Composite power semiconductor device
A power semiconductor and device technology, applied in the field of compound power semiconductor devices, can solve the problems of power device occupation, large chip area, etc.
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[0035] The composite power semiconductor device provided by the present invention has the characteristics of strong driving capability of LIGBT and fast speed of LDMOS, and realizes high withstand voltage and low on-resistance with the smallest possible chip area.
[0036] A compound power semiconductor device such as Figure 1~5 As shown, it is formed by a hybrid structure of LIGBT and LDMOS cascaded with JFET. The overall top view of the device is as figure 1 As shown, the AA' section structure (such as figure 2 shown) means LIGBT; BB' section structure (such as image 3 shown) means LDMOS; CC' section structure (such as Figure 4 Shown) means JFET; DD' section structure (such as Figure 5 shown) represents the curvature of the device.
[0037] The LIGBT as figure 2 As shown, including p-type substrate 1, N well region 6, P-body region 12, P well region 13, n + Cathode 2, P + Anode 5, gate 3, dielectric layer 14, polycrystalline field plate 7, cathode metal 15 and ...
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