Unlock instant, AI-driven research and patent intelligence for your innovation.

Inorganic electromagnetic-wave absorbing material and preparation method thereof

A technology for absorbing materials and electromagnetic waves, applied in chemical instruments and methods, and other chemical processes, can solve problems such as the influence of wave-absorbing performance, easy changes in shape, thickness, and size, and the inability to use wave-absorbing materials, so as to overcome temperature resistance Poor weather resistance, good oxidation resistance and low cost

Inactive Publication Date: 2012-07-25
NANJING UNIV OF TECH
View PDF4 Cites 20 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, during actual use, the shape, thickness and size of flexible electromagnetic wave absorbing materials are prone to change when subjected to external forces, which will affect their wave-absorbing performance.
Chinese patent (application number: 201010588886.8) discloses a method including LSMO material and SiO 2 High temperature resistant electromagnetic wave absorbing material of ceramic adhesive, but the composite material is in powder state and cannot be used as wave absorbing material directly or after simple processing

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Inorganic electromagnetic-wave absorbing material and preparation method thereof
  • Inorganic electromagnetic-wave absorbing material and preparation method thereof
  • Inorganic electromagnetic-wave absorbing material and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0033] In this example, 560g carbonyl iron powder and 440g glass powder are mixed in a rolling mill. The average particle size of the carbonyl iron powder is 1 micron, the average particle size of the glass powder is 6 microns, the softening point of the glass powder is 500°C, and the ball weight The ratio is 5:1, the ball milling time is 12 hours, and the speed is 80r / min. Add 136 g of CMC with a concentration of 4 wt% to the mixed powder and mix, and pass through a 60-mesh sieve to obtain granulated powder. According to the product size, the granulated powder is weighed, put into a mold, and formed on a press to obtain a green body. The formed green body is fired in an atmosphere furnace using a ceramic sintering process, the atmosphere is nitrogen, the firing temperature is 550°C, and the firing temperature is kept for 40 minutes.

[0034] The strength of the carbonyl iron / glass composite absorbing material prepared by the invention is 52MPa, which meets the requirements of l...

Embodiment 2

[0036] In this example, 50g carbon nanotubes and 950g glass powder are mixed in a stirring mill. The average size of carbon nanotubes is 0.01 micron, the average particle size of glass powder is 0.1 micron, the softening point of glass powder is 650℃, and the mixing time is 2 hours, the speed is 450r / min. Add 53 g of PVB with a concentration of 10 wt% to the mixed powder and mix, and pass through a 100-mesh sieve to obtain granulated powder. According to the product size, the granulated powder is weighed, put into a mold, and formed on a press to obtain a green body. The formed green body is fired in an atmosphere furnace using a ceramic sintering process, the atmosphere is high-purity argon, the firing temperature is 730°C, and the firing temperature is kept for 10 minutes.

[0037] The strength of the carbon nanotube / glass composite absorbing material prepared by the invention is 42MPa, which meets the requirements of later mechanical processing; Figure 4 It can be seen that ...

Embodiment 3

[0039] In this example, 300g of silicon carbide and 700g of glass powder are mixed in a planetary mill. The average particle size of silicon carbide is 10 microns, the average particle size of glass powder is 2 microns, the softening point of glass powder is 750°C, and the ball-to-material weight ratio is 2:1, rotation speed is 200r / min, ball milling time is 6 hours. To the mixed powder, 87g of PVA with a concentration of 5 wt% was added and mixed, and then passed through a 40-mesh sieve to obtain granulated powder. According to the product size, the granulated powder is weighed, put into a mold, and formed on a press to obtain a green body. The formed green body is fired in a silicon carbide rod high-temperature furnace using a ceramic sintering process, the atmosphere is air, the firing temperature is 850 DEG C, and the firing temperature is kept for 20 minutes.

[0040] The strength of the silicon carbide / glass composite wave absorbing material prepared by the invention is 45...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
The average particle sizeaaaaaaaaaa
The average particle sizeaaaaaaaaaa
Softening pointaaaaaaaaaa
Login to View More

Abstract

The invention discloses a high-strength and high-temperature-resistance inorganic electromagnetic-wave absorbing material and a preparation method of the inorganic electromagnetic-wave absorbing material. The inorganic electromagnetic-wave absorbing material is characterized by comprising the following raw material components by mass percent: 20-95% of glass frit and 5-80% of electromagnetic-wave absorbent. The preparation process mainly comprises burdening, mixing, prilling, forming and sintering. The inorganic electromagnetic-wave absorbing material overcomes the defects of poor temperature resistance and weather fastness of macromolecule substrates, and has the characteristics of simple process, high strength, good wave absorbing performance, high temperature resistance, good inoxidizability and low cost.

Description

Technical field [0001] The invention relates to the research field of electromagnetic wave absorbing materials, in particular to a high-strength, high-temperature resistant inorganic electromagnetic wave absorbing material and a preparation method thereof. Background technique [0002] Electromagnetic wave absorbing materials have an important role and application prospects in solving electromagnetic radiation pollution, anti-electromagnetic interference, and improving the electromagnetic compatibility of electronic instruments and equipment. Electromagnetic wave absorbing materials are usually composed of absorbents and polymer organic matrices such as plastics, rubber, adhesives and coatings. The absorbent provides the electromagnetic properties required for electromagnetic wave absorption. The polymer organic matrix is ​​the carrier of the absorber and determines the absorbing material The key component of temperature resistance, weather resistance, environmental resistance an...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): C03C14/00C04B35/26C04B35/565C04B35/52C09K3/00
Inventor 冯永宝李玉娇丘泰
Owner NANJING UNIV OF TECH
Features
  • R&D
  • Intellectual Property
  • Life Sciences
  • Materials
  • Tech Scout
Why Patsnap Eureka
  • Unparalleled Data Quality
  • Higher Quality Content
  • 60% Fewer Hallucinations
Social media
Patsnap Eureka Blog
Learn More

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2025 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com