is 200g. The material of the ultrasonic horn is titanium alloy (Ti-6Al-4V), the ultrasonic power is 1200W, the ultrasonic frequency is 20KHz, and the depth of the ultrasonic horn immersed in the molten solder is 5mm.

[0042] Take 97.8 grams of Sn-0.3Ag-0.7Cu solder powder, ZrO 2 2 g of powder and 0.2 g of Hf powder (oil-immersed Hf powder, weighed after vacuum drying) were introduced into a ball mill jar for ball milling. The ball-to-material ratio is 10:1, the material of the ball mill tank and balls is zirconia, the ball mill medium is a mixture of flux and alcohol, the ball mill protective atmosphere is Ar, the ball mill time is...

Embodiment 3

[0046] The materials used in this example are: Sn-0.3Ag-0.7Cu cast alloy strips, Ti powder, Sn-0.3Ag-0.7Cu solder powder with a particle size of about 10 μm, and Sn-0.3Ag-0.7Cu solder powder with an average diameter and length of 10 nm and 10 μm, respectively. Multi-walled carbon nanotubes (CNTs) powder. The material of the tin pot is pure titanium, the size is: ?38mm×35mm, and the amount of tin melting at one time in actual operation is 200g. The material of the ultrasonic horn is titanium alloy (Ti-6Al-4V), the ultrasonic power is 1200W, the ultrasonic frequency is 20KHz, and the depth of the ultrasonic horn immersed in the molten solder is 5mm.

[0047] Take 198.6 grams of Sn-0.3Ag-0.7Cu solder powder, 1 gram of CNTs powder and 0.4 gram of Ti powder, and pour the above powders into a ball mill jar for ball milling. The ball-to-material ratio is 10:1, the material of the ball mill tank and balls is zirconia, the ball mill medium is a mixture of flux and alcohol, the ball mi...

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Abstract

The invention discloses high-performance tin-based solder alloy, which comprises a tin-based solder body, refractory hard dispersion strengthening phase particles and 0.01wt%-2wt% of doped elements, wherein the doped elements include one or multiple of Fe, Ni, Y, Ag, Ti, Zr, Hf and Sb. Due to the added doped elements, interface bonding property between the tin-based solder body and the refractory hard dispersion strengthening phase particles is improved, aggregation of the strengthening phase particles in remelting is reduced, and the mechanical property is improved accordingly. The invention further discloses a preparation method of the high-performance tin-based solder alloy, which combines the powder metallurgy preparation process with the ultrasonic-assistant casting process so that the strengthening phase particles are high in dispersion and uniform in distribution, solves the problem that the strengthening phase particles are difficult to be added when in use of the ultrasonic-assistant casting process individually, the mechanical property of the tin-based solder alloy is improved, and the performance of the solder can keep stable basically after the solder is remelted.

Description

technical field [0001] The invention relates to a tin-based solder alloy, in particular to a high-performance particle-reinforced tin-based solder alloy. The invention also relates to a preparation method of a high-performance tin-based solder alloy. Background technique [0002] With the rapid development of electronic products in the direction of volume miniaturization and functional integration, they put forward higher requirements for the reliability of existing packaging materials. Particle-reinforced solder is currently considered to be a promising electronic packaging material to improve the performance of solder. By adding a hard refractory second phase (such as ceramics and high-melting point metal particles) to the solder matrix, it can be achieved. On the premise of less influence on the melting point and toughness of the brazing filler metal, the strength and effective use temperature range of the brazing filler metal are greatly improved. [0003] For general...

Claims

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Application Information

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IPC IPC(8): B23K35/26B23K35/36B23K35/40C22C1/02C22C13/00
Inventor 李明雨肖勇计红军
Owner HARBIN INST OF TECH SHENZHEN GRADUATE SCHOOL
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