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Termination electrode for multilayer sheet-type temperature-sensitive ceramic resistor and preparation method thereof

A heat-sensitive ceramic, multi-layer chip technology, applied in the direction of resistance terminals/electrodes, resistors with positive temperature coefficients, resistors with negative temperature coefficients, etc., can solve the problem of affecting the contact of Ag terminal electrodes and the resistance value of resistors Fluctuation and other problems, to achieve good electrical conductivity and bonding strength, convenient operation, simple process effect

Inactive Publication Date: 2012-06-27
HUAZHONG UNIV OF SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, since the glass cladding layer existing between the multilayer thermosensitive ceramic body and the terminal electrode is an insulating layer, it affects the contact between the Ag terminal electrode and the Ni internal electrode, resulting in large fluctuations in the resistance of the resistor.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0026] 1) Preparation of terminal electrode slurry:

[0027] (1.1) The preparation of inorganic binder, its proportioning is:

[0028] In terms of mass percentage, silicon dioxide 5%, boron oxide 10%, bismuth oxide 60%, barium oxide 10%, titanium dioxide 1.5%, aluminum oxide 8.5%, zinc oxide 5%;

[0029] The above raw materials are weighed according to the mass ratio, after being ground and mixed evenly, they are placed in an alumina crucible, heated to 1100°C in a muffle furnace, and the holding time is 60 minutes, and the molten glass is quenched to obtain fine glass particles. Carry out ball milling;

[0030] (1.2) Preparation of organic binder

[0031] By mass percentage, rosin 10%, terpineol 80%, dibutyl phthalate 10%;

[0032] Weigh the above raw materials according to the mass ratio, stir and mix evenly, heat the mixture to 80°C, stir until the resin is dissolved, then filter and remove impurities on a 400-mesh filter to obtain an organic binder;

[0033] (1.3) Prep...

Embodiment 2

[0041] 1) Preparation of terminal electrode slurry:

[0042] (1.1) The preparation of inorganic binder, its proportioning is:

[0043] In terms of mass percentage, silicon dioxide is 10%, boron oxide is 5%, bismuth oxide is 30%, barium oxide is 15%, titanium dioxide is 15%, aluminum oxide is 15%, and zinc oxide is 10%.

[0044] The above raw materials are weighed according to the mass ratio, after being ground and mixed evenly, they are placed in an alumina crucible, heated to 1150°C in a muffle furnace, and the holding time is 40 minutes, and the molten glass is quenched to obtain fine glass particles. Carry out ball milling;

[0045] (1.2) Preparation of organic binder

[0046] In terms of mass percentage, ethyl cellulose 20%, terpineol 70%, castor oil 5%, dibutyl phthalate 5%;

[0047] Weigh the above raw materials according to the mass ratio, stir and mix evenly, heat the mixture to 80°C, stir until the resin is dissolved, then filter and remove impurities on a 600-mesh...

Embodiment 3

[0056] 1) Preparation of terminal electrode slurry:

[0057] (1.1) The preparation of inorganic binder, its proportioning is:

[0058] In terms of mass percentage, silicon dioxide 15%, boron oxide 15%, bismuth oxide 43.5%, barium oxide 1.5%, titanium dioxide 10%, zinc oxide 15%;

[0059] The above raw materials are weighed according to the mass ratio, after being ground and mixed evenly, they are placed in an alumina crucible, heated to 1250°C in a muffle furnace, and the holding time is 30 minutes, and the molten glass is quenched to obtain fine glass particles. Carry out ball milling;

[0060] (1.2) Preparation of organic binder

[0061] By mass percentage, polyvinyl butyral 30%, terpineol 70%;

[0062] Weigh the above raw materials according to the mass ratio, stir and mix evenly, heat the mixture to 85°C, stir until the resin is dissolved, then filter and remove impurities on a 800-mesh filter to obtain an organic binder;

[0063] (1.3) Preparation of terminal electrod...

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Abstract

The invention provides a termination electrode for a multilayer sheet-type temperature-sensitive ceramic resistor and a preparation method thereof. The termination electrode comprises components of, by weight, 40-70% of silver powder, 5-35% of nickel boride, 2-5% of inorganic binder and 25-28% of organic binder. The preparation process comprises steps of: adding the organic binder into the inorganic binder to prepare a fluid suspension; dipping a multilayer sheet-type temperature-sensitive ceramic body in the fluid suspension; drying and sintering to obtain a cladding body with a glass coating formed on a surface thereof; coating a termination electrode slurry on two end faces of the cladding body; and sintering the cladding body to form a Ag termination electrode. The termination electrode of the invention has high conductivity, can fuse well with the glass coating, formed in an early stage, for resisting erosion by a plating liquid, and eliminates unfavorable influences of the glass coating on great fluctuation of resistance of the sheet-type element.

Description

technical field [0001] The invention belongs to the technical field of passive devices, and in particular relates to a terminal electrode for a multilayer chip thermally sensitive ceramic resistor and a preparation method thereof. Background technique [0002] With the advancement of surface mount technology, technologies such as miniaturization and chipping of electronic components have developed rapidly. Among them, the multilayer chip thermistor ceramic resistor is alternately laminated by BaTiO 3 A semiconductor ceramic green sheet composed of a base and a conductive film containing Ni conductive powder, and then the laminate is co-fired in a reducing atmosphere, and then heat-treated in an oxidizing atmosphere to obtain a multilayer chip heat-sensitive ceramic element. Body, and finally made by sintering Ag terminal electrodes on the end face of the multilayer chip thermosensitive ceramic body. [0003] Since the multilayer chip thermistor ceramic resistor needs to be...

Claims

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Application Information

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IPC IPC(8): H01C1/14H01C7/02H01C7/04
Inventor 周东祥郑志平傅邱云龚树萍胡云香赵俊刘欢吴兴文
Owner HUAZHONG UNIV OF SCI & TECH
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